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SOURCE-LINKED SEMICONDUCTOR ROADMAP

๋ฏธ๋ž˜ ์•ฝ์†๊ณผ ์‹ค์ œ ์ถœํ•˜๋ฅผ ๊ฐ™์€ ์ƒ‰์œผ๋กœ ์น ํ•˜์ง€ ์•Š์Šต๋‹ˆ๋‹ค.

Foundry, memory, packaging, EDA์™€ interconnect milestone์„ ๋ฐœํ‘œยท์ค€๋น„ยท๊ณต๊ฐœยท๊ฐ€์šฉยท์ƒ์‚ฐ ์ƒํƒœ๋กœ ๋ถ„๋ฆฌํ•˜๊ณ  ๊ธฐ์ค€์ผยท๊ณต์‹ ์ถœ์ฒ˜ยทevidence boundary๋ฅผ ๋ณด์กดํ•ฉ๋‹ˆ๋‹ค.

Open 24 milestones Compare in VLSI Hub Specs
Foundry ยท CONFIDENCE B
Company schedule ยท TSMC

N2P and A16 volume-production target

TSMC ๊ณต์‹ ์‹ค์ ๋ฐœํ‘œ transcript์— ์ œ์‹œ๋œ ๋ฏธ๋ž˜ ์ƒ์‚ฐ ๋ชฉํ‘œ๋ฅผ ๋ณ„๋„ ์ƒํƒœ๋กœ ๋ณด์กดํ•ฉ๋‹ˆ๋‹ค.

Review source and boundary
Foundry ยท CONFIDENCE B
Company schedule ยท TSMC

A14 volume-production target

์—ฐ์ฐจ๋ณด๊ณ ์„œ์˜ ์žฅ๊ธฐ ์ƒ์‚ฐ ๋ชฉํ‘œ๋ฅผ roadmap commitment๋กœ ํ‘œ์‹œํ•ฉ๋‹ˆ๋‹ค.

Review source and boundary
Foundry ยท CONFIDENCE B
Company schedule ยท Samsung Foundry

SF2 mass production

Samsung Foundry ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ SF2 mass production ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2025 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Foundry ยท CONFIDENCE B
Company schedule ยท Samsung Foundry

SF1.4 mass production

Samsung Foundry ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ SF1.4 mass production ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2027 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Foundry ยท CONFIDENCE B
Company schedule ยท Intel

Intel 18A production readiness

Intel ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ Intel 18A production readiness ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2025 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Foundry ยท CONFIDENCE B
Announced development ยท Intel

Intel 14A development

Intel ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ Intel 14A development ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ next-node roadmap ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Memory ยท CONFIDENCE B
Company announcement ยท Micron

HBM4 sampling

Micron ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ HBM4 sampling ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2025 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Memory ยท CONFIDENCE B
Company schedule ยท Micron

HBM4E roadmap

Micron ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ HBM4E roadmap ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2027 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Packaging ยท CONFIDENCE B
Company schedule ยท TSMC

SoW-X prototype timing

TSMC ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ SoW-X prototype timing ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2027 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Packaging ยท CONFIDENCE A
Available ยท Intel

EMIB availability

Intel ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ EMIB availability ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Packaging ยท CONFIDENCE A
Available ยท Intel

Foveros availability

Intel ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ Foveros availability ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Packaging ยท CONFIDENCE A
Available ยท Samsung

I-Cube packaging offering

Samsung ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ I-Cube packaging offering ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
EDA ยท CONFIDENCE A
Available ยท Synopsys

Synopsys.ai product availability

Synopsys ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ Synopsys.ai product availability ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
EDA ยท CONFIDENCE A
Available ยท Cadence

Cerebrus AI Studio availability

Cadence ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ Cerebrus AI Studio availability ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
EDA ยท CONFIDENCE A
Available ยท Siemens EDA

AI-driven EDA portfolio

Siemens EDA ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ AI-driven EDA portfolio ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current portfolio ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Interconnect ยท CONFIDENCE A
Published ยท PCI-SIG

PCIe 7.0 specification

PCI-SIG ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ PCIe 7.0 specification ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2025 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Interconnect ยท CONFIDENCE B
Roadmap target ยท PCI-SIG

PCIe 8.0 specification target

PCI-SIG ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ PCIe 8.0 specification target ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2028 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Interconnect ยท CONFIDENCE A
Published ยท CXL Consortium

CXL 3.1 specification

CXL Consortium ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ CXL 3.1 specification ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2023 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Interconnect ยท CONFIDENCE A
Published ยท UCIe Consortium

UCIe 2.0 specification

UCIe Consortium ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ UCIe 2.0 specification ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ 2024 ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary
Interconnect ยท CONFIDENCE A
Approved contribution ยท Open Compute Project

OpenHBI approved contribution

Open Compute Project ๊ณต์‹ ์ถœ์ฒ˜๊ฐ€ OpenHBI approved contribution ์ƒํƒœ ๋˜๋Š” ๋ชฉํ‘œ๋ฅผ current catalog ๊ธฐ์ค€์œผ๋กœ ์ œ์‹œํ•œ ๋ ˆ์ฝ”๋“œ์ž…๋‹ˆ๋‹ค.

Review source and boundary