Technology classes, exact records, services, software, and components—with gaps retained.
Technology taxonomy, clearly separated from products.
This separate 187-node map contains technology generations, market categories, services, and software. Every node receives honest activity context without being presented as a priced SKU.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Markets & technology classesOpen priced products
Memory through display, power, manufacturing and EDA.
Only multi-date product-specific price references.
Every node exposes available, unavailable, proxy, or not-applicable states.
Taxonomy coverage187 matches
Showing the first 60 of 187 matches.
Narrow the market group, evidence state, family, application, or product name to reveal the rest.
Memory & Storage
Verified price historyDDR5 16Gb Die
DDR DRAM · memory die
- Product family
- DDR DRAM
- Object measured
- memory die
- Applications
- AI PC · server · desktop
DDR5 16 gigabit chip16Gb DDR5
Verified reference history
DDR5 16Gb die · Market-wide reference · Public market reference
Consecutive compatible fixed-price references are connected for readability. This is not a live spot quote, retail price, shipment series, or forecast. This is a market-wide reference, not a Samsung, SK hynix, Micron, CXMT, or other vendor-specific price.
- Latest reference
- 28.5 · USD / chip
- As of
- Jan 2026
- Market basis
- Public fixed reference
- Source publication
- 2026-02-13
- Revision ID
- chungbuk-ict-jan-2026:ddr5-16gb-die:2026-01:v1
MANUFACTURER & SUPPLIER EVIDENCE
4 SOURCE-LINKEDWho is source-linked to this market?
4 manufacturers with official DDR5 evidence
memory manufacturerOfficial generation catalog
MicronAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 4
- Latest signal
- official sampling catalog
memory manufacturerOfficial generation catalog
Samsung ElectronicsAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 3
- Latest signal
- official mass-production announcement
memory manufacturerOfficial generation catalog
SK hynixAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 1
- Latest signal
- official launch announcement
memory manufacturerOfficial generation catalog
CXMTAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 2
- Latest signal
- official current product family
Relationship scope4 manufacturers with official DDR5 evidence
Supply coverageProduct and production status; no comparable volume
Market-share claimNot inferred
Review 10 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
official production statusRetrieved 2026-08-05
Micron · MT60B1G16HD-64B IT:H catalog statusofficial sampling catalog
package · 16Gb · The official catalog lists this 16Gb x16 DDR5 component at 6400 MT/s as Sampling. No reusable Micron price history is attached.DDR5 SDRAM part catalogofficial production statusRetrieved 2026-08-05
Samsung Electronics · DDR5 product statusofficial mass-production announcement
die · 16Gb · Samsung officially announced mass production of 16Gb DDR5. The announcement does not disclose a part number or reusable Samsung price series.12nm-class 16Gb DDR5 DRAM mass-production announcementofficial production statusRetrieved 2026-08-05
Samsung Electronics · M323R1GB4PB0-CWM catalog statusofficial production catalog
module · 8GB · Samsung lists this 8GB DDR5-5600 UDIMM as Mass Production. The 16Gb die reference is not a Samsung module price.M323R1GB4PB0-CWM DDR5 UDIMM product pageofficial production statusRetrieved 2026-08-05
Samsung Electronics · M321R4GA0PB0-CWM catalog statusofficial production catalog
module · 32GB · Samsung lists this 32GB DDR5-5600 ECC RDIMM as Mass Production. No reusable Samsung price history is published for the part number.M321R4GA0PB0-CWM DDR5 RDIMM product pageofficial production statusRetrieved 2026-08-05
SK hynix · DDR5 product statusofficial launch announcement
die · 16Gb · SK hynix's official launch describes 16Gb DDR5 at 4,800–5,600 Mbps with built-in ECC, but does not state a part number or reusable company price.SK hynix launches DDR5 DRAMofficial production statusRetrieved 2026-08-05
CXMT · DDR5 product statusofficial current product family
package · 16Gb · CXMT's official product page identifies a 16Gb DDR5 family with speeds up to 8,000 Mbps. It does not publish a reusable CXMT price series.CXMT DDR5 / DDR5 module product familyofficial production statusRetrieved 2026-08-05
CXMT · DDR5 product statusofficial current product family
package · 24Gb · CXMT's official product page identifies a 24Gb DDR5 family with speeds up to 8,000 Mbps. The 16Gb market reference is not compatible with this density.CXMT DDR5 / DDR5 module product familyofficial production statusRetrieved 2026-08-05
Micron · MTC4C10163S1SC56BH1 catalog statusofficial production catalog
module · 8GB · Official Micron production catalog row for an 8GB DDR5 SODIMM. There is no reusable public part-number price history.SODIMM part catalogofficial production statusRetrieved 2026-08-05
Micron · MTC8C1084S1SC56BH1 catalog statusofficial production catalog
module · 16GB · Official Micron production catalog row for a 16GB DDR5 SODIMM. The 16Gb die reference is not a module price.SODIMM part catalogofficial production statusRetrieved 2026-08-05
Micron · MTC16C2085S1UC56BH1 catalog statusofficial production catalog
module · 32GB · Official Micron production catalog row for a 32GB DDR5 UDIMM. Current authorized offers may exist, but no reusable Micron price history is published.UDIMM part catalogManufacturer & capacity matrix
Official manufacturer products are shown beside compatible public market references. A market-wide reference is never presented as a Samsung, SK hynix, Micron, or CXMT price.
Official product evidence
8GB · 16GB · 32GB
Manufacturer-neutral exact die references
Shown explicitly; never zero-filled
| Manufacturer / product | Generation | Object & capacity | Form factor | Speed | Product status | Price evidence | Source / offers |
|---|---|---|---|---|---|---|---|
| DDR5 16Gb die market referencePart number not published | DDR5not stated | 16Gb dieDensity in gigabits | not applicabledie | Speed not specifiedSource unit: not stated · not applicable | market reference; manufacturer not identifiedManufacturer-neutral market reference | $28.50 / chip2026-01 · Government-reported fixed-price referenceOpen price history | Official sourceOutbound discovery only; no scraped price is stored. |
| Micron 16Gb DDR5-6400 x16 componentMT60B1G16HD-64B IT:H | DDR5on-die ECC | 16Gb packageDensity in gigabits | component packagepackage | 6,400 MT/sSource unit: MT/s · native MT/s | official sampling catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Samsung 16Gb DDR5 mass-production announcementPart number not published | DDR5not stated | 16Gb dieDensity in gigabits | not applicabledie | Speed not specifiedSource unit: not stated · not applicable | official mass-production announcementSamsung Electronics | Market context: $28.50 / chip2026-01 · not a Samsung priceOpen neutral context | Official sourceOutbound discovery only; no scraped price is stored. |
| Samsung 8GB DDR5-5600 non-ECC UDIMMM323R1GB4PB0-CWM | DDR5non-ECC module | 8GB moduleCapacity in gigabytes | UDIMMmodule | 5,600 MT/sSource unit: Mbps per pin · 1 Mbps per pin normalized to 1 MT/s | official production catalogSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Samsung 32GB DDR5-5600 ECC RDIMMM321R4GA0PB0-CWM | DDR5ECC module | 32GB moduleCapacity in gigabytes | RDIMMmodule | 5,600 MT/sSource unit: Mbps per pin · 1 Mbps per pin normalized to 1 MT/s | official production catalogSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| SK hynix 16Gb DDR5 launch announcementPart number not published | DDR5on-die ECC | 16Gb dieDensity in gigabits | not applicabledie | 4,800–5,600 MT/sSource unit: Mbps per pin · 1 Mbps per pin normalized to 1 MT/s | official launch announcementSK hynix | Market context: $28.50 / chip2026-01 · not a SK hynix priceOpen neutral context | Official sourceOutbound discovery only; no scraped price is stored. |
| CXMT 16Gb DDR5 product familyPart number not published | DDR5on-die ECC | 16Gb packageDensity in gigabits | component packagepackage | Up to 8,000 MT/sSource unit: Mbps per pin · 1 Mbps per pin normalized to 1 MT/s | official current product familyCXMT | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| CXMT 24Gb DDR5 product familyPart number not published | DDR5on-die ECC | 24Gb packageDensity in gigabits | component packagepackage | Up to 8,000 MT/sSource unit: Mbps per pin · 1 Mbps per pin normalized to 1 MT/s | official current product familyCXMT | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Micron 8GB DDR5-5600 non-ECC SODIMMMTC4C10163S1SC56BH1 | DDR5non-ECC module | 8GB moduleCapacity in gigabytes | SODIMMmodule | 5,600 MT/sSource unit: MT/s · native MT/s | official production catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Micron 16GB DDR5-5600 non-ECC SODIMMMTC8C1084S1SC56BH1 | DDR5non-ECC module | 16GB moduleCapacity in gigabytes | SODIMMmodule | 5,600 MT/sSource unit: MT/s · native MT/s | official production catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Micron 32GB DDR5-5600 non-ECC UDIMMMTC16C2085S1UC56BH1 | DDR5non-ECC module | 32GB moduleCapacity in gigabytes | UDIMMmodule | 5,600 MT/sSource unit: MT/s · native MT/s | official production catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
Manufacturer price means a source explicitly identifies that manufacturer and exact product. Public fixed references, retailer offers, distributor quantity breaks, MSRP, and completed transactions remain separate evidence layers.
PRODUCTION & SUPPLY CONTEXT
6/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
ShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
Sales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
2 separately scoped evidence seriesSales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryIndustry context
73.2 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesUtilizationIndustry context
72.2% · U.S. · 2026-06Use to frame broad industry-cycle conditions with geography and industry scope visible.
Trade flowMarket-category proxy
$214.9B · 38.5 kt reported mass · 2024Use as broader market-category context; keep the selected node and source category visibly distinct.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.