Technology classes, exact records, services, software, and components—with gaps retained.
Technology taxonomy, clearly separated from products.
This separate 187-node map contains technology generations, market categories, services, and software. Every node receives honest activity context without being presented as a priced SKU.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Markets & technology classesOpen priced products
Memory through display, power, manufacturing and EDA.
Only multi-date product-specific price references.
Every node exposes available, unavailable, proxy, or not-applicable states.
Taxonomy coverage187 matches
Showing the first 60 of 187 matches.
Narrow the market group, evidence state, family, application, or product name to reveal the rest.
Memory & Storage
Verified price historyDDR3 4Gb Annual Spot Reference
DDR DRAM · memory die
- Product family
- DDR DRAM
- Object measured
- memory die
- Applications
- legacy server · PC · industrial
DDR3 4Gb chipDDR3 4 gigabitDDR3 annual spot
Verified reference history
DDR3 4Gb annual spot reference · Market-wide reference · Public market reference
Compatible annual-average spot references are connected for readability. This is not a live spot quote, DIMM retail price, contract price, manufacturer ASP, shipment series, or forecast. This is a market-wide reference, not a Samsung, SK hynix, Micron, CXMT, or other vendor-specific price.
- Latest reference
- 1.74 · USD / chip
- As of
- 2025
- Market basis
- Public annual spot reference
- Source publication
- 2026-06-10
- Revision ID
- 2025-12-31:dram-price:2025
MANUFACTURER & SUPPLIER EVIDENCE
2 SOURCE-LINKEDWho is source-linked to this market?
2 manufacturers with official DDR3 evidence
memory manufacturerOfficial generation catalog
MicronAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 1
- Latest signal
- official production catalog
memory manufacturerOfficial generation catalog
Samsung ElectronicsAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 2
- Latest signal
- official legacy specification
Relationship scope2 manufacturers with official DDR3 evidence
Supply coverageProduct and production status; no comparable volume
Market-share claimNot inferred
Review 3 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
official production statusRetrieved 2026-08-05
Micron · MT41K256M16TW-107 AIT:P catalog statusofficial production catalog
package · 4Gb · The Micron catalog marks this 4Gb x16 DDR3 component as Production. No reusable Micron price history is published at this part-number grain.DDR3 SDRAM part catalogofficial product catalogRetrieved 2026-08-05
Samsung Electronics · M378B5173BH0-CK0 catalog statusofficial legacy specification
module · 4GB · Official legacy 4GB UDIMM specification based on 4Gb B-die. The DDR3 die reference cannot be relabeled as this module's price.DDR3 4Gb B-die based unbuffered DIMM specificationofficial product catalogRetrieved 2026-08-05
Samsung Electronics · M378B1G73BH0-CK0 catalog statusofficial legacy specification
module · 8GB · Official legacy 8GB UDIMM specification based on 4Gb B-die. Module capacity is GB and is not interchangeable with die density in Gb.DDR3 4Gb B-die based unbuffered DIMM specificationManufacturer & capacity matrix
Official manufacturer products are shown beside compatible public market references. A market-wide reference is never presented as a Samsung, SK hynix, Micron, or CXMT price.
Official product evidence
4GB · 8GB
Manufacturer-neutral exact die references
Shown explicitly; never zero-filled
| Manufacturer / product | Generation | Object & capacity | Form factor | Speed | Product status | Price evidence | Source / offers |
|---|---|---|---|---|---|---|---|
| DDR3 4Gb die market referencePart number not published | DDR3not stated | 4Gb dieDensity in gigabits | not applicabledie | Speed not specifiedSource unit: not stated · not applicable | market reference; manufacturer not identifiedManufacturer-neutral market reference | $1.74 / chip2025 · Official annual-average spot-price referenceOpen price history | Official sourceOutbound discovery only; no scraped price is stored. |
| Micron 4Gb DDR3-1866 x16 componentMT41K256M16TW-107 AIT:P | DDR3not stated | 4Gb packageDensity in gigabits | component packagepackage | 1,866 MT/sSource unit: MT/s · native MT/s | official production catalogMicron | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Samsung 4GB DDR3-1600 non-ECC UDIMMM378B5173BH0-CK0 | DDR3non-ECC module | 4GB moduleCapacity in gigabytes | UDIMMmodule | 1,600 MT/sSource unit: DDR data-rate bin · DDR data-rate bin normalized to MT/s | official legacy specificationSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
| Samsung 8GB DDR3-1600 non-ECC UDIMMM378B1G73BH0-CK0 | DDR3non-ECC module | 8GB moduleCapacity in gigabytes | UDIMMmodule | 1,600 MT/sSource unit: DDR data-rate bin · DDR data-rate bin normalized to MT/s | official legacy specificationSamsung Electronics | Not publicly publishedManufacturer quote or licensed current-offer feed required | Official sourceCurrent offer searchOutbound discovery only; no scraped price is stored. |
Manufacturer price means a source explicitly identifies that manufacturer and exact product. Public fixed references, retailer offers, distributor quantity breaks, MSRP, and completed transactions remain separate evidence layers.
PRODUCTION & SUPPLY CONTEXT
6/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
ShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
Sales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
2 separately scoped evidence seriesSales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryIndustry context
73.2 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesUtilizationIndustry context
72.2% · U.S. · 2026-06Use to frame broad industry-cycle conditions with geography and industry scope visible.
Trade flowMarket-category proxy
$214.9B · 38.5 kt reported mass · 2024Use as broader market-category context; keep the selected node and source category visibly distinct.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.