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One query. The whole semiconductor stack.
Search numeric product references, technology classes, public companies, semiconductor startups, named investors, analyst datasets, and controlling sources. Market categories such as SRAM, ASIC, FPGA, and CPU are kept separate from priceable manufacturer models and exact measured specifications.
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DISCOVERY INDEX
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56 results shown across seven collections. Product coverage is evidence status, not a claim that every item has a public price series.
Client SSDMemory & Storage · market category · finished storage deviceCoverage plannedCXL Memory ExpanderMemory & Storage · market category · controller or add-in moduleCoverage plannedDDR2 DRAMMemory & Storage · technology generation · memory die or moduleCoverage plannedDDR3 4Gb Annual Spot ReferenceMemory & Storage · priced specification · memory dieVerified price historyDDR3 DRAMMemory & Storage · technology generation · memory die or moduleCoverage plannedDDR4 8Gb DieMemory & Storage · priced specification · memory dieVerified price historyDDR4 DRAMMemory & Storage · technology generation · memory die or modulePublic category proxyDDR5 16Gb DieMemory & Storage · priced specification · memory dieVerified price history
AMD RX 9060 XT 16GBGPU · 16GB · GDDR6 · May 20, 2025$349 · Suggested priceAMD RX 9060 XT 8GBGPU · 8GB · GDDR6 · May 20, 2025$299 · Suggested priceAMD RX 9070GPU · 16GB · GDDR6 · Feb 28, 2025$549 · Suggested priceAMD RX 9070 XTGPU · 16GB · GDDR6 · Feb 28, 2025$599 · Suggested priceAMD Ryzen 5 8600GCPU · 6C/12T · NPU · Jan 8, 2024$229 · Suggested priceAMD Ryzen 7 8700GCPU · 8C/16T · NPU · Jan 8, 2024$329 · Suggested priceAMD Ryzen 7 9800X3DCPU · 8C/16T · 104MB cache · Oct 31, 2024$479 · Suggested priceDDR3 4Gb annual spot referenceDRAM · 4Gb · DDR3 · source metadata: 512MB×8 · 2025$1.74 · Official annual-average spot-price reference
Analog & Mixed SignalSignal-chain, timing, interface, control, and mixed-signal integrated circuits.14 nodesDisplays & ComponentsDisplay panels, backplanes, emitters, driver ICs, timing, and touch components.20 nodesLogic & ComputeProcessors, accelerators, programmable logic, controllers, and custom silicon.36 nodesManufacturing, Packaging & EDAFoundry services, wafers, masks, test, advanced packaging, and design software.21 nodesMemory & StorageVolatile memory, flash, storage devices, and emerging memory technologies.42 nodesOptoelectronics & PhotonicsEmitters, detectors, optical links, and integrated photonic components.10 nodesPower & DiscretesPower conversion, protection, switching, and discrete semiconductor devices.16 nodesRF & ConnectivityRadio-frequency front ends, wired and wireless connectivity, and communications silicon.14 nodes
Akeana, Inc.Santa Clara, California, United States · RISC-V processor and system IP. Licensable RISC-V processor, vector, security, interconnect, and system IP spanning embedded through data-center designs.StartupAlixLabs ABLund, Sweden · Atomic-layer-etch pitch splitting. Atomic Layer Etching Pitch Splitting process and equipment for sub-7nm logic, DRAM, and HBM patterning.StartupAvicena, Inc.Sunnyvale, California, United States · MicroLED-based optical interconnect. LightBundle microLED optical links designed for dense, low-power chip-to-chip and board-level data movement in AI systems.StartupAxelera AI B.V.Eindhoven, Netherlands · Power-efficient edge and data-center inference. Digital in-memory computing, RISC-V control, accelerator hardware, and the Voyager software stack for computer vision and generative-AI inference.StartupAyar Labs, Inc.San Jose, California, United States · Co-packaged optical I/O. TeraPHY co-packaged optical engines and SuperNova light sources for high-bandwidth AI scale-up fabrics.StartupBaya Systems, Inc.Santa Clara, California, United States · Software-defined fabric and chiplet system IP. Network-on-chip and die-to-die fabric IP, system exploration, and software tooling for composable multi-die semiconductor systems.StartupBlack Semiconductor GmbHAachen, Germany · Graphene photonic-electronic chip connectivity. Graphene-based electronic-photonic integration and a planned 300 mm pilot production line for high-bandwidth chip connectivity.StartupCadence Design Systems, Inc.United States · Issuer-reported total-company revenue for its single operating segment, including software, hardware, IP, maintenance, and services.EDA
1789 CapitalAyar Labs · Photonics & interconnect1 disclosed companyA&E InvestmentSambaNova · AI accelerators1 disclosed companyACVCEnCharge AI · AI accelerators1 disclosed companyAdditionXscape · Photonics & interconnect1 disclosed companyAFW PartnersTenstorrent · Compute & IP1 disclosed companyAlchipAyar Labs · Photonics & interconnect1 disclosed companyAlfred AkirovHailo · AI accelerators1 disclosed companyAlleyCorpEnCharge AI · AI accelerators1 disclosed company
Display Export & Trade MonitorOfficial Korea LCD, OLED, and parts export values plus open-licensed global LCD and OLED module trade, without relabeling flows as prices or market size. · Korea monthly exports · global HS2022 bilateral display-module tradeWeb · JSON catalogEDA Disclosure MonitorDirect EDA segment evidence is separated from total-company and broad-software context; unavailable standalone EDA revenue remains explicit. · Synopsys direct segment · Cadence company context · Siemens software contextJSON · CSVGlobal Foundry MonitorOfficial foundry revenue, reporting scope, wafer shipments, utilization, capacity, and technology signals without an invented market-share denominator. · TSMC, Samsung, Intel, SMIC, UMC, GlobalFoundries, Hua Hong, TowerJSON · CSVGlobal Memory Trade AtlasOpen-licensed bilateral memory trade value and reported physical quantity with classification and flow caveats retained. · Global reporter × partner × HS product × yearWeb · JSONGlobal Semiconductor Startup MonitorSource-linked funding stages, disclosed private valuations, founders, technologies, applications, company sites, and explicitly dated indexed public sources for private semiconductor companies. · Global active-private and pending-acquisition semiconductor companies · daily source watchWeb · JSON · CSVKorea ICT Export PulseMonthly official semiconductor, memory, DRAM, NAND, system-IC, discrete, optoelectronics, and regional export observations. · Republic of Korea · monthly customs and ministry releasesWeb · JSONMemory Company DisclosuresCompany-reported financial and application facts for Samsung, SK hynix, Micron, and CXMT with non-comparable scopes left visible. · Official company and exchange disclosuresWeb · JSONOpen Memory Price ExchangeSource-linked DRAM and NAND fixed-price references with quote-board statistics, historical comparison, a transparent base-100 basket, CSV, JSON, and alerts feed. · DDR4 8Gb and NAND 128Gb monthly history · DDR5 dated reference · methodology and refresh stateWeb · JSON · CSV · Atom
500 Global PortfolioPrograms & ecosystems · Global portfolio and geography discovery. Investor portfolio inclusion is verified separately from financing amount and date.outbound-only Akeana funding announcementAkeana · Company-stated capital raised above USD 100 million; round stage, date, and exact transaction scope were not stated.ready AlixLabs funding announcementAlixLabs · Series A amount disclosed in EUR; no synthetic USD conversion is published.ready AMD Radeon RX 9000 SeriesAMD Radeon RX 9000 Series · Official suggested prices and memory specifications. Freshness: Feb 28, 2025.ready AMD Radeon RX 9060 XTAMD Radeon RX 9060 XT · Official suggested prices for 8GB and 16GB models. Freshness: May 20, 2025.ready AMD Ryzen 7 9800X3DAMD Ryzen 7 9800X3D · Official suggested price, core count and cache. Freshness: Oct 31, 2024.ready AMD Ryzen 8000G SeriesAMD Ryzen 8000G Series · Official suggested prices and specifications. Freshness: Jan 8, 2024.ready Apollo.ioCommercial discovery · People, company, role, and contact-enrichment discovery. Contact enrichment is not investment evidence; no contact data is republished.license-required