Technology classes, exact records, services, software, and components—with gaps retained.
Technology taxonomy, clearly separated from products.
This separate 187-node map contains technology generations, market categories, services, and software. Every node receives honest activity context without being presented as a priced SKU.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Markets & technology classesOpen priced products
Memory through display, power, manufacturing and EDA.
Only multi-date product-specific price references.
Every node exposes available, unavailable, proxy, or not-applicable states.
Taxonomy coverage187 matches
Showing the first 60 of 187 matches.
Narrow the market group, evidence state, family, application, or product name to reveal the rest.
Manufacturing, Packaging & EDA
No verified price seriesSemiconductor Foundry Service
Foundry · manufacturing service
- Product family
- Foundry
- Object measured
- manufacturing service
- Applications
- fabless semiconductor · custom silicon
wafer foundrycontract chip manufacturing
EVIDENCE DIAGNOSTIC
No verified price seriesUseful context, explicit limits.
Foundry, packaging, test, and other services are quoted by process, mask count, wafer or package specification, volume, yield responsibility, and contract terms.
service · manufacturing service
No compatible exact-price record attached
8 covered foundry companies
Company disclosure context
- 01IdentitySemiconductor Foundry Service
- 02Company link8 covered foundry companies
- 03Market activity5 contextual layers
- 04Exact price historyService price is not standardized
Why this is not a price chartNo verified price series · Service price is not standardizedMethod & requirements
Foundry, packaging, test, and other services are quoted by process, mask count, wafer or package specification, volume, yield responsibility, and contract terms. Missing evidence is not zero. A broader proxy is never promoted to an exact-product price.
- Named service specification
- Process or package basis
- Order volume
- Dated reusable transaction or quote source
Use company-reported shipments, capacity, utilization, and revenue only in their original scopes.
MANUFACTURER & SUPPLIER EVIDENCE
8 SOURCE-LINKEDWho is source-linked to this market?
8 covered foundry companies
foundryCovered foundry company
TSMCCompany revenue is a strong pure-play foundry measure, with process and shipment disclosures in the annual report.
- Attached evidence
- 2
- Latest signal
- 15.0M 12-inch-equivalent wafers
foundryCovered foundry company
Samsung FoundrySamsung reports Foundry commentary inside Device Solutions but does not publish standalone Foundry revenue.
- Attached evidence
- 2
- Latest signal
- Not separately disclosed
foundryCovered foundry company
Intel FoundrySegment revenue consists substantially of internal transfers; external foundry and assembly/test revenue is disclosed separately.
- Attached evidence
- 1
- Latest signal
- US$0.307B external subset
foundryCovered foundry company
SMICAudited company revenue and 8-inch-equivalent shipment/capacity definitions are available in the annual report.
- Attached evidence
- 3
- Latest signal
- 9.697M 8-inch-equivalent wafers
foundryCovered foundry company
UMCMonthly revenue and quarterly 12-inch-equivalent shipments, capacity, utilization, and node mix are disclosed.
- Attached evidence
- 3
- Latest signal
- 3.870M 12-inch-equivalent wafers
foundryCovered foundry company
GlobalFoundriesCompany revenue and 300 mm-equivalent wafer shipments are reported on a consistent annual and quarterly basis.
- Attached evidence
- 2
- Latest signal
- 2.345M 300mm-equivalent wafers
foundryCovered foundry company
Hua HongAudited specialty-foundry revenue and operating disclosures are available through HKEX filings.
- Attached evidence
- 2
- Latest signal
- 5.384M 8-inch-equivalent wafers
foundryCovered foundry company
TowerCompany revenue and specialty-platform investment are disclosed in official results and SEC filings.
- Attached evidence
- Context only
- Latest signal
- No comparable supply metric
Relationship scope8 covered foundry companies
Supply coverageWafer shipments plus separately scoped capacity and utilization
Market-share claimNot inferred
Review 15 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
reported wafer shipmentsFY2025
TSMC · Wafer shipments15.0M 12-inch-equivalent wafers
Company-reported native wafer basis · None; reported directly on a 12-inch-equivalent basis. Shipments are not installed capacity, wafer starts, die output, or good-die yield.TSMC 2025 Annual Reportreported wafer shipmentsFY2025
SMIC · Wafer shipments9.697M 8-inch-equivalent wafers
Area-equivalent conversion from company-reported native basis · 9.697M ÷ 2.25 using SMIC's disclosed 12-inch-to-8-inch conversion factor. The converted value enables area-equivalent comparison but does not normalize process complexity or wafer value.SMIC 2025 Annual Reportreported wafer shipmentsFY2025
UMC · Wafer shipments3.870M 12-inch-equivalent wafers
Area-equivalent conversion from company-reported native basis · Sum of company-reported quarterly 12-inch-equivalent shipments; rounded to the annual total shown here. Quarterly company series summed without further process or price normalization.UMC 2025 Form 20-F and Resultsreported wafer shipmentsFY2025
GlobalFoundries · Wafer shipments2.345M 300mm-equivalent wafers
Company-reported native wafer basis · None; reported directly on a 300 mm-equivalent basis. The shipment definition does not imply equivalent process complexity, die size, or selling price across companies.GlobalFoundries FY2025 Resultsreported wafer shipmentsFY2025
Hua Hong · Wafer shipments5.384M 8-inch-equivalent wafers
Area-equivalent conversion from company-reported native basis · 5.384M ÷ 2.25 using an area-equivalent 300 mm / 200 mm conversion. The normalized count supports area comparison only; process mix, wafer value, and yield remain different.Hua Hong Semiconductor 2025 Annual Reportreported capacityFY2025
TSMC · Annual manufacturing capacity>17.0M
Issuer-defined company manufacturing scope · 12-inch-equivalent wafers; annual capacity exceeded 17 million.TSMC 2025 Annual Reportreported capacityDec 2025
SMIC · Year-end monthly capacity1.059M
Issuer-defined company manufacturing scope · Standard-logic 8-inch-equivalent wafers per month.SMIC 2025 Annual Reportreported utilizationFY2025
SMIC · Annualized utilization93.5%
Issuer-defined company manufacturing scope · Company-defined annualized capacity utilization rate.SMIC 2025 Annual Reportreported utilizationQ4 2025
UMC · Capacity utilization78%
Issuer-defined company manufacturing scope · Quarterly wafer out divided by estimated quarterly capacity.UMC 2025 Form 20-F and Resultsreported capacityFY2025
UMC · Annual calculated max capacity5.163M
Issuer-defined company manufacturing scope · 12-inch-equivalent wafers; calculated maximum output, not designed capacity.UMC 2025 Form 20-F and Resultsreported utilizationFY2025
GlobalFoundries · Average shipment utilization86%
Issuer-defined company manufacturing scope · Company-defined average shipment utilization; numeric production capacity is not disclosed.GlobalFoundries FY2025 Resultsreported utilizationFY2025
Hua Hong · Capacity utilization106.1%
Issuer-defined company manufacturing scope · Can exceed 100% under the company's practical-output definition; year-end monthly capacity was 486K 8-inch equivalents.Hua Hong Semiconductor 2025 Annual Reportavailability gapFY2025
Samsung Foundry · Standalone foundry revenueNot separately disclosed
Issuer did not separately disclose the metric · Samsung publishes Device Solutions totals and Foundry commentary, but no standalone Foundry revenue value.Samsung 4Q & FY2025 Resultsavailability gapFY2025
Intel Foundry · Third-party foundry revenue comparable with pure-play peersUS$0.307B external subset
Issuer scope is not peer-comparable · The US$17.826B segment total consists substantially of transfers to Intel product businesses; external foundry and assembly/test revenue was US$307M.Intel 2025 Form 10-Kavailability gapQ2 2026
Samsung Foundry · Standalone foundry revenueNot separately disclosed
Issuer did not separately disclose the metric · Samsung reported Device Solutions and Memory revenue but no standalone Foundry revenue for Q2 2026; the DS-minus-Memory residual is not a Foundry observation.Samsung 2Q 2026 ResultsPRODUCTION & SUPPLY CONTEXT
5/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionDownstream industry context
114.1 · EU27 index · 2026-05Use only as downstream semiconductor-cycle context; do not claim it measures the selected supply-chain node.
ShipmentsCompany disclosure context
5 company-reported shipment facts · native wafer basesCompare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Sales / revenueCompany disclosure context
Company-reported foundry revenue scopesCompare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionDownstream industry context
114.1 · EU27 index · 2026-05Use only as downstream semiconductor-cycle context; do not claim it measures the selected supply-chain node.
3 separately scoped evidence seriesShipmentsCompany disclosure context
5 company-reported shipment facts · native wafer basesCompare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
3 separately scoped evidence seriesSales / revenueCompany disclosure context
Company-reported foundry revenue scopesCompare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryDownstream industry context
73.2 · Japan index · 2026-05Use only as downstream semiconductor-cycle context; do not claim it measures the selected supply-chain node.
3 separately scoped evidence seriesUtilizationCompany disclosure context
Company-defined capacity and utilization disclosuresCompare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
2 separately scoped evidence seriesTrade flowNot applicable
Not a physical-goods metrictrade is a physical-goods activity measure and is not applicable to this manufacturing service under the current model. It is not treated as zero.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.