Technology classes, exact records, services, software, and components—with gaps retained.
Technology taxonomy, clearly separated from products.
This separate 187-node map contains technology generations, market categories, services, and software. Every node receives honest activity context without being presented as a priced SKU.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Markets & technology classesOpen priced products
Memory through display, power, manufacturing and EDA.
Only multi-date product-specific price references.
Every node exposes available, unavailable, proxy, or not-applicable states.
Taxonomy coverage187 matches
Showing the first 60 of 187 matches.
Narrow the market group, evidence state, family, application, or product name to reveal the rest.
Memory & Storage
Verified price historyDDR4 8Gb Die
DDR DRAM · memory die
- Product family
- DDR DRAM
- Object measured
- memory die
- Applications
- PC · server maintenance · industrial
DDR4 8 gigabit chip8Gb DDR4
Verified reference history
DDR4 8Gb die · Market-wide reference · Public market reference
Consecutive compatible fixed-price references are connected for readability. This is not a live spot quote, retail price, shipment series, or forecast. This is a market-wide reference, not a Samsung, SK hynix, Micron, CXMT, or other vendor-specific price.
- Latest reference
- 21 · USD / chip
- As of
- Jun 2026
- Market basis
- Public fixed reference
- Source publication
- 2026-07-15
- Revision ID
- k-knowledge-ict-jun-2026:ddr4-8gb-die:2026-06:v1
MANUFACTURER & SUPPLIER EVIDENCE
2 SOURCE-LINKEDWho is source-linked to this market?
2 manufacturers with official DDR4 evidence
memory manufacturerOfficial generation catalog
Samsung ElectronicsAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 2
- Latest signal
- official legacy specification
memory manufacturerOfficial generation catalog
MicronAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 1
- Latest signal
- official production catalog
Relationship scope2 manufacturers with official DDR4 evidence
Supply coverageProduct and production status; no comparable volume
Market-share claimNot inferred
Review 3 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
official product catalogRetrieved 2026-08-05
Samsung Electronics · K4A8G165WB catalog statusofficial legacy specification
package · 8Gb · The data sheet covers an 8Gb x16 packaged-component family across multiple speed bins. The separate public DDR4 die reference is not attached to this Samsung package or presented as a Samsung price.K4A8G165WB 8Gb DDR4 SDRAM x16 data sheetofficial production statusRetrieved 2026-08-05
Micron · MT40A512M16TB-062E IT:R catalog statusofficial production catalog
package · 8Gb · The Micron catalog marks this 8Gb x16 DDR4 packaged component as Production. The separate public DDR4 die reference is not attached to this Micron package or presented as a Micron price.DDR4 SDRAM part catalogofficial product catalogRetrieved 2026-08-05
Samsung Electronics · M378A1K43CB2-CRC00 catalog statusofficial legacy specification
module · 8GB · Official SPD identifies an 8GB, 1Rx8, non-ECC UDIMM. The 8Gb die series cannot be multiplied into a module price.M378A1K43CB2-CRC00 serial presence detect specificationManufacturer & capacity matrix
Official manufacturer products are shown beside compatible public market references. A market-wide reference is never presented as a Samsung, SK hynix, Micron, or CXMT price.
Official product evidence
8GB
Manufacturer-neutral exact die references
Shown explicitly; never zero-filled
| Manufacturer / product | Generation | Object & capacity | Form factor | Speed | Product status | Price evidence | Source / offers |
|---|---|---|---|---|---|---|---|
| DDR4 8Gb die market referencePart number not published | DDR4not stated | 8Gb dieDensity in gigabits | not applicabledie | Speed not specifiedSource unit: not stated · not applicable | market reference; manufacturer not identifiedManufacturer-neutral market reference | $21.00 / chip2026-06 · Government-reported fixed-price referenceOpen price history | Official sourceOutbound discovery only; no scraped price is stored. |
| Samsung K4A8G165WB 8Gb DDR4 x16 component familyK4A8G165WB | DDR4not stated | 8Gb packageDensity in gigabits | component packagepackage | 1,600–2,666 MT/sSource unit: DDR data-rate bin · DDR data-rate bin normalized to MT/s | official legacy specificationSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Micron 8Gb DDR4-3200 x16 componentMT40A512M16TB-062E IT:R | DDR4not stated | 8Gb packageDensity in gigabits | component packagepackage | 3,200 MT/sSource unit: MT/s · native MT/s | official production catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Samsung 8GB DDR4-2400 non-ECC UDIMMM378A1K43CB2-CRC00 | DDR4non-ECC module | 8GB moduleCapacity in gigabytes | UDIMMmodule | 2,400 MT/sSource unit: DDR data-rate bin · DDR data-rate bin normalized to MT/s | official legacy specificationSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
Manufacturer price means a source explicitly identifies that manufacturer and exact product. Public fixed references, retailer offers, distributor quantity breaks, MSRP, and completed transactions remain separate evidence layers.
PRODUCTION & SUPPLY CONTEXT
6/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
ShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
Sales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
2 separately scoped evidence seriesSales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryIndustry context
73.2 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesUtilizationIndustry context
72.2% · U.S. · 2026-06Use to frame broad industry-cycle conditions with geography and industry scope visible.
Trade flowMarket-category proxy
$214.9B · 38.5 kt reported mass · 2024Use as broader market-category context; keep the selected node and source category visibly distinct.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.