VLSI Market’s geographic layer connects source-scoped company, fab, supplier, manufacturing, and trade evidence. It does not infer coordinates, capacity, ownership, or production relationships.
Scan official movement, single dated GPU/CPU launch references, declared import-export corridors, verified relationships, issuer node and wafer-size revenue mix, and supplier roles without collapsing unlike evidence into one score. Every displayed number keeps its source, as-of period, unit, scope, evidence state, and caveat.
Product price, price index, production index, utilization, shipment value, inventory value, shipment index, trade value, and issuer revenue are separate metric families. Raw levels never share a cross-family scale. No GPU production, live market price, inferred customer allocation, inferred final destination, or proprietary market-share estimate is created.
Latest official signal movements
Choose one metric family at a time. Signed shading compares movement only inside that family; GPU and CPU launch references are single dated points with no movement scale.
Blue + · Gold −
Product price references
Like-for-like prior-period percent change within each exact product reference
The July source table does not report DDR4, so June remains the latest validated observation. Not a live spot quote, retail price, transaction or company ASP.
Movement basis: +14.3% · percent change vs 2026-06.
Evidence class: government release · exact acquisition and provenance records are restricted to the internal research ledger.Source-defined reference
The monthly ledger is continuous from January 2025 through July 2026; February–April 2026 are individually attributed to official Pyeongtaek Customs releases. No values are interpolated. Not a live spot quote, retail price, transaction or company ASP.
Movement basis: +3.3% · percent change vs 2026-07.
Evidence class: government release · exact acquisition and provenance records are restricted to the internal research ledger.Source-defined reference
Industry rate; not a company or fab utilization estimate.
Movement basis: +1.0 pp · percentage points vs 2026-06.
Evidence class: official statistics · exact acquisition and provenance records are restricted to the internal research ledger.
Utilization is isolated from production indexes, output, capacity, and company fab rates.
Shipment values
Prior-period percent change in official shipment value
Independent scale
United States
U.S. computers & electronics shipments
+2.5%$34.7B · USD million
Evidence and scope
As of
2026-06
Unit
USD million
Scope
NAICS Computers and Electronic Products · United States
Evidence
reported · Seasonally adjusted shipment value
Broader computers and electronic-products industry, not semiconductor-only shipments.
Movement basis: +2.5% · percent change vs 2026-05.
Evidence class: official statistics · exact acquisition and provenance records are restricted to the internal research ledger.
Shipment value is isolated from shipment indexes, physical units, inventory, revenue, and trade.
Inventory values
Prior-period percent change in official end-of-period inventory value
Independent scale
United States
U.S. computers & electronics inventory
+0.8%$68.5B · USD million
Evidence and scope
As of
2026-06
Unit
USD million
Scope
NAICS Computers and Electronic Products · United States
Evidence
reported · Seasonally adjusted end-of-period inventory value
Industry book value, not channel units or semiconductor die inventory.
Movement basis: +0.8% · percent change vs 2026-05.
Evidence class: official statistics · exact acquisition and provenance records are restricted to the internal research ledger.
Inventory value has its own family and is never placed on the shipment or revenue scale.
Shipment indexes
Prior-period percent change in an official shipment index
Independent scale
Japan
Japan electronic-parts shipments
-6.5%113.0 · Index 2020=100
Evidence and scope
As of
2026-05
Unit
Index 2020=100
Scope
Electronic parts and devices industry · Japan
Evidence
reported · Seasonally adjusted producer shipments index
Producer shipments index; not seller listings, revenue or company units.
Movement basis: -6.5% · percent change vs 2026-04.
Evidence class: official statistics · exact acquisition and provenance records are restricted to the internal research ledger.
Index direction is shown without converting the index into currency, units, sales, or demand.
Trade values
Like-for-like prior-period percent change in each customs or open-data series
Independent scale
Republic of Korea
Korea semiconductor exports
-8.5%$41.02B · USD billion
Evidence and scope
As of
2026-07
Unit
USD billion
Scope
Semiconductors, memory, DRAM, NAND, system IC and destinations where published · Republic of Korea
Evidence
reported · Monthly semiconductor headline export value
Export value is not company revenue, product units or end-customer demand. The July release republishes comparable April–July semiconductor totals; source-missing February–March totals and post-January component splits remain unfilled.
Movement basis: -8.5% · percent change vs 2026-06.
Evidence class: government release · exact acquisition and provenance records are restricted to the internal research ledger.Republic of Korea
Korea display exports
+5.4%$1.77B · USD 100 million
Evidence and scope
As of
2026-07
Unit
USD 100 million
Scope
Display total, LCD, OLED and parts where independently published · Republic of Korea
Evidence
reported · Monthly display headline export value
Latest headline total is not allocated to LCD, OLED or parts without a published breakdown; each missing component remains null.
Movement basis: +5.4% · percent change vs 2026-06.
Evidence class: government release · exact acquisition and provenance records are restricted to the internal research ledger.Global bilateral trade
derived-open-data · Reconciled bilateral gross merchandise trade value
Can include assembly and re-export flows; not manufacturer revenue or final end use.
Movement basis: +32.2% · percent change vs 2023.
Evidence class: open licensed research · exact acquisition and provenance records are restricted to the internal research ledger.
Trade movement is isolated from company revenue, price, production, and final demand; native currency scales remain visible.
Issuer revenue
Like-for-like prior-period percent change in the issuer's reported revenue series
Independent scale
Global company reporting
TSMC monthly consolidated net revenue
+16.3%NT$514.81B · NTD million
Evidence and scope
As of
2026-08
Unit
NTD million
Scope
Unaudited consolidated company net revenue · Global company reporting
Evidence
reported · Unaudited consolidated company net revenue · single month
The official +53.3% YoY rate is retained in the foundry issuer layer; this card compares August with July and does not imply product, customer, process, shipment, capacity or market-share allocation.
Movement basis: +16.3% · percent change vs 2026-07.
Evidence class: issuer disclosure · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer revenue is isolated from trade value, financing, market size, and market share.
GPU and CPU official launch references
One manufacturer-announced dated launch price or MSRP per exact product; no time-series or live-price comparison.
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Jan 6, 2025
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Jan 6, 2025
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Jan 6, 2025
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Apr 15, 2025
high confidence · official manufacturer launch starting price
Official launch starting price announced before Apr 16 availability; not a live street or retail quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Apr 15, 2025
high confidence · official manufacturer launch starting price
Official launch starting price announced before Apr 16 availability; not a live street or retail quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Apr 15, 2025
high confidence · official manufacturer launch starting price
Official launch starting price with May availability stated in the announcement; not a live street or retail quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Jun 24, 2025
high confidence · official manufacturer launch starting price
Official launch starting price with second-half-of-July desktop availability stated in the announcement; not a live street or retail quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Feb 28, 2025
high confidence · official manufacturer launch suggested price
Official suggested launch price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Feb 28, 2025
high confidence · official manufacturer launch suggested price
Official suggested launch price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · May 20, 2025
high confidence · official manufacturer launch suggested price
Official suggested launch price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · May 20, 2025
high confidence · official manufacturer launch suggested price
Official suggested launch price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Dec 3, 2024
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.GPU · Dec 3, 2024
high confidence · official manufacturer launch starting price
Official launch starting price, not a live street quote. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.CPU · Oct 31, 2024
high confidence · official manufacturer launch suggested price
Official suggested launch price with 104MB total cache and a 120W TDP. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.CPU · Jan 8, 2024
high confidence · official manufacturer launch suggested price
Official suggested launch price for an 8-core desktop APU with an integrated NPU. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.CPU · Jan 8, 2024
high confidence · official manufacturer launch suggested price
Official suggested launch price for a 6-core desktop APU with an integrated NPU. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.CPU · Mar 11, 2026
Intel Core Ultra 7 270K Plus
US$299
24 cores · 8P + 16E
Evidence and scope
As of
Mar 11, 2026
Unit
USD / processor
Scope
Intel Core Ultra 7 270K Plus · 24 cores · 8P + 16E · manufacturer launch reference
Evidence
high confidence · official manufacturer launch suggested price
Intel suggested-price announcement; retail-partner availability was stated for Mar 26, 2026. Not a formal offer, live retail quote, or street price. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.CPU · Mar 11, 2026
Intel Core Ultra 5 250K Plus
US$199
18 cores · 6P + 12E
Evidence and scope
As of
Mar 11, 2026
Unit
USD / processor
Scope
Intel Core Ultra 5 250K Plus · 18 cores · 6P + 12E · manufacturer launch reference
Evidence
high confidence · official manufacturer launch suggested price
Intel suggested-price announcement; retail-partner availability was stated for Mar 26, 2026. Not a formal offer, live retail quote, or street price. This is one dated launch reference, not a live price, current offer, completed transaction, price history, production quantity, shipment, or demand signal.
Evidence class: manufacturer official reference · exact acquisition and provenance records are restricted to the internal research ledger.
GPU and CPU prices are single official dated launch references only. They are not live quotes, offers, transactions, price histories, production, shipments, or demand signals.
Official statistics, government releases, issuer filings, and open-licensed dataRaw price · launch reference · index · trade · revenue levels never share a scale
Declared memory-IC trade corridors
Open trade data · HS 2007 854232 · customs reporter to declared partner
Coverage boundary: showing 4 of 15 validated leading corridors. This subset is not a country total. A declared partner can be an assembly, logistics, or re-export hub and is not necessarily the final customer, final destination, or end demand. Value and mass are never blended.
Korea, Rep.China
US$36.55BEvidence and scope
As of
2024
Unit
USD billion
Scope
Korea, Rep. declared export to China · HS 2007 854232
Evidence
derived-open-data · reconciled bilateral gross merchandise trade value
BACI reconciles exporter and importer declarations; values are bilateral trade flows, not manufacturer revenue. Declared partner economy can be an assembly, logistics, or re-export hub and is not necessarily final end use.
Evidence class: open licensed research · exact acquisition and provenance records are restricted to the internal research ledger.
Korea, Rep.Other Asia, nes
US$18.74BEvidence and scope
As of
2024
Unit
USD billion
Scope
Korea, Rep. declared export to Other Asia, nes · HS 2007 854232
Evidence
derived-open-data · reconciled bilateral gross merchandise trade value
BACI reconciles exporter and importer declarations; values are bilateral trade flows, not manufacturer revenue. Declared partner economy can be an assembly, logistics, or re-export hub and is not necessarily final end use.
Evidence class: open licensed research · exact acquisition and provenance records are restricted to the internal research ledger.
Korea, Rep.Hong Kong SAR, China
US$16.25BEvidence and scope
As of
2024
Unit
USD billion
Scope
Korea, Rep. declared export to Hong Kong SAR, China · HS 2007 854232
Evidence
derived-open-data · reconciled bilateral gross merchandise trade value
BACI reconciles exporter and importer declarations; values are bilateral trade flows, not manufacturer revenue. Declared partner economy can be an assembly, logistics, or re-export hub and is not necessarily final end use.
Evidence class: open licensed research · exact acquisition and provenance records are restricted to the internal research ledger.
Korea, Rep.Viet Nam
US$7.45BEvidence and scope
As of
2024
Unit
USD billion
Scope
Korea, Rep. declared export to Viet Nam · HS 2007 854232
Evidence
derived-open-data · reconciled bilateral gross merchandise trade value
BACI reconciles exporter and importer declarations; values are bilateral trade flows, not manufacturer revenue. Declared partner economy can be an assembly, logistics, or re-export hub and is not necessarily final end use.
Evidence class: open licensed research · exact acquisition and provenance records are restricted to the internal research ledger.
open licensed research · validated · through 2024USD billion
Verified manufacturing and collaboration edges
Only issuer, counterparty, regulatory, or exchange evidence creates an edge. Relationship type and scope stay explicit.
Sony and TSMC executed a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation in Koshi City, Kumamoto Prefecture.
Sony is planned to be the sole controlling shareholder; TSMC plans approximately JPY282B of cash contributions and Sony approximately JPY465B through cash and transferred assets, phased based on demand and business conditions.
The joint venture expects 2029 volume production, subject to regulatory approvals and customary closing conditions.
Not disclosed: process node, wafer volume, installed capacity, customer allocation, unit shipments, revenue, Japanese-government support amount.
The definitive agreement does not establish current production, capacity, shipments, revenue, market share, or a process node. The 2029 volume-production date is planned, contributions are phased, closing remains conditional, and Japanese-government support is contemplated without a disclosed amount.
Announced 2026-08-11 · last confirmed 2026-08-11 · verified-first-party · company IR
Samsung Electronics disclosed a semiconductor contract-manufacturing supply agreement with Tesla.
The disclosed contract value is KRW 22,764,764,160,000 for the effective period from July 24, 2025 through December 31, 2033.
Not disclosed: product, process node, fab, package, wafer volume, production status, realized revenue.
The agreement value is a multi-year contractual amount, not annual revenue, realized sales, backlog, shipment volume, or proof of production. Samsung states that key terms remain confidential and may change or terminate.
Announced 2025-07-31 · last confirmed 2025-07-31 · verified-first-party · company IR
Intel FoundryFortinet
strategic co developmentexternal counterpartycollaboration announced
Fortinet Security Processor 6
Verified claims and boundary
Intel disclosed a strategic collaboration with Fortinet to develop Fortinet Security Processor 6.
The disclosure identifies Intel design, packaging, and manufacturing capabilities as part of the collaboration.
Not disclosed: process node, fab, package, wafer volume, contract value, tape-out date, production status.
A strategic collaboration is not a confirmed manufacturing order, revenue observation, production shipment, or market-share claim. The source does not identify a node, fab, package, volume, value, or lifecycle stage beyond the announced collaboration.
Announced 2026-07-23 · last confirmed 2026-07-23 · verified-first-party · company IR
Intel FoundryIntel Products
internal manufacturinginternal productsubset high volume manufacturing
Intel Core Ultra Series 3 · Panther Lake subset
Verified claims and boundary
Intel Foundry disclosed high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors code-named Panther Lake.
The disclosed manufacturing relationship is internal to Intel rather than an external foundry customer design win.
Not disclosed: full product coverage, wafer volume, yield, fab, customer revenue, external-customer allocation.
The high-volume-manufacturing statement applies only to a subset of Panther Lake. It must not be generalized to every Core Ultra Series 3 processor or presented as an external foundry customer win.
Announced 2026-07-23 · last confirmed 2026-07-23 · verified-first-party · company IR
Issuer and counterparty disclosures · revision-scoped ledgerNo rumor, ecosystem-membership, or inferred design-win edges
Issuer-reported node and wafer-size revenue mix
Each card preserves the issuer's own process-node or wafer-size categories and denominator. These are revenue-mix disclosures, not physical wafer demand or foundry share.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · 90nm–0.13µm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer categories, node bands, denominators, and foundry perimeters are company-specific. Do not sum, average, rank, or convert these cards into demand or market share.
issuer-reported · 14nm and below share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >14nm to 28nm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >28nm to 40nm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >40nm to 65nm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >65nm to 90nm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >90nm to 0.13µm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >0.13µm to 0.18µm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · >0.18µm to 0.35µm share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
issuer-reported · 0.5µm and above share of wafer revenue
Issuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer categories, node bands, denominators, and foundry perimeters are company-specific. Do not sum, average, rank, or convert these cards into demand or market share.
issuer-reported · 8-inch wafers share of wafer revenue
Issuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
12-inch wafers78.2%
Evidence and scope
As of
Q2 2026
Unit
percent of wafer revenue
Scope
SMIC wafer size mix · denominator: wafer revenue
Evidence
issuer-reported · 12-inch wafers share of wafer revenue
Issuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer categories, node bands, denominators, and foundry perimeters are company-specific. Do not sum, average, rank, or convert these cards into demand or market share.
Hua Hong Grace wafer size mix · denominator: total revenue
Evidence
issuer-reported · 8-inch wafers share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
12-inch wafers62.1%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace wafer size mix · denominator: total revenue
Evidence
issuer-reported · 12-inch wafers share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer categories, node bands, denominators, and foundry perimeters are company-specific. Do not sum, average, rank, or convert these cards into demand or market share.
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 65nm and below share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
90nm and 95nm24.3%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 90nm and 95nm share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
0.11µm and 0.13µm10.9%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 0.11µm and 0.13µm share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
0.15µm and 0.18µm5.3%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 0.15µm and 0.18µm share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
0.25µm0.3%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 0.25µm share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
0.35µm and above30.6%
Evidence and scope
As of
Q2 2026
Unit
percent of total revenue
Scope
Hua Hong Grace process technology node mix · denominator: total revenue
Evidence
issuer-reported · 0.35µm and above share of total revenue
Issuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate. This issuer-specific revenue mix is not demand, physical wafer allocation, capacity share, or cross-company market share.
Evidence class: company IR · exact acquisition and provenance records are restricted to the internal research ledger.
Issuer categories, node bands, denominators, and foundry perimeters are company-specific. Do not sum, average, rank, or convert these cards into demand or market share.
Issuer filings and investor releases · native categories retainedRevenue mix · not demand, physical allocation, capacity, or market share
Official-portfolio supplier taxonomy
Materials, components, equipment, and manufacturing services are classification nodes—not customer, shipment, or allocation edges.
Prime, epitaxial, SOI, SiC, GaN, and other engineered semiconductor wafers.
SEHSUMCOGlobalWafersSiltronicSK SiltronSoitec
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.materialsElectronic gases & chemicals
Bulk and specialty gases, deposition and etch precursors, wet chemicals, filtration, and purification.
Air LiquideLindeAir ProductsNippon SansoEntegrisMerck ElectronicsKanto DenkaFUJIFILM
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.materialsPhotoresist & patterning materials
Photoresists, developers, anti-reflective coatings, CMP materials, and adjacent process chemistries.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.componentsPhotomasks & mask blanks
Photomasks, reticles, mask blanks, and mask-process services for semiconductor patterning.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.componentsPackage substrates & materials
IC package substrates, build-up films, leadframes, glass and ceramic substrates, and encapsulation materials.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentLithography
EUV, DUV, i-line, nanoimprint, and adjacent patterning systems.
ASMLNikonCanon
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentDeposition & epitaxial growth
CVD, PVD, ALD, epitaxy, oxidation, diffusion, and furnace systems.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentEtch, clean & CMP
Dry and wet etch, wafer cleaning, resist processing, and chemical-mechanical planarization.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentMetrology & inspection
Defect inspection, process control, mask inspection, overlay, critical-dimension, and materials metrology.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentIon implantation
High-current, medium-current, high-energy, and specialty ion implantation systems.
Applied MaterialsULVACAxcelisNissin Ion
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.equipmentTest & assembly equipment
ATE, handlers, probers, dicing, bonding, molding, singulation, and advanced-packaging equipment.
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.manufacturing servicesOutsourced packaging & test
Commercial wafer probe, assembly, advanced packaging, burn-in, and final-test services.
ASEAmkorJCETPTI
Official portfolio membership identifies a supplier role only. It does not establish a customer, shipment, production, allocation, revenue, or market-share flow.
Official company product pages and investor-relations disclosuresSupplier taxonomy remains separate from verified customer and customs-flow edges
Latest validated releases
The number, its period, and its measurement basis
No thesis layer is inserted between the validated observation and the reader. Each tile keeps its native unit, latest compatible comparison, evidence class, and the boundary that prevents a false inference.
The July source table does not report DDR4, so June remains the latest validated observation. Not a live spot quote, retail price, transaction or company ASP.
Evidence class: Government releaseValidated publication date: 2026-08-14
The monthly ledger is continuous from January 2025 through July 2026; February–April 2026 are individually attributed to official Pyeongtaek Customs releases. No values are interpolated. Not a live spot quote, retail price, transaction or company ASP.
Evidence class: Government releaseValidated publication date: 2026-09-01
Measurement basisMonthly semiconductor headline export value
Export value is not company revenue, product units or end-customer demand. The July release republishes comparable April–July semiconductor totals; source-missing February–March totals and post-January component splits remain unfilled.
Evidence class: Government releaseValidated publication date: 2026-08-14
Measurement basisUnaudited consolidated company net revenue · single month
The official +53.3% YoY rate is retained in the foundry issuer layer; this card compares August with July and does not imply product, customer, process, shipment, capacity or market-share allocation.
≈US$29,442.50M approvedBoard approvedNo compatible prior period
Period
2026-08-11
Frequency
Event-driven
Geography
Global company reporting · geography not allocated
Display unit
USD million
Source unit
USD million
Source date
2026-08-11
Measurement basisApproximately stated board-approved capital appropriation
The amount spans advanced technology, advanced packaging, mature or specialty technology, and fab construction or facility systems. It is not realized spend, installed capacity, wafer starts, shipments, revenue or market share.
TSMC planned Sony image-sensor JV cash contribution
≈JPY282B plannedPlanned phased contributionNo compatible prior period
Period
2026-08-11
Frequency
Event-driven
Geography
Koshi City, Kumamoto Prefecture, Japan
Display unit
JPY billion
Source unit
JPY billion
Source date
2026-08-11
Measurement basisApproximate planned TSMC cash contribution, expected in phases
The contribution is conditional on regulatory approvals and closing and is expected in phases based on market demand and other business conditions. It is not completed funding, capex, capacity, sales, shipments or market share.
Measurement basisApproximate planned Sony contribution through cash and transfer of existing assets
The Sony amount combines cash contributions and transferred-asset context and is not comparable with TSMC's cash-only contribution. Volume production is expected in 2029; Japanese government support was contemplated but not quantified.
US$20B priced baseFull option exercisedNo compatible prior period
Period
2026-08-11
Frequency
Event-driven
Geography
Global company reporting
Display unit
USD billion
Source unit
USD billion
Source date
2026-08-12
Price / share
US$95
Base shares
210,526,315
Option shares
31,578,947
Total shares
242,105,262
Option exercised
2026-08-11
Derived gross
US$22,999,999,890
Expected net
≈US$22.62B · not realized
Use of proceeds
General corporate purposes; may include capital expenditures and working capital
Settlement
Not independently confirmed
Measurement basisIssuer-reported priced base offering: 210,526,315 shares at US$95 per share; the full 31,578,947-share option was exercised, bringing the total to 242,105,262 shares.
The exact US$22,999,999,890 total gross is derived arithmetic, not an issuer-reported realized proceeds figure. The prospectus estimated approximately US$22.62B net with the full option; neither amount is realized proceeds. Option exercise does not independently confirm closing or settlement, and general corporate purposes do not establish foundry capex, capacity, demand, shipments or revenue.
>US$500B targetAnnounced targetNo compatible prior period
Period
2026-08-10
Frequency
Event-driven
Geography
Global AI infrastructure
Display unit
USD billion
Source unit
USD billion
Source date
2026-08-10
Measurement basisForward-looking lower-bound target to mobilize third-party capital over time
The numeric value is a lower bound with valueQualifier=greater-than. This is not NVIDIA revenue, sales, capex, a binding funding commitment, deployed capital, semiconductor shipments or market size.
Compare direction only after the bases are visible
The activity chart rebases three different official measures to 100 in their first shared valid month (2025-03). The trade chart keeps annual USD values but preserves each product classification and does not turn trade into revenue or demand.
Cross-region electronics activity
Derived direction comparison · 2025-03=100
Monthly
Official statistics · three compatible monthly seriesDerived index · 2025-03=100View chart data
Official cross-region electronics activity rebased to 2025-03
Month
U.S. shipments
Japan production
EU production
2025-03
100
100
100
2025-04
99.83
102.78
98.53
2025-05
100.63
89.62
102.76
2025-06
101.01
99.44
102.21
2025-07
101.2
100.09
103.69
2025-08
101.03
100.28
104.61
2025-09
100.93
101.76
103.32
2025-10
101.18
98.61
99.45
2025-11
102.16
99.63
104.24
2025-12
102.96
101.3
104.06
2026-01
104.64
103.24
96.87
2026-02
105.69
99.63
97.05
2026-03
106.29
101.3
106.91
2026-04
106.96
102.78
101.94
2026-05
108
104.08
105.16
Rebasing compares direction, not native level or economic size. The U.S. line is shipment value; Japan and EU lines are production indexes. No missing value is interpolated.
Open semiconductor-related trade layers
Gross bilateral merchandise value
2022–2024
Open data source · validated · through 2024USD billion · annual · published annual seriesView chart data
Annual open semiconductor-related gross bilateral trade value
Year
Memory ICs, USD bn
Display modules, USD bn
Display equipment, USD bn
2022
196.3275
86.238511
4.738612
2023
162.6293
82.06429000000001
2.523312
2024
214.9467
108.801407
3.274001
These are separate customs product classes. Gross bilateral value can count assembly, logistics and re-export stages; it is not market size, producer revenue, units shipped or final end use.
Market data map
Eight evidence pillars, never one blended score
Each pillar has its own measurement objects. A production index, customs value, company filing and policy award stay analytically connected but numerically separate.
Official source directory
Find the series before reading the conclusion
Published series, live APIs, official expansion routes and public-headline-only sources are visibly different states. Commercial databases and opinion pieces are excluded from this default directory.
Official and open semiconductor market data source directory
Dataset
Market & geography
Grain & cadence
Coverage state
Evidence & boundary
U.S. semiconductor production & utilizationFederal Reserve Board via FREDVLSI workspace
Production & utilizationUnited StatesSemiconductors and related electronic components
Series × monthMonthlyIDs: IPG3344S · CAPUTLG3344S
Published series2000-01–2026-07Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Production and utilization remain unlike native measures; the coverage is a U.S. industry aggregate, not global output.
U.S. semiconductor producer & export price indexesU.S. Bureau of Labor Statistics via FREDVLSI workspace
Prices & indexesUnited StatesSemiconductors and related electronic components
Series × monthMonthlyIDs: PCU33443344 · IQ21320
Published series2000-01–2026-07Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The two indexes have different base periods and are not dollar prices, company ASPs or global price measures.
U.S. computers & electronics shipments and inventoryU.S. Census Bureau via FREDVLSI workspace
Shipments & inventoryUnited StatesNAICS Computers and Electronic Products
Industry × month × metricMonthlyIDs: A34SVS · A34STI
Published series2023-12–2026-06Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The Census Bureau no longer publishes a separate semiconductor-only M3 series.
Japan electronic-parts & devices productionJapan Ministry of Economy, Trade and IndustryVLSI workspace
Production & utilizationJapanElectronic parts and devices industry
Industry × month × indexMonthlyIDs: METI-IIP-PRODUCTION
Published series2025-03–2026-05Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The industry production index is not exact-product units, company output, revenue, or market share.
Japan electronic-parts shipments & inventoryJapan Ministry of Economy, Trade and IndustryVLSI workspace
Shipments & inventoryJapanElectronic parts and devices industry
Industry × month × indexMonthlyIDs: METI-IIP-SHIPMENTS · METI-IIP-INVENTORY · METI-IIP-INVENTORY-RATIO
Published series2025-03–2026-05Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Producer shipments and inventory indexes are not channel sell-through, seller listings, revenue, or exact-product units.
Production & utilizationEuropean Union — 27 countriesNACE Rev. 2 C2611 manufacture of electronic components
EU27 industry × monthMonthlyIDs: STS_INPR_M:C2611:EU27_2020:SCA:I21
Published series2025-01–2026-05Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The June 2026 time position exists without a value and remains null rather than being carried forward.
Korea public DRAM & NAND referencesMOTIR / MSIT, Pyeongtaek Customs, and official preservation mirrorsVLSI workspace
Exact product density × reference monthMonthly when independently publishedIDs: DDR4-8Gb-FIXED · DDR5-16Gb-FIXED · NAND-128Gb-FIXED
Published series2025-01–2026-07Tier: government release
Government releaseExact provenance is retained in the private research ledger.Government-reported fixed references are not live spot quotes, retailer prices, transactions, company ASPs or forecasts. February–April 2026 DDR5 facts are attributed individually; no source table or commercial history is republished.
Korea DRAM & flash-memory producer price indexesBank of Korea ECOSVLSI workspace
Prices & indexesRepublic of KoreaDRAM and flash-memory producer price indexes
Published series2025-01–2026-06Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Producer price indexes are not dollar-per-chip quotes or manufacturer selling prices.
Korea ICT semiconductor exportsMinistry of Trade, Industry and Resources / Ministry of Science and ICTVLSI workspace
Trade & geographyRepublic of Korea exportsSemiconductors, memory, DRAM, NAND, system IC and destinations where published
Published series2025-01–2026-07Tier: government release
Government releaseExact provenance is retained in the private research ledger.Export value is not company revenue, end demand, product units, shipments or market share.
Korea ICT display exportsMinistry of Trade, Industry and Resources / Ministry of Science and ICTVLSI workspace
Trade & geographyRepublic of Korea exportsDisplay total, LCD, OLED and parts where independently published
Published series2025-01–2026-07Tier: government release
Government releaseExact provenance is retained in the private research ledger.Export value is not panel shipments, producer revenue, final demand, product units or market share.
Korea detailed semiconductor customs tradeKorea Customs ServiceVLSI workspace
Trade & geographyRepublic of Korea by partner economyHS and HSK integrated circuits, value and net weight
HS/HSK code × partner × period × flowMonthly with revisionsIDs: HS854231 · HS854232 · HS854233 · HS854239
Published seriesThrough 2025Tier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Customs net weight can contain reporting anomalies; customs unit value is not an actual chip price.
Published series2007–2024Tier: open licensed research
Open data sourceExact provenance is retained in the private research ledger.Bilateral gross merchandise trade can include re-exports and is not market revenue or final end use.
Global display-module bilateral tradeCEPII BACIVLSI workspace
Trade & geographyGlobal reporter-partner coverageHS 2022 LCD, OLED and other flat-panel display modules
Published series2022–2024Tier: open licensed research
Open data sourceExact provenance is retained in the private research ledger.Gross trade value is not display-market revenue, panel production, shipments or price.
World Bank macro, manufacturing & technology contextWorld BankVLSI workspace
End-market demandGlobal economies and aggregatesExchange rates, high-technology and ICT-goods trade context
Live APIExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.High-technology and ICT indicators are broad economic context, not semiconductor product demand.
SEC issuer Company FactsU.S. Securities and Exchange CommissionVLSI workspace
Company disclosuresSEC registrantsIssuer XBRL facts and filing freshness
Live APIExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Issuer taxonomies and segment scopes can differ; facts are not automatically comparable across companies.
Korea corporate filingsFinancial Supervisory Service OpenDART
Company disclosuresRepublic of Korea issuersRegulatory filings, XBRL statements and disclosure documents
Official source linkExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Company-specific facts require taxonomy and fiscal-scope validation before cross-company comparison.
Taiwan listed-company filingsTaiwan Stock Exchange Market Observation Post System
Company disclosuresTaiwan listed issuersFinancial statements, material information and monthly revenue filings
Issuer × disclosure periodMonthly, quarterly and event-driven
Official source linkExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Monthly revenue and quarterly financial facts are issuer disclosures, not market size or market share.
Published seriesThrough Q2 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.Memory revenue is unsplit; no DRAM, NAND, HBM, LPDDR or foundry product value is inferred.
SK hynix provisional 2Q 2026 resultsSK hynix / U.S. SECVLSI workspace
Company disclosuresGlobal company reportingProvisional consolidated revenue and operating profit
Published seriesThrough Q2 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.The filing does not provide a compatible DRAM, NAND, HBM or exact-product split.
Micron fiscal Q3 2026 resultsMicron Technology / U.S. SECVLSI workspace
Company disclosuresGlobal company reportingConsolidated and issuer-defined business-unit revenue
Issuer or business unit × Micron fiscal quarterQuarterlyIDs: MICRON-FQ3-2026-CONSOLIDATED · MICRON-FQ3-2026-CMBU · MICRON-FQ3-2026-CDBU · MICRON-FQ3-2026-MCBU · MICRON-FQ3-2026-AEBU
Published seriesThrough FQ3 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.Issuer-defined business units are not DRAM-, NAND-, HBM- or unit-shipment splits.
Official source linkThrough Q2 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.Process revenue mix is not physical capacity, unit market share or customer allocation.
SMIC Q2 2026 resultsSemiconductor Manufacturing International Corporation / HKEXVLSI workspace
Company disclosuresGlobal company reporting and China manufacturingRevenue, profit, wafer shipments, utilization, period-end capacity, capex, revenue mix and forward guidance
Published seriesThrough Q2 2026 actuals / Q3 2026 guidanceTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Revenue mix is not cross-company market share; period-end monthly capacity is not quarterly output; guidance midpoints are derived and never presented as actual results.
Hua Hong Grace Semiconductor Q2 2026 resultsHua Hong Grace Semiconductor Limited / HKEXVLSI workspace
Company disclosuresGlobal company reporting and China manufacturingRevenue, profit, wafer shipments, utilization, period-end capacity, revenue and process mix, and forward guidance
Published seriesThrough Q2 2026 actuals / Q3 2026 guidanceTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Revenue and process mixes use issuer-defined denominators and are not cross-company market share; utilization may exceed 100%; guidance midpoints are derived and never presented as actual results.
Published seriesJan 2026–Aug 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.Company revenue is not wafer shipments, capacity, product or customer allocation, or foundry market share.
TSMC August 2026 board-approved capital appropriationTaiwan Semiconductor Manufacturing CompanyVLSI workspace
Capacity & investmentGlobal company reporting · geography not allocatedApproximately US$29,442.50 million of board-approved capital appropriations for advanced technology, advanced packaging, mature or specialty technology, and fab construction or facility systems
Published event recordThrough Aug 11, 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.A board-approved appropriation is not realized capital expenditure, installed capacity, wafer starts, shipments, revenue or market share.
Sony–TSMC image-sensor joint-venture agreementSony Semiconductor Solutions and TSMCVLSI workspace
Capacity & investmentKoshi City, Kumamoto Prefecture, JapanDefinitive joint-venture agreement with planned phased contributions of approximately JPY282 billion from TSMC and approximately JPY465 billion of cash and transferred-asset context from Sony
Joint venture × announced contribution planEvent-drivenIDs: TSMC-SONY-IMAGE-SENSOR-JV-CONTRIBUTIONS · ADVANCED-VISION-SEMICONDUCTOR-MANUFACTURING-CORPORATION
Published event recordThrough Aug 11, 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.The transaction remains conditional on regulatory approvals and closing conditions. Contributions are planned in phases based on market demand and other conditions; production is expected in 2029, and Japanese government support was not quantified.
Tower–OpenLight PH18DA design-enablement filing recordTower Semiconductor / U.S. SECVLSI workspace
Company disclosuresGlobal silicon-photonics design ecosystemQualitative issuer filing record linking Tower's PH18DA process, OpenLight's process design kit and Cadence photonics design enablement
Published event recordThrough Aug 11, 2026Tier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.This is a qualitative technology and design-enablement record. It does not disclose product sales, customer volume, wafer shipments, capacity, utilization, revenue or market share, so no numeric observation is created.
SK hynix Chongqing stake-sale review disclosureSK hynix / U.S. SECVLSI workspace
Company disclosuresRepublic of Korea / China operationsIssuer response to an exchange inquiry about a possible packaging-plant stake sale
Issuer × disclosure eventEvent-driven
Official source linkThrough Aug 10, 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.No decision was made. The media-reported consideration is not a transaction value, capacity change, shipment, investment, or sale observation.
Intel priced common-stock offering and full option exerciseIntel Corporation / U.S. SECVLSI workspace
Company disclosuresGlobal company reportingPriced base offering of 210,526,315 shares at US$95 per share, announced as US$20 billion; the full 31,578,947-share option was exercised for 242,105,262 total shares
Published event recordThrough Aug 12, 2026Tier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.The option exercise is not independent confirmation of closing or settlement. Derived gross proceeds and expected net proceeds are not realized proceeds; stated general corporate purposes cannot be relabeled foundry capex, capacity, demand, shipments or revenue.
NVIDIA AI infrastructure financing-platform targetNVIDIAVLSI workspace
Capacity & investmentGlobal AI infrastructureTarget to mobilize more than US$500 billion of third-party capital over time through financing-platform partnerships
Issuer × announced third-party capital targetEvent-driven
Published event recordThrough Aug 10, 2026Tier: issuer disclosure
Issuer disclosureExact provenance is retained in the private research ledger.The target is not NVIDIA revenue, sales, capex, a funding commitment, deployed capital, semiconductor shipments or market size.
Taiwan industrial production statisticsTaiwan Ministry of Economic Affairs
Production & utilizationTaiwanIndustrial production and manufacturing statistics, including electronics categories where published
Industry × month × metricMonthly
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Broad electronics production cannot be relabeled as foundry wafer output or semiconductor units.
Taiwan customs trade statisticsTaiwan Ministry of Finance
Trade & geographyTaiwan by partner and commodityOfficial import and export value and quantity by customs classification
Commodity × partner × period × flowMonthly
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Customs value and unit value are not company revenue, product selling price or final consumption.
Korea manufacturing production, shipments & inventoryKorean Statistical Information Service
Shipments & inventoryRepublic of KoreaProduct and KSIC manufacturing tables selected for semiconductor and electronics activity
Table-defined product or industry × period × metricMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.A table appearing in KOSIS does not make unlike product, survey and industry scopes comparable.
Japan product-level production, shipments & inventoryJapan Ministry of Economy, Trade and Industry
Shipments & inventoryJapanCurrent Survey of Production product quantities and values for ICs, logic, memory, discrete, passive components and semiconductor equipment
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Product-level statistical categories can still aggregate multiple specifications and manufacturers.
Japan official statistics portalStatistics Bureau of Japan and participating ministries
End-market demandJapanGovernment statistics and APIs used for manufacturing and downstream demand context
Dataset-definedDataset-defined
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Portal membership alone does not establish semiconductor-specific numeric coverage.
Japan trade statisticsJapan Ministry of Finance / Customs
Trade & geographyJapan by partner and commodityOfficial merchandise imports and exports
Commodity × partner × period × flowMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Trade quantity quality varies by commodity and is not a production or shipment series.
Japan issuer filingsFinancial Services Agency EDINET
Company disclosuresJapan issuersFiling lists, XBRL facts and amended disclosure documents
Official source linkExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Issuer-specific segments and fiscal calendars require validation before comparison.
U.S. detailed semiconductor customs tradeU.S. Census Bureau
Trade & geographyUnited States by partner, district and commodityHS10 imports and exports with value, quantity, weight and transport dimensions
HS10 × partner/district × month × flowMonthly
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Customs value, quantity and unit value are not manufacturer revenue, shipments or realized product price.
U.S. semiconductor industry input-output relationshipsU.S. Bureau of Economic Analysis
End-market demandUnited StatesInput-output, gross output, value added and intermediate inputs by industry
Industry × use/make relationship × year or benchmark vintageAnnual and benchmark releases
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Input-output relationships are modeled industry aggregates, not product bills of materials or customer shipments.
Semiconductor material supplyU.S. Geological Survey
Capacity & investmentGlobal production and U.S. supply contextGallium, germanium, silicon, rare earths and other semiconductor-input production, imports, prices and reserves
Commodity × economy or U.S. measure × yearAnnual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Mineral prices and production are upstream material context, not semiconductor wafer or device output.
U.S. industrial energy input contextU.S. Energy Information Administration
Capacity & investmentUnited States by state and sectorIndustrial electricity, natural gas and petroleum supply, prices, sales and revenue
Energy product × geography × sector × periodMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Sector or state energy data is macro cost context, not a specific fab's consumption or cost.
EU detailed merchandise tradeEurostat Comext
Trade & geographyEuropean Union and member statesDetailed intra- and extra-EU trade by Combined Nomenclature
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Merchandise trade is not semiconductor revenue, price or final destination demand.
UN ComtradeUnited Nations Statistics Division
Trade & geographyGlobal reporter-partner coverageOfficially reported international merchandise trade
Reporter × partner × commodity × period × flowMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Reported trade can be asymmetric and is not a substitute for product sales or market size.
Singapore electronics & semiconductor outputSingapore Department of Statistics / Economic Development Board
Production & utilizationSingaporeElectronics, semiconductor and manufacturing-performance tables
Industry or product group × period × metricMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Electronics and semiconductor output scopes vary by table and cannot be silently combined.
Official FX reference ratesEuropean Central Bank / Central Bank of the Republic of China (Taiwan)
Prices & indexesEuro area and Taiwan reference currenciesOfficial daily, monthly and annual reference exchange rates for transparent derived currency conversions
Currency pair × dateDaily with monthly and annual aggregates
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Reference FX is a conversion input, not a transaction rate; native currency always remains available.
Global Supply Chain Pressure IndexFederal Reserve Bank of New York
End-market demandGlobal aggregatePublished aggregate global supply-chain pressure index
Month × aggregate indexMonthly
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The aggregate is global supply-chain context, not a semiconductor shortage, lead-time or inventory measure.
WTO trade statisticsWorld Trade Organization
Trade & geographyGlobal economies and aggregatesMerchandise and services trade context
Indicator-definedMonthly to annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Broad trade indicators are downstream context, not semiconductor-specific observations.
OECD Trade in Value AddedOrganisation for Economic Co-operation and Development
End-market demandOECD members and partner economiesModeled value-added flows by origin economy, industry and final-demand destination
Origin economy × industry × destination/final demand × yearAnnual editions
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.TiVA is a modeled input-output layer, not observed semiconductor shipments, product destination or company revenue.
IMF macroeconomic dataInternational Monetary Fund
End-market demandGlobal economies and aggregatesExchange-rate, trade and macroeconomic context
Indicator-definedIndicator-defined
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.The market hub excludes IMF forecasts by default and uses only clearly identified observations.
China integrated-circuit industrial outputNational Bureau of Statistics of China
Production & utilizationMainland ChinaOfficial industrial output tables including integrated-circuit categories where published
Product or industry × period × geographyMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.National IC output cannot be allocated to company, process node, product generation or market share.
China customs semiconductor tradeGeneral Administration of Customs of China
Trade & geographyMainland China by partner and commodityOfficial merchandise trade statistics and releases
Commodity × partner × period × flow where publishedMonthly and annual
Official source linkExpansion registryTier: official statistics
Official statisticsExact provenance is retained in the private research ledger.Customs value and quantity are not company sales, product price or final end use.
Hong Kong listed-company filingsHong Kong Exchanges and Clearing
Company disclosuresHong Kong listed issuersOfficial announcements, financial reports and issuer disclosures
Issuer × document × filing dateEvent-driven
Official source linkExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Issuer-specific segment scopes and currencies require reconciliation before comparison.
Company disclosuresMainland China listed issuersOfficial listed-company announcements and financial disclosures
Issuer × document × filing dateEvent-driven
Official source linkExpansion registryTier: regulator or exchange filing
Regulatory sourceExact provenance is retained in the private research ledger.Prospectus, annual report and later operating disclosure scopes remain distinct.
U.S. CHIPS awards & incentivesU.S. Department of Commerce / NIST
Policy & incentivesUnited StatesOfficial CHIPS incentives, awards and program announcements
Recipient × award/announcementEvent-driven
Official source linkExpansion registryTier: government release
Government releaseExact provenance is retained in the private research ledger.Announced maximum funding is not cash received, capital expenditure, capacity or project completion.
European Chips Act implementationEuropean Commission
Policy & incentivesEuropean UnionOfficial policy, approved schemes and implementation materials
Program or decision × dateEvent-driven
Official source linkExpansion registryTier: government release
Government releaseExact provenance is retained in the private research ledger.Policy targets are not observed capacity, production or private investment.
Global semiconductor sales release headlinesSemiconductor Industry Association
End-market demandGlobal and regional headline aggregatesPublic monthly sales headlines derived from WSTS
Headline aggregate × release monthMonthly
Public headline onlyExpansion registryTier: public headline only
Public headlineExact provenance is retained in the private research ledger.No restricted WSTS historical series, regional tables or paid forecast data are copied.
Capacity & investmentGlobal and region-defined public headlinesPublic press-release facts on equipment, wafers and fab outlooks
Public headline fact × releaseRelease-defined
Public headline onlyExpansion registryTier: public headline only
Public headlineExact provenance is retained in the private research ledger.Paid SEMI datasets and forecasts are never reproduced or converted into platform history.
Coverage boundaries
What cannot yet be measured—and the exact promotion gate
A blank chart is replaced with a specific disclosure reason and the evidence required to publish it. Commercial data is not reverse-engineered into a free but unreliable estimate.
Not yet comparable
Global smartphone shipments by model and vendor
Comparable model-level history is primarily commercial research; public company shipments are incomplete and differently scoped.
Publication gateA reusable official or licensed series with vendor, model, region, unit, period and revision metadata.
Not yet comparable
Global PC shipments by vendor
The global vendor series commonly cited in market reports is commercial and cannot be reproduced without redistribution rights.
Publication gateA licensed feed or complete reusable official denominator with vendor-level observations.
Not yet comparable
Samsung, SK hynix, Micron and CXMT DRAM/NAND ASP
Issuers generally disclose revenue, qualitative pricing or bit-growth context, not compatible product-level ASP histories.
Publication gateIssuer-reported exact-product ASP with period, currency, object and unit; no estimate from revenue or trade value.
Not yet comparable
HBM shipments and vendor market share
Compatible absolute shipments and a complete public market denominator are not disclosed.
Publication gateReusable vendor shipments plus a complete compatible denominator; qualification or capacity commentary is insufficient.
Not yet comparable
Global foundry capacity and market share
Company reports mix wafer diameters, equivalent-wafer conversions, internal/external revenue and pure-play/IDM scopes.
Publication gateComplete reusable vendor observations on the same wafer basis, period, currency and business-model denominator.
Not yet comparable
Exact DRAM, NAND, CPU, GPU, analog and power-device production units
Official statistical systems publish broader industry or customs categories, while companies rarely disclose exact SKU units.
Publication gateA source-backed product/part-number series with units, object, geography, period and revision behavior.
VLSI Korea