Navigate foundry services, process technologies, wafers, photomasks, substrates, packaging, OSAT, test, and EDA. Services, materials, software, and finished devices retain separate measurement bases.
Every chart keeps its object, unit, geography, period, and market basis visible.
Largest families in this workspace
| Product family | Price history | Dated reference | Broader market proxy | No verified price series |
|---|---|---|---|---|
| Advanced Packaging | 0 | 0 | 0 | 5 |
| EDA | 0 | 0 | 0 | 4 |
| Foundry | 0 | 0 | 0 | 3 |
| Specialty Foundry | 0 | 0 | 0 | 3 |
| Wafer | 0 | 0 | 0 | 2 |
| Assembly & Test | 0 | 0 | 0 | 1 |
| Mask | 0 | 0 | 0 | 1 |
What the record actually describes
| Object type | Product nodes |
|---|---|
| manufacturing service | 6 |
| semiconductor package | 4 |
| software | 3 |
| substrate material | 2 |
| patterning tool | 1 |
| test service | 1 |
| packaging service | 1 |
| multi-die package | 1 |
| stacked-die package or process | 1 |
| software or emulation system | 1 |
Japan electronic parts & devices industry—not exact products in this market group
| Month | Production | Producer shipments | Producer inventory |
|---|---|---|---|
| 2025-03 | 107.9 | 101 | 77.9 |
| 2025-04 | 110.9 | 115.1 | 75.1 |
| 2025-05 | 96.7 | 99.1 | 71 |
| 2025-06 | 107.3 | 101.6 | 74.2 |
| 2025-07 | 108 | 105.6 | 73 |
| 2025-08 | 108.2 | 104.9 | 72.4 |
| 2025-09 | 109.8 | 105.5 | 80 |
| 2025-10 | 106.4 | 106.5 | 74.1 |
| 2025-11 | 107.5 | 101.9 | 75.5 |
| 2025-12 | 109.3 | 108.5 | 78.6 |
| 2026-01 | 111.4 | 115 | 74.9 |
| 2026-02 | 107.5 | 104.3 | 74.7 |
| 2026-03 | 109.3 | 105.8 | 77.7 |
| 2026-04 | 110.9 | 120.8 | 72.1 |
| 2026-05 | 112.3 | 113 | 73.2 |
The production, producer-shipment, and producer-inventory indexes share one broad national electronic-parts-and-devices scope. They are context only—not exact-product output, company sales, revenue, market share, or a forecast.
Family counts describe catalog coverage. They are not shipment, sales, or market-share estimates.
Flip-Chip BGA · Wafer-Level Chip-Scale Package · Fan-Out Packaging · 2.5D Interposer Packaging…
EDA Digital Design Software · EDA Verification Software · EDA Analog & Custom Design Software · EDA Signoff & TCAD Software
Semiconductor Foundry Service · Leading-Edge Foundry · Mature-Node Foundry
Specialty Analog Foundry · RF SOI Foundry · CMOS Image Sensor Foundry
200 mm Silicon Wafer · 300 mm Silicon Wafer
OSAT Service
Semiconductor Photomask
Wire-Bond Package
Wafer Probe & Test
Company-reported revenue, capacity, utilization, shipments, and process mix.
69 public company profilesSupply chainMaterials, process components, equipment, test, assembly, and OSAT suppliers with explicit quantity gaps.
Design automationEDADirect EDA disclosures with issuer context and unavailable scope kept separate.
Reusable design blocksIPArm, Synopsys, Cadence, and Siemens disclosure scopes without derived market share.
VLSI Korea