VLSI MARKET · GLOBAL SEMICONDUCTOR INTELLIGENCE+32.2% YoY
GLOBAL MEMORY IC TRADE$214.9B2024 · HS 854232 · CEPII BACI
VLSI MARKET · GLOBAL SEMICONDUCTOR INTELLIGENCE
Semiconductor markets,
connected end to end.
Connect product pricing, EDA company trends, memory, foundry manufacturing, cross-border trade, and downstream demand in one auditable global terminal. Every metric retains its scope, basis, unit, geography, period, and source.
Official company filingsOpen-licensed trade dataNo fabricated observations
GLOBAL OVERVIEW
The semiconductor market at a glance
A consistent public-data baseline across memory trade, company reporting, foundry manufacturing, and product scope.
REPORTED NET MASS38.5 kt
Customs mass, not chips or bits
TOP EXPORTER SHARE39.2%
Korea, Rep. · trade value
TOP IMPORTER SHARE28.4%
China · declared destination
GLOBAL TRADE CYCLE
BACI International Trade DatabaseMemory IC trade value, 2007–2024
Annual bilateral exports under one HS revision. Value is preferred over long-run customs mass because quantity coverage contains reporting outliers.
COMPANY MONITOR
Samsung, SK hynix, Micron & CXMT
Latest quarterly disclosures are kept separate from the FY2025 annual comparison so fiscal periods, currency, and business scope remain intact.
Reported memory / product revenue
USD conversion uses World Bank 2025 annual-average FX.
What is actually comparable?
Scope is visible before magnitude.
Samsung
$73.2BReported memory total, unsplit
No DRAM, NAND, HBM, or protocol split is implied.SK hynix
$68.3BDRAM + NAND + other reported components
The chart total reconciles the disclosed components; it is not an HBM-only or DRAM-only value.Micron
$37.4BDRAM + NAND + other reported components
Micron fiscal-year timing remains visible and must not be silently remapped to calendar-year reporting.CXMT
$8.5BDDR + LPDDR family + other product-family revenue
The product-family total is used instead of the separately reported CNY 61.7993215bn company total.Samsung’s memory total is not split. CXMT’s LPDDR figure combines LPDDR4X and LPDDR5/5X. Neither is silently allocated to protocols.
| Company | FY2025 native disclosure | Product detail | Absolute sales volume | Status | Source |
|---|---|---|---|---|---|
| SamsungFY2025 | 104.081 KRWtnReported memory total, unsplit | Not disclosed | Not disclosedUnits, bits, packages and wafers are not interchangeable. | Derived USD | Primary filing |
| SK hynixFY2025 | 97.146 KRWtnDRAM + NAND + other reported components | DRAM revenue: 74.904 KRWtnNAND revenue: 20.69 KRWtn | Not disclosedUnits, bits, packages and wafers are not interchangeable. | Derived USD | Primary filing |
| MicronFY2025 | 37.378 USDbnDRAM + NAND + other reported components | DRAM revenue: 28.578 USDbnNAND revenue: 8.503 USDbn | Not disclosedUnits, bits, packages and wafers are not interchangeable. | Reported USD | Primary filing |
| CXMTFY2025 | 61.275 CNYbnDDR + LPDDR family + other product-family revenue | DDR product-family revenue: 19.531 CNYbnLPDDR-family revenue: 40.704 CNYbn | Not disclosedUnits, bits, packages and wafers are not interchangeable. | Derived USD | Primary filing |
Latest official quarterly disclosures
Samsung and SK hynix Q2 2026; Micron fiscal Q3 ended May 28, 2026. Native values only.
| Company | Issuer period | Metric | Reported value | Scope & document status | Source |
|---|---|---|---|---|---|
| Samsung ElectronicsPublished 2026-07-30 | Q2 2026Ended 2026-06-30 | Consolidated revenue | KRW 171.5TKRW trillion | Samsung Electronics consolidated totalpre-review consolidated results · Company total; it is not Memory, DRAM, NAND, HBM, shipment, or foundry revenue. | Official result |
| Samsung ElectronicsPublished 2026-07-30 | Q2 2026Ended 2026-06-30 | Device Solutions revenue | KRW 127.5TKRW trillion | Device Solutions divisionpre-review consolidated results · DS includes Memory, System LSI, and Foundry; it is not standalone Samsung Foundry revenue. | Official result |
| Samsung ElectronicsPublished 2026-07-30 | Q2 2026Ended 2026-06-30 | Memory revenue | KRW 120.8TKRW trillion | Memory Business total, unsplitpre-review consolidated results · No DRAM, NAND, HBM, or LPDDR generation allocation is inferred from the total. | Official result |
| SK hynixPublished 2026-07-29 | Q2 2026Ended 2026-06-30 | Consolidated revenue | KRW 79.318746TKRW trillion | SK hynix consolidated totalprovisional result · The provisional filing does not provide a DRAM, NAND, or HBM revenue split. | Official result |
| SK hynixPublished 2026-07-29 | Q2 2026Ended 2026-06-30 | Operating profit | KRW 60.542608TKRW trillion | SK hynix consolidated operating profitprovisional result · Operating profit is not sales, shipment volume, or a product-family result. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | Consolidated revenue | US$41.456BUSD billion | Micron consolidated totalfiled quarterly result · Micron fiscal Q3 ended May 28, 2026; it is not a calendar-Q2 observation. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | Cloud Memory Business Unit revenue | US$13.769BUSD billion | CMBU issuer-defined business unitfiled quarterly result · Business-unit revenue is not a DRAM-, NAND-, HBM-, or unit-shipment split. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | Core Data Center Business Unit revenue | US$11.524BUSD billion | CDBU issuer-defined business unitfiled quarterly result · Business-unit revenue is not a DRAM-, NAND-, HBM-, or unit-shipment split. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | Mobile & Client Business Unit revenue | US$11.521BUSD billion | MCBU issuer-defined business unitfiled quarterly result · Business-unit revenue is not a DRAM-, NAND-, HBM-, or unit-shipment split. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | Automotive & Embedded Business Unit revenue | US$4.634BUSD billion | AEBU issuer-defined business unitfiled quarterly result · Business-unit revenue is not a DRAM-, NAND-, HBM-, or unit-shipment split. | Official result |
| MicronPublished 2026-06-24 | FQ3 2026Ended 2026-05-28 | All other revenue | US$0.008BUSD billion | All other issuer-defined revenuefiled quarterly result · Retained so the official business-unit rows reconcile to the consolidated total. | Official result |
technology milestoneSource
Samsung Electronics · Q2 2026Reported milestoneHBM4 sales scaled and HBM4E samples shippedNo HBM4 or HBM4E revenue, shipment volume, customer allocation, yield, or market share is inferred.
packaging investmentSource
SK hynix · Investment planKRW 7.0931TP&T7 advanced-packaging investment increasedInvestment-plan value; it is not quarterly capex, revenue, capacity, shipments, or an HBM product split.
GLOBAL FOUNDRY MONITOR
The manufacturing layer, scope intact.
Latest official quarterly results sit above the FY2025 annual baseline across eight major foundries. Pure-play revenue, internal manufacturing segments, wafer shipments, utilization, capacity, and node mix remain separate.
Data throughQ2 2026 latest results · FY2025 annual baseline
Last checked5 Aug 2026
Last changed5 Aug 2026
Dataset vintage2026.08.05-foundry-3
Validated snapshotreportedSource
Tower Q2 2026 revenueUS$460M+24% YoYGross profit was US$138M; Q3 revenue guidance is a separate US$520M midpoint with a ±5% range.
reportedSource
TSMC Q2 2026 revenueUS$40.20B+33.7% YoYGross margin was 67.7%, operating margin 60.3%, and 2nm represented 3% of wafer revenue.
scope alertSource
Intel Foundry Q2 scopeUS$5.8B+31% YoYThe operating-segment total includes intersegment transactions and is not ranked with pure-play company revenue.
reportedSource
UMC Q2 2026 revenueNT$68.73B+12.6% QoQUtilization was 85%, 22/28nm represented 37% of revenue, and wafer shipments rose 10.6% QoQ.
Latest official quarterly disclosures
Native units and issuer scopes; no annualization, FX conversion, or cross-company ranking.
| Company | Period | Metric | Reported value | Scope & status | Source |
|---|---|---|---|---|---|
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Net revenue | US$40.20B / NT$1,270.38BUSD billion | Pure-play company totalBoth currency values are company-reported; no annualization or FX conversion is applied.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Gross margin | 67.7%percent | Consolidated company marginActual quarter, not Q3 guidance.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Wafer shipments | 4,336 Kpcs · 12-inch equivalentthousand 12-inch-equivalent wafers | Company-reported quarterly shipment basis+3.9% QoQ and +16.6% YoY; the native 12-inch-equivalent basis is not converted.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Operating margin | 60.3%percent | Consolidated company marginActual quarter, not Q3 guidance.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 2nm share of wafer revenue | 3%percent of wafer revenue | TSMC process-node revenue mixProcess mix is company-specific and is not cross-company node market share.reported | Official result |
| Intel FoundryPublished 23 Jul 2026 | Q2 2026Issuer fiscal label | Foundry segment revenue | US$5.8B · +31% YoYUSD billion | Operating segment including intersegment transactionsThe segment total is intersegment-inclusive and does not enter the pure-play revenue comparison.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Consolidated revenue | NT$68.73B / US$2.18BNTD billion | Pure-play company totalThe NT dollar value is primary; U.S. dollars are the company's disclosed translation.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | 22/28nm share of revenue | 37%percent of revenue | UMC process-node revenue mix22nm alone represented 17.5% of second-quarter sales.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Capacity utilization | 85%percent | Company-defined quarterly capacity utilizationQ3 90%+ is guidance and is not stored as this actual observation.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Wafer shipment growth | +10.6% QoQpercent quarter over quarter | Company-reported wafer shipment changeGrowth rate only; no absolute quarterly wafer count is inferred.reported | Official result |
| UMCPublished 29 Jul 2026 | FY2026 planIssuer fiscal label | Capital expenditure budget | US$2.0BUSD billion | Revised company capex planBudget guidance, not Q2 cash capex or realized capacity.guidance | Official result |
| TowerPublished 4 Aug 2026 | Q2 2026Issuer fiscal label | Consolidated revenue | US$460MUSD billion | Pure-play specialty-foundry company totalActual quarter; +24% year over year. It is not annualized or converted into market share.reported | Official result |
| TowerPublished 4 Aug 2026 | Q2 2026Issuer fiscal label | Gross profit | US$138MUSD billion | Consolidated GAAP gross profitActual quarter; the value is a profit measure, not revenue, shipment volume, or capacity.reported | Official result |
| TowerPublished 4 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Revenue guidance midpoint | US$520M ±5%USD billion | Company revenue guidanceForward guidance is retained separately from the Q2 actual and is not treated as a reported sale.guidance | Official result |
FY2025 pure-play company revenue
Official company totals in U.S. dollars; this is not a market-share table.
INTEL FOUNDRYScope alert
US$17.826Bsegment total · substantially intersegmentUS$0.307Bexternal foundry + assembly/test subset
Intel’s segment total does not enter the pure-play comparison. The external subset also combines foundry with assembly and test.
Intel Form 10-KSAMSUNG FOUNDRYNot disclosed
Standalone revenue: NDFoundry sits inside Device Solutions reporting.No residual from Samsung’s combined non-memory businesses is presented as foundry revenue. Technology and disclosed contract facts remain available separately.
Samsung FY2025 resultsWhy no “public market share”?
A complete licensed denominator is not available from these filings. A partial cohort would reward broader reporting scope, not necessarily foundry demand.
FY2025 wafer shipments
Area-normalized to 12-inch equivalents; native disclosures stay visible below.
TSMC advanced-node mix
Share of wafer revenue at 7nm and below; company-specific definition.
| Company | FY2025 revenue | YoY | Wafer shipments | Operating disclosure | Source |
|---|---|---|---|---|---|
| TSMCTaiwan · pure-play foundry | US$122.42BPure-play company total | +35.9%reported | 15.0M 12-inch-equivalent wafersreported | ≤7nm share of wafer revenue: 74%FY2025 · Up from 69% in 2024; 3nm alone represented 24% of wafer revenue.Annual manufacturing capacity: >17.0MFY2025 · 12-inch-equivalent wafers; annual capacity exceeded 17 million. | Primary filing |
| Samsung FoundryRepublic of Korea · integrated device manufacturer | Not separately disclosedSamsung publishes Device Solutions totals and Foundry commentary, but no standalone Foundry revenue value. | ND | Not disclosedNo complete comparable FY2025 observation. | Disclosed long-term contract value: KRW 22.765T2025–2033 · Tesla semiconductor contract-manufacturing agreement (US$16.544B disclosure translation); this 2025–2033 total is not annual or realized revenue, and key terms remain confidential. | Primary filing |
| Intel FoundryUnited States · integrated device manufacturer | US$17.83BSegment total · mostly intersegment | +2.9%derived | Not disclosedNo complete comparable FY2025 observation. | Third-party external revenue: US$0.307BFY2025 · External foundry and assembly/test revenue, separate from the US$17.826B segment total. | Primary filing |
| SMICChina · pure-play foundry | US$9.327BPure-play company total | +16.2%reported | 9.697M 8-inch-equivalent wafersderived | Year-end monthly capacity: 1.059MDec 2025 · Standard-logic 8-inch-equivalent wafers per month.Annualized utilization: 93.5%FY2025 · Company-defined annualized capacity utilization rate. | Primary filing |
| UMCTaiwan · pure-play foundry | US$7.573BPure-play company total | +5.3%reported | 3.870M 12-inch-equivalent wafersderived | Capacity utilization: 78%Q4 2025 · Quarterly wafer out divided by estimated quarterly capacity.Annual calculated max capacity: 5.163MFY2025 · 12-inch-equivalent wafers; calculated maximum output, not designed capacity. | Primary filing |
| GlobalFoundriesUnited States · pure-play foundry | US$6.791BPure-play company total | +1.0%reported | 2.345M 300mm-equivalent wafersreported | Average shipment utilization: 86%FY2025 · Company-defined average shipment utilization; numeric production capacity is not disclosed. | Primary filing |
| Hua HongChina · pure-play foundry | US$2.402BPure-play company total | +5.1%derived | 5.384M 8-inch-equivalent wafersderived | Capacity utilization: 106.1%FY2025 · Can exceed 100% under the company's practical-output definition; year-end monthly capacity was 486K 8-inch equivalents. | Primary filing |
| TowerIsrael · pure-play foundry | US$1.566BPure-play company total | +9.0%reported | Not disclosedNo complete comparable FY2025 observation. | Not disclosed | Primary filing |
Technology and capacity timeline
Reported milestones stay distinct from management targets.
Q2 2026TSMC
2nm entered the reported wafer-revenue mix
TSMC reported 2nm at 3% of Q2 wafer revenue; the process mix is company-specific and is not a foundry market-share estimate.
reportedSource
Q2 2026Intel Foundry
Intel 18A-P entered risk production
The earnings release describes the milestone as risk production, not customer volume, yield, revenue, or high-volume manufacturing.
reportedSource
Q2 2026Intel Foundry
A subset of Panther Lake entered high-volume manufacturing
Intel limited the statement to a subset of Core Ultra Series 3 processors and did not disclose external-customer wafer volume.
reportedSource
Jul 2026 approvalUMC
Singapore cleanroom and Tainan fab expansion approved
UMC approved phased Singapore P4 cleanroom/tool expansion and a new Tainan building shell; the revised FY2026 capex budget is US$2.0B guidance.
guidanceSource
Jul 14, 2026Tower
Japan SiPho, SiGe and optical-packaging expansion announced
Tower described a dual-track plan with Q4 2027 production readiness for the first track and a multi-fold capacity target for the second; both remain forward-looking.
guidanceSource
Q4 2025TSMC
2nm entered high-volume manufacturing
TSMC reported good yield and expects a fast 2026 ramp; N2P and A16 remain scheduled for H2 2026.
reportedSource
Q3 2025Samsung Foundry
First-generation 2nm GAA mass production started
Revenue remains undisclosed, so technology progress is not converted into a market-share estimate.
reportedSource
FY2025Intel Foundry
Intel 18A ramped into high-volume production
Intel identifies 18A as its first significant node for government and enterprise foundry customers.
reportedSource
Dec 2025SMIC
Monthly capacity passed 1M 8-inch-equivalent wafers
Year-end monthly capacity reached 1,058,750; FY2025 shipments rose 20.9% to 9.697M on the same basis.
reportedSource
2027 targetTower
Silicon-photonics capacity targeted above 5× Q4 2025 run-rate
The target is guidance backed by a stated US$920M SiPho/SiGe investment program, not current capacity.
guidanceSource
PRESS DESK
Publish faster. Verify every number.
Use the stable section link, newsroom-ready citation, tidy CSV, or versioned JSON. Scope and primary sources travel with the data.
Suggested citation
VLSI Market (VLSI Korea), “Global Foundry Monitor: latest official quarters and FY2025 annual baseline,” dataset 2026.08.05-foundry-3, data through Q2 2026 latest results · FY2025 annual baseline, accessed 5 Aug 2026, https://market.vlsi.kr/foundry. Underlying sources: company filings and exchange disclosures.
Free to cite with attribution. Underlying source terms still apply. Figures are informational, not investment advice.
EDA DISCLOSURE MONITOR
Direct EDA evidence first; issuer context stays separate
Only an issuer-defined Design Automation segment is treated as direct EDA evidence. Company totals and broad software disclosures are context, never EDA revenue.
Direct annual EDA disclosure
Unavailable means the issuer does not publish a standalone EDA revenue line. Missing is not zero.
FY2025 · REPORTED
$5.302BSynopsys
Design Automation segment revenue
STANDALONE EDA
Not disclosedCadence
Cadence reports one operating segment; total company revenue must not be labeled EDA revenue.
STANDALONE EDA
Not disclosedSiemens
Siemens EDA revenue is not separately disclosed. The broader software business is context only, never an EDA metric.
Latest issuer context — not EDA revenue
Company totals and the Siemens Digital Industries software business remain outside the direct EDA series.
Q2 FY2026 · CONTEXT
$2.276BSynopsys
Total company revenue. This value is not standalone EDA revenue.
Official resultQ2 2026 · CONTEXT
$1.584BCadence
Total company revenue. This value is not standalone EDA revenue.
Official resultQ2 FY2026 · CONTEXT
€1.614BSiemens software context
Digital Industries software business. This value is not standalone EDA revenue.
Official resultDirect EDA segment growth
Synopsys Design Automation only; FY2025 includes Ansys after the July close.
Broader issuer context
Cadence total company and Siemens broad software context; neither series is EDA revenue.
Scope before magnitude
A numeric context series never fills a missing EDA disclosure.
SynopsysDirect annual evidence: Design Automation segment
FY2025 includes Ansys after July. Quarterly company totals remain context only.
CadenceStandalone EDA revenue: not disclosed
Total company revenue includes software, hardware, IP, maintenance, and services.
SiemensStandalone Siemens EDA revenue: not disclosed
Digital Industries software includes PLM and other software and is never relabeled as Siemens EDA revenue.
Issuer context is not EDA market share. Unavailable standalone metrics remain unavailable and are never inferred from a broader perimeter.
Quarterly results and annual audited filingsAppend only after scope, currency, period, and issuer table reconcile. Quarterly facts stay outside the annual index; no estimated run-rate extension.
| Company / context | Fiscal year | Reported revenue | Evidence role | Reporting scope | Comparability marker | Source |
|---|---|---|---|---|---|---|
| Cadence company contextIssuer context only | FY2025Year ended near 31 Dec | $5.297BUSD billion | Not standalone EDA revenue | Total company revenue | Not standalone EDA revenue; one operating segment includes software, hardware, IP, maintenance, and services. | Primary filing |
| Siemens software contextIssuer context only | FY2025Year ended 30 Sep | €6.174BEUR billion | Not standalone EDA revenue | Digital Industries software business | Not Siemens EDA revenue; FY2025 scope expanded through Altair and Dotmatics. | Primary filing |
| SynopsysDirect EDA evidence | FY2025Year ended near 31 Oct | $5.302BUSD billion | Direct annual segment evidence | Design Automation segment revenue | Includes Ansys after the July 2025 acquisition close; structural comparability break. | Primary filing |
| Cadence company contextIssuer context only | FY2024Year ended near 31 Dec | $4.641BUSD billion | Not standalone EDA revenue | Total company revenue | Not standalone EDA revenue; one operating segment includes software, hardware, IP, maintenance, and services. | Primary filing |
| Siemens software contextIssuer context only | FY2024Year ended 30 Sep | €6.286BEUR billion | Not standalone EDA revenue | Digital Industries software business | Not Siemens EDA revenue; includes PLM, EDA, low-code, marketplaces, and other software. | Primary filing |
| SynopsysDirect EDA evidence | FY2024Year ended near 31 Oct | $4.221BUSD billion | Direct annual segment evidence | Design Automation segment revenue | FY2024 contained 53 weeks. | Primary filing |
| Cadence company contextIssuer context only | FY2023Year ended near 31 Dec | $4.090BUSD billion | Not standalone EDA revenue | Total company revenue | Not standalone EDA revenue; one operating segment includes software, hardware, IP, maintenance, and services. | Primary filing |
| Siemens software contextIssuer context only | FY2023Year ended 30 Sep | €5.067BEUR billion | Not standalone EDA revenue | Digital Industries software business | Not Siemens EDA revenue; includes PLM, EDA, low-code, marketplaces, and other software. | Primary filing |
| SynopsysDirect EDA evidence | FY2023Year ended near 31 Oct | $3.775BUSD billion | Direct annual segment evidence | Design Automation segment revenue | Issuer-defined segment; includes EDA software and hardware. | Primary filing |
| Cadence company contextIssuer context only | FY2022Year ended near 31 Dec | $3.562BUSD billion | Not standalone EDA revenue | Total company revenue | Not standalone EDA revenue; one operating segment includes software, hardware, IP, maintenance, and services. | Primary filing |
| SynopsysDirect EDA evidence | FY2022Year ended near 31 Oct | $3.300BUSD billion | Direct annual segment evidence | Design Automation segment revenue | Issuer-defined segment; includes EDA software and hardware. | Primary filing |
| Cadence company contextIssuer context only | FY2021Year ended near 31 Dec | $2.988BUSD billion | Not standalone EDA revenue | Total company revenue | Not standalone EDA revenue; one operating segment includes software, hardware, IP, maintenance, and services. | Primary filing |
| SynopsysDirect EDA evidence | FY2021Year ended near 31 Oct | $2.755BUSD billion | Direct annual segment evidence | Design Automation segment revenue | Issuer-defined segment; includes EDA software and hardware. | Primary filing |
MEMORY PRODUCTS
A protocol-level product universe
DDR, LPDDR, GDDR, HBM, NAND, NOR, SRAM, logic and manufacturing services share one filterable taxonomy—without assigning sales where companies do not disclose them.
family
Memory
Volatile and non-volatile semiconductor memory.
subfamily
DRAM
Volatile dynamic memory spanning standard, mobile, graphics, and high-bandwidth generations.
subfamily
Standard DDR
Commodity and server-oriented double-data-rate DRAM.
generation
DDR3
Third-generation standard DDR DRAM.
generation
DDR4
Fourth-generation standard DDR DRAM.
generation
DDR5
Fifth-generation standard DDR DRAM.
subfamily
Mobile DRAM
Low-power DRAM used in mobile, client, and edge devices.
generation
LPDDR4
Fourth-generation low-power DRAM; taxonomy only, with no implied sales figure.
generation
LPDDR4X
Lower-I/O-voltage LPDDR4 derivative; taxonomy only, with no implied sales figure.
generation
LPDDR5
Fifth-generation low-power DRAM; taxonomy only, with no implied sales figure.
generation
LPDDR5X
Higher-speed LPDDR5 derivative; taxonomy only, with no implied sales figure.
subfamily
Graphics DRAM
Graphics-oriented DRAM for GPUs, accelerators, consoles, and workstations.
generation
GDDR6
Sixth-generation graphics DRAM.
generation
GDDR7
Seventh-generation graphics DRAM.
subfamily
High Bandwidth Memory
Stacked high-bandwidth DRAM used with accelerators and high-performance compute devices.
generation
HBM2E
Enhanced second-generation high-bandwidth memory.
generation
HBM3
Third-generation high-bandwidth memory.
generation
HBM3E
Enhanced third-generation high-bandwidth memory.
generation
HBM4
Fourth-generation high-bandwidth memory.
subfamily
NAND Flash
Non-volatile NAND flash across cell-density and product forms.
generation
SLC NAND
One-bit-per-cell NAND classification.
generation
MLC NAND
Two-bit-per-cell NAND classification in this taxonomy.
generation
TLC NAND
Three-bit-per-cell NAND classification.
generation
QLC NAND
Four-bit-per-cell NAND classification.
subfamily
NOR Flash
Non-volatile NOR flash used for code storage and embedded applications.
subfamily
SRAM
Static volatile memory used in cache, networking, industrial, and embedded applications.
family
Logic
Compute and control semiconductor devices.
subfamily
GPU
Graphics and parallel-compute processors.
subfamily
CPU
General-purpose central processors.
subfamily
AI / Compute Accelerator
Specialized processors for AI and other accelerated compute workloads.
family
Manufacturing Services
Semiconductor manufacturing and production-service layers.
process stage
Foundry
Contract wafer fabrication; public point prices are generally not comparable.
process stage
Packaging
Assembly, test, conventional packaging, and advanced integration services.
LPDDR INTELLIGENCE
LPDDR4 deserves an honest data model.
No open customs code or comparable company filing isolates LPDDR4 revenue or unit sales. The site therefore separates the reported family total from protocol-level availability and future demand models.
CXMT SSE prospectusTRADE ATLAS
Where memory crosses borders
Global reporter-to-partner flows show immediate customs destination. Assembly and re-export hubs are not final end users.
Top declared destinations
2024 memory IC imports by partner economy.
Largest bilateral corridors
Exporter → immediate partner economy.
01Korea, Rep.$84.3B5.48 kt
02China$54.1B8.54 kt
03Other Asia, nes$33.8B8.12 kt
04Japan$15.4B2.67 kt
05Singapore$14.5B5.64 kt
06Malaysia$5.2B0.48 kt
07Hong Kong SAR, China$1.6B0.1 kt
08United States$1.5B0.79 kt
01China$61.1B4.63 kt
02Hong Kong SAR, China$41B8.85 kt
03Other Asia, nes$35.4B2.09 kt
04Korea, Rep.$19.7B1.08 kt
05Viet Nam$16.6B0.87 kt
06Singapore$13.2B0.78 kt
07Malaysia$10.2B5.06 kt
08India$4.1B1.77 kt
END MARKETS
From memory family to application
Reported application revenue is used where available. Everywhere else, routes remain qualitative until a licensed or transparent demand model exists.
CXMT FY2025 application revenue
The richest current official company disclosure for downstream mix.
Product → application paths
Structural routes with a leading demand signal.
HBM3EAI acceleratorsAccelerator shipments and package capacity
DDR5Enterprise serversServer shipments and DIMM content per system
DDR5Cloud and hyperscale serversCloud capex, server builds, and installed memory per server
LPDDR4XSmartphonesCompatible device shipments and installed GB per device
LPDDR4XTabletsCompatible tablet shipments and installed GB per device
LPDDR5XAI PCsAI-PC shipments and installed GB per system
GDDR7Workstations and creator systemsProfessional GPU shipments and board-memory content
TLC NANDClient storageClient SSD shipments, capacity mix, and inventory turns
TLC NANDEnterprise storageEnterprise SSD shipments and cloud storage demand
Customs destination, reported application revenue, and modeled final demand are separate analytical layers.
PRODUCT MARKET WORKSPACE
Prices stay attached to their market basis
Select any product once. Price evidence, market activity, company scope, and retail discovery update together without mixing unlike measures.
Selected product: DDR3 4Gb annual spot reference. Price, market activity, company scope, and retail discovery updated.
DDR3 4Gb annual spot reference · price evidence
Basis-compatible public history.
Selected reference
Every observation carries object, basis, and date.
DDR3 4Gb annual spot reference
$1.74USD / chip- Basis
- Official annual-average spot-price reference
- As of
- 2025
- Object
- die
- Applications
- Legacy PC · server maintenance · industrial
MOTIE open-data annual average for the source-described DDR3 4Gb spot-price object. This is not a DIMM, retail listing, contract price, live spot quote, or manufacturer ASP. Only 2013–2025 is promoted because the source metadata applies the DDR3 label to earlier pre-product years.
MOTIE Semiconductor & Display Industry TrendsGlobal memory IC trade activity
Annual reported trade value · selected product is not isolated.
HS 854232 covers memory integrated circuits across technologies, densities, brands, and generations. It is a market-activity proxy, not this product's sales volume.
Broad company revenue trend
FY2023=100 within each issuer-defined scope.
Samsung, SK hynix, Micron, and CXMT do not publish comparable generation-specific units for this product. Each broader reported scope is indexed to its own FY2023 native-currency value; the lines are company trajectories, not product sales or market share.
RETAIL DISCOVERY
DDR3 4GB memory module
The selected series is an annual average for a 4-gigabit DDR3 chip. Retail links search for 4-gigabyte modules, a different object whose price also depends on vendor, speed, rank, ECC, condition, tax, shipping, and seller.
Discovery links open third-party searches. VLSI Market does not scrape, cache, normalize, or represent those listings as executed prices or sales.
| Product | Category | Reference | Basis | As of | Source |
|---|---|---|---|---|---|
| DRAM | $1.74USD / chip | Official annual-average spot-price reference | 2025 | MOTIE Semiconductor & Display Industry Trends | |
| DRAM | $21USD / chip | Government-reported fixed-price reference | Jun 2026 | MOTIR / MSIT ICT Export Trends | |
| DRAM | $28.5USD / chip | Government-reported fixed-price reference | Jan 2026 | MOTIR / MSIT ICT Export Trends | |
| NAND | $28.8USD / chip | Government-reported fixed-price reference | Jun 2026 | MOTIR / MSIT ICT Export Trends | |
| GPU | $1,999USD / card | Starting price | Jan 6, 2025 | NVIDIA RTX 50 Series | |
| GPU | $999USD / card | Starting price | Jan 6, 2025 | NVIDIA RTX 50 Series | |
| GPU | $749USD / card | Starting price | Jan 6, 2025 | NVIDIA RTX 50 Series | |
| GPU | $549USD / card | Starting price | Jan 6, 2025 | NVIDIA RTX 50 Series | |
| GPU | $429USD / card | Starting price | Apr 15, 2025 | NVIDIA GeForce RTX 5060 Family | |
| GPU | $379USD / card | Starting price | Apr 15, 2025 | NVIDIA GeForce RTX 5060 Family | |
| GPU | $299USD / card | Starting price | Apr 15, 2025 | NVIDIA GeForce RTX 5060 Family | |
| GPU | $249USD / card | Starting price | Jun 24, 2025 | NVIDIA GeForce RTX 5050 | |
| GPU | $599USD / card | Suggested price | Feb 28, 2025 | AMD Radeon RX 9000 Series | |
| GPU | $549USD / card | Suggested price | Feb 28, 2025 | AMD Radeon RX 9000 Series | |
| GPU | $349USD / card | Suggested price | May 20, 2025 | AMD Radeon RX 9060 XT | |
| GPU | $299USD / card | Suggested price | May 20, 2025 | AMD Radeon RX 9060 XT | |
| GPU | $249USD / card | Starting price | Dec 3, 2024 | Intel Arc B-Series | |
| GPU | $219USD / card | Starting price | Dec 3, 2024 | Intel Arc B-Series | |
| CPU | $479USD / processor | Suggested price | Oct 31, 2024 | AMD Ryzen 7 9800X3D | |
| CPU | $329USD / processor | Suggested price | Jan 8, 2024 | AMD Ryzen 8000G Series | |
| CPU | $229USD / processor | Suggested price | Jan 8, 2024 | AMD Ryzen 8000G Series | |
| CPU | $299USD / processor | Suggested price | Mar 11, 2026 | Intel Core Ultra 200S Plus Series | |
| CPU | $199USD / processor | Suggested price | Mar 11, 2026 | Intel Core Ultra 200S Plus Series |
DATA LAB
Open JSON catalogBuilt for analysts, not screenshots
Filter, inspect, download, and trace compatible observations without losing definitions, units, revisions, or source links.
Compatible filters
Period, geography, product and measure stay explicit across views.
Analyst exports
Native reported values and derived FX layers export as separate fields.
Revision-aware
New releases append; corrections never silently overwrite old facts.
Null-safe
Unavailable revenue or volume is shown as such, never turned into zero.
DATA OPERATIONS
Automatic refresh, source by source
Refresh checks follow each source’s release cadence, licensing terms, and revision window; failed refreshes retain the last validated snapshot.
READY
Synopsys, Cadence & Siemens filings
Direct Design Automation segment evidence and separately labeled issuer context
- Source cadence
- Annual filings; event-driven perimeter changes
- Platform check
- Daily source watch during reporting windows
- Failure policy
- Publish no estimate; retain the last audited fact and its original perimeter
READY
Arm, Synopsys, Cadence & Siemens filings
Issuer-reported semiconductor-IP revenue categories, segment revenue, product-group share, and non-disclosure state
- Source cadence
- Annual filings; event-driven segment and category recasts
- Platform check
- Daily source watch during reporting windows
- Failure policy
- Publish no estimate or rounded-share dollar derivation; retain the last validated fact and explicit unavailable states
READY
CEPII BACI
Global bilateral HS6 trade value and available physical quantities
- Source cadence
- Annual release
- Platform check
- Monthly release check
- Failure policy
- Keep the last validated vintage and expose its release year
ACTIVE
World Bank WDI
Selected global macro and downstream-demand context series
- Source cadence
- Varies by indicator
- Platform check
- Daily metadata check; fetch only changed series
- Failure policy
- Serve the last validated observations with a stale badge
ACTIVE
FRED
Price indices, industrial production, utilization, and other cycle proxies
- Source cadence
- Series-specific; commonly monthly
- Platform check
- Every six hours using conditional requests where supported
- Failure policy
- Serve the last-known-good series and expose the failed check
READY
Korea MOTIR / MSIT ICT export releases
Official monthly display total, LCD, OLED, parts, semiconductor, and memory export categories where published
- Source cadence
- Monthly release with occasional corrections
- Platform check
- Daily release-page check during the monthly publication window
- Failure policy
- Keep the last validated release visibly dated; never infer panel units, vendor share, or price
READY
Samsung Electronics IR
Reported company and explicitly disclosed segment facts
- Source cadence
- Quarterly and annual
- Platform check
- Release-calendar check daily during reporting windows
- Failure policy
- Publish no new fact until value, unit, scope, and period reconcile
READY
SK hynix IR
Reported company and explicitly disclosed product facts
- Source cadence
- Quarterly and annual
- Platform check
- Release-calendar check daily during reporting windows
- Failure policy
- Publish no new fact until value, unit, scope, and period reconcile
READY
Micron IR
Reported company and explicitly disclosed product facts
- Source cadence
- Quarterly and annual
- Platform check
- Release-calendar check daily during reporting windows
- Failure policy
- Publish no new fact until value, unit, scope, and fiscal period reconcile
READY
CXMT Official
Official company, technology, product, and capacity statements
- Source cadence
- Event-driven
- Platform check
- Weekly official-publication review
- Failure policy
- Leave sales and capacity facts Not disclosed; never substitute unsourced estimates
OPTIONAL
Korea Customs Service
Optional monthly HS/HSK trade value and net weight by partner
- Source cadence
- Monthly with revisions around the middle of the month
- Platform check
- Run after the release window; retry through day 20 when configured
- Failure policy
- Publish no partial row; preserve the last complete validated observation
PROVENANCE
Source registry
Inspect coverage, granularity, access, cadence, and redistribution terms for every production source.
BACI International Trade Database
Harmonized bilateral merchandise trade by HS product, trade value, and physical quantity where reported
Annual release · Global reporter-partner coverageWorld Development Indicators
Macro, manufacturing, trade, technology, and demand-context indicators selected by series
Varies by indicator · Global country and aggregate coverageFRED Economic Data
Semiconductor producer prices, export prices, industrial production, utilization, and related cycle indicators
Daily to annual; semiconductor series are commonly monthly · Primarily United States with selected international seriesKorea ICT Export Trends
Official monthly ICT export releases, including display, LCD, OLED, parts, semiconductor, and memory categories where published
Monthly release · Republic of Korea exports by product category and destinationSamsung 4Q & FY2025 Results
Audited financial statements, earnings releases, presentations, and management commentary
Quarterly and annual · Global company reportingSamsung 2Q 2026 Results
Q2 2026 consolidated, Device Solutions, and Memory Business revenue plus HBM4 and HBM4E operating commentary
Quarterly · Global company reportingSamsung FY2024 Memory Results
FY2023–FY2024 Memory Business sales with issuer-defined business scope
Annual earnings presentation · Global company reportingSamsung Foundry Contract Disclosure
Disclosed semiconductor contract-manufacturing agreement with Tesla, including value, period, and confidentiality limits
Event-driven disclosure · Global company reportingSK hynix Investor Relations
Audited financial statements, earnings releases, presentations, and management commentary
Quarterly and annual · Global company reportingSK hynix Provisional 2Q 2026 Results
Provisional Q2 2026 consolidated revenue and operating profit
Quarterly · Global company reportingSK hynix P&T7 Investment Disclosure
July 2026 revision to the P&T7 advanced-packaging investment plan
Event-driven disclosure · Republic of Korea packaging investmentMicron Technology Investor Relations
SEC filings, earnings releases, presentations, and management commentary
Quarterly and annual · Global company reportingMicron Fiscal Q3 2026 Form 10-Q
Fiscal Q3 2026 consolidated and issuer-defined business-unit revenue
Quarterly · Global company reportingCXMT Official Publications
Official company, technology, product, and capacity statements when explicitly published
Event-driven · Global company and product announcementsCXMT SSE Prospectus
FY2025 audited company, product-family, and application-revenue disclosures in the SSE prospectus
Prospectus and subsequent official filing events · Global company reportingTSMC 2025 Annual Report
Audited revenue, wafer shipments, annual capacity, process mix, customer count, and technology milestones
Monthly revenue; quarterly results; annual report · Global company reportingTSMC 2Q 2026 Results
Q2 2026 revenue, margins, wafer shipments, and process-node revenue mix
Quarterly · Global company reportingIntel 2025 Form 10-K
Intel Foundry segment revenue, third-party external revenue, operating result, and process milestones
Quarterly and annual · Global company reportingIntel Q2 2026 Earnings Release
Q2 2026 Intel Foundry segment revenue and Intel 18A-P / Panther Lake manufacturing milestones
Quarterly · Global company reportingGlobalFoundries FY2025 Results
Annual and quarterly revenue, margins, cash flow, and 300 mm-equivalent wafer shipments
Quarterly and annual · Global company reportingUMC 2025 Form 20-F and Results
Annual revenue, monthly sales, wafer shipments, capacity utilization, and 12-inch-equivalent capacity
Monthly, quarterly, and annual · Global company reportingUMC Q2 2026 Results and Expansion Disclosure
Q2 2026 revenue, process mix, utilization, wafer-shipment growth, 2026 capex, and approved expansion plan
Quarterly and event-driven · Global company reporting and Taiwan/Singapore manufacturingSMIC 2025 Annual Report
Audited revenue, wafer shipments, 8-inch-equivalent capacity, ASP, and operating metrics
Quarterly and annual · Global company reportingHua Hong Semiconductor 2025 Annual Report
Audited foundry revenue, profitability, capacity, utilization, and technology-platform disclosures
Quarterly and annual · Global company reportingTower Semiconductor FY2025 Results
Annual and quarterly revenue, profitability, capital expenditure, and specialty-platform investment
Quarterly and annual · Global company reportingTower Semiconductor Q2 2026 Results
Q2 2026 consolidated revenue and gross profit plus separately labeled Q3 2026 revenue guidance
Quarterly · Global company reportingTower Japan SiPho / SiGe Capacity Expansion
July 2026 plan for 300mm silicon-photonics, silicon-germanium, and advanced optical-packaging expansion
Event-driven disclosure · Japan manufacturingSynopsys 2023 Form 10-K
Audited FY2021–FY2023 Design Automation and Design IP segment revenue, including retrospectively reclassified Design IP periods
Annual filing · Global company reportingSynopsys 2025 Form 10-K
Audited FY2023–FY2025 Design Automation and Design IP segment revenue and Ansys acquisition perimeter
Annual filing · Global company reportingSynopsys Q2 Fiscal 2026 Results
Q2 fiscal 2026 total company revenue
Quarterly · Global company reportingCadence 2023 Form 10-K
Audited FY2021–FY2023 company revenue
Annual filing · Global company reportingCadence 2025 Form 10-K
Audited FY2023–FY2025 company revenue, rounded product-group revenue shares, and one-operating-segment disclosure
Annual filing · Global company reportingCadence Q2 2026 Results
Q2 2026 total company revenue
Quarterly · Global company reportingSiemens Annual Report 2024
FY2023–FY2024 Digital Industries software-business revenue; a broad proxy that includes but does not isolate EDA
Annual report · Global company reportingSiemens Annual Report 2025
FY2024–FY2025 Digital Industries software-business revenue and acquisition perimeter
Annual report · Global company reportingSiemens Q2 Fiscal 2026 Results
Q2 fiscal 2026 Digital Industries software-business revenue (€1,614 million), a broad context metric that does not isolate Siemens EDA
Quarterly · Global company reportingArm Fiscal 2026 Form 20-F
Audited FY2024–FY2026 license-and-other, royalty, and total revenue
Annual filing · Global company reportingKorea Customs Service Open API
HS and HSK product trade value and net weight by partner and month
Monthly with revisions · Republic of Korea reporter-partner tradeVLSI Market Global Taxonomy
Product hierarchy and qualitative product-to-end-market routing
Versioned editorial updates · Global