Technology classes, exact records, services, software, and components—with gaps retained.
Technology taxonomy, clearly separated from products.
This separate 187-node map contains technology generations, market categories, services, and software. Every node receives honest activity context without being presented as a priced SKU.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Markets & technology classesOpen priced products
Memory through display, power, manufacturing and EDA.
Only multi-date product-specific price references.
Every node exposes available, unavailable, proxy, or not-applicable states.
Taxonomy coverage187 matches
Showing the first 60 of 187 matches.
Narrow the market group, evidence state, family, application, or product name to reveal the rest.
Memory & Storage
3 priced specificationsDRAM
DRAM · memory die
- Product family
- DRAM
- Object measured
- memory die
- Applications
- server · PC · mobile · industrial
dynamic random-access memorydynamic RAM
EVIDENCE DIAGNOSTIC
Broader market proxyUseful context, explicit limits.
The linked public series measures a larger market category containing multiple products, generations, vendors, or objects.
market category · memory die
Kept separate from this broader node
4 companies in broader official DRAM disclosures
Market-category proxy
- 01IdentityDRAM
- 02Company link4 companies in broader official DRAM disclosures
- 03Market activity6 contextual layers
- 04Exact price historyOnly broader evidence exists
Why this is not a price chartBroader market proxy · Only broader evidence existsMethod & requirements
The linked public series measures a larger market category containing multiple products, generations, vendors, or objects. An absent observation is not a zero observation. A broader proxy is never promoted to an exact-product price.
- Exact product identity
- Compatible dated observations
- Product-level price basis
- Reusable public source rights
Use the broader series only as market context; do not relabel it as this product's price.
Available priced specifications
The family itself is not assigned a synthetic price. Each card below is an exact die density with its own basis, unit, dates, and source.
DDR3 · dieVerified public history
DDR3 4Gb die market reference$1.74 / chip · 2025
Official annual-average spot-price reference
DDR4 · dieVerified public history
DDR4 8Gb die market reference$21.00 / chip · 2026-06
Government-reported fixed-price reference
DDR5 · dieVerified public history
DDR5 16Gb die market reference$28.50 / chip · 2026-01
Government-reported fixed-price reference
Gb is die density; GB is assembled-module capacity. A 16Gb chip price is never relabeled or multiplied into a 16GB DIMM price.
MANUFACTURER & SUPPLIER EVIDENCE
4 SOURCE-LINKEDWho is source-linked to this market?
4 companies in broader official DRAM disclosures
memory manufacturerBroader memory-company context
Samsung ElectronicsThe company is present in a broader memory disclosure; no exact product allocation is inferred.
- Attached evidence
- Context only
- Latest signal
- No comparable supply metric
memory manufacturerBroader memory-company context
SK hynixThe company is present in a broader memory disclosure; no exact product allocation is inferred.
- Attached evidence
- Context only
- Latest signal
- No comparable supply metric
memory manufacturerBroader memory-company context
MicronThe company is present in a broader memory disclosure; no exact product allocation is inferred.
- Attached evidence
- 2
- Latest signal
- Increased in the low-single-digit percentage range
memory manufacturerBroader memory-company context
CXMTThe company is present in a broader memory disclosure; no exact product allocation is inferred.
- Attached evidence
- 1
- Latest signal
- 61.799 CNY billion
Relationship scope4 companies in broader official DRAM disclosures
Supply coverageLatest issuer-reported bit-shipment direction
Market-share claimNot inferred
Review 5 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
reported bit shipment directionFQ3 2026
Micron · DRAM bit shipment changeIncreased in the low-single-digit percentage range
Micron-wide DRAM; sequential change · Issuer wording is retained. This is a directional bit-shipment change, not absolute units, generation supply, market share, or price.Micron prepared remarksissuer revenue contextFY2025
Samsung · Memory Business sales104.1 KRW trillion
Memory Business sales · DRAM and NAND combined; includes intersegment sales; not DDR4-only.Samsung 4Q & FY2025 Resultsissuer revenue contextFY2025
SK hynix · Consolidated company revenue97.147 KRW trillion
Consolidated company revenue · Includes DRAM, NAND / Solidigm, and other products; not DDR4-only.SK hynix Investor Relationsissuer revenue contextFY2025
Micron · Consolidated company revenue37.378 USD billion
Consolidated company revenue · Late-August fiscal year; includes DRAM, NAND, and other revenue; not DDR4-only.Micron Technology Investor Relationsissuer revenue contextFY2025
CXMT issuer group · Consolidated issuer operating revenue61.799 CNY billion
Consolidated issuer operating revenue · ChangXin Technology Group scope; not DDR4-only or shipment volume.CXMT SSE ProspectusPRODUCTION & SUPPLY CONTEXT
6/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
ShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
Sales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
2 separately scoped evidence seriesSales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryIndustry context
73.2 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesUtilizationIndustry context
72.2% · U.S. · 2026-06Use to frame broad industry-cycle conditions with geography and industry scope visible.
Trade flowMarket-category proxy
$214.9B · 38.5 kt reported mass · 2024Use as broader market-category context; keep the selected node and source category visibly distinct.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.