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VLSI MARKET / SOURCE-LINKED RESEARCH

Semiconductor, materials, components, equipment & display history

Explore wafers and memory alongside materials, electronic components, manufacturing and inspection equipment, equipment parts, displays and packaging. Distinguish output, capacity, shipments, installed base and investment with original sources.

Evidence cutoff2026-10-17
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3,865Source-linked observations & milestonesPrevious release 1,663 · Added now +2,202
153 + 3Company identities + aggregatesHistorical ownership scopes retained
337Distinct metricsPoints, bounds, qualitative facts & events
738Unique source URLs764 source records

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104 matching records · 1–40 shown40 per page · Native measurement units retained
Measurements, native scopes, period bases and original sources. Expand a row’s evidence details for its full context.
Company / metricPeriod / productObservation / unitStatus / kindSource / availability
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003812008year300mm physical60,000Physical production capacitywafers/monthannounced plannumeric pointForecast / planForecast vintage: see sourceMKSS2007Samsung Opens Largest Wafer Plant in Austin TexasPublished: UnknownVerified available: Unknown — no point-in-time assumption
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Austin_new_300mm_NAND_fab_only
Wafer basis
300mm_physical
Source locator
Paragraph2
Notes
Plan announced2007; do not assume actual2008 attainment; later Austin logic conversion breaks a simple memory capacity series.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003822011-09month300mm physical> 10,000Physical production capacitywafers/monthannounced plannumeric boundForecast / plan2011-09-26MKSS2011L16World Largest Fabrication Facility Line16Published: 2011-09-26Verified available: 2011-09-26
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Hwaseong_Line16_initial_NAND_ramp
Wafer basis
300mm_physical
Source locator
Projected volume paragraph
Notes
Projected volume more than10,000; not audited realized starts, and not contradictory to future200k buildout target.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003832011-10month300mm physical40,000Physical production capacitywafers/monthreported actualnumeric pointMKSS2011S2Samsung Austin Logic Line Breaks Record AchievementsPublished: 2011-12-13Verified available: 2011-12-13
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Austin_S2_logic_only
Wafer basis
300mm_physical
Source locator
Opening paragraph
Notes
Achieved targeted wafer-start capacity,45nm low-power logic; separate from memory. Does not represent all Samsung foundry.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003842011_onwardtarget window300mm physical> 200,000Physical production capacitywafers/monthannounced plannumeric boundForecast / plan2010-05-17MKSS2010L16Samsung 2010 Investment Plan / Line16 GroundbreakingPublished: 2010-05-17Verified available: 2010-05-17
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Hwaseong_Line16_planned_buildout
Wafer basis
300mm_physical
Source locator
반도체 부문, Line16
Notes
Source says more than200,000 and phased investment; not demonstrated output in2011.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003852013-12point in time200mm equivalent1,867,000Physical production capacitywafers/monthsecondary estimatenumeric pointIS11Samsung, TSMC, and Micron Top List of IC Industry Capacity LeadersPublished: 2014-01-08Verified available: 2014-01-08
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.
Wafer basis
200mm_equivalent
Source locator
Figure 1, p.2
Notes
Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003862016-12point in time200mm equivalent2,598,750Physical production capacitywafers/monthsecondary estimatenumeric pointIS12Atomera Investor Presentation, March 2018Published: 2018-03-12Verified available: 2018-03-12
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.
Wafer basis
200mm_equivalent
Source locator
Slide 9: Largest Companies with fabs
Notes
Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003872019-12point in time200mm equivalent2,935,000Physical production capacitywafers/monthsecondary estimatenumeric pointIS13Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%Published: 2021-02-10Verified available: 2021-02-10
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Installed IC fab capacity per IC Insights; images-sensor-converted Line 13 partly excluded.
Wafer basis
200mm_equivalent
Source locator
Figure 1, p.1
Notes
IC Insights 2021 publication vintage; not comparable without scope reconciliation to Knometa revised 2020 values. Line 13 partially excluded in 2020 due to conversion to image sensors.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003882020-12point in time200mm equivalent3,060,000Physical production capacitywafers/monthsecondary estimatenumeric pointIS13Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%Published: 2021-02-10Verified available: 2021-02-10
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Installed IC fab capacity per IC Insights; images-sensor-converted Line 13 partly excluded.
Wafer basis
200mm_equivalent
Source locator
Figure 1, p.1
Notes
IC Insights 2021 publication vintage; not comparable without scope reconciliation to Knometa revised 2020 values. Line 13 partially excluded in 2020 due to conversion to image sensors.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003892020-12point in time200mm equivalent3,364,000Physical production capacitywafers/monthsecondary estimatenumeric pointIS14Top Five Leaders Continue Expanding Share of Global IC Fab CapacityPublished: 2022-04-07Verified available: 2022-04-07
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Installed monthly IC wafer capacity, including image sensors, per Knometa 2022.
Wafer basis
200mm_equivalent
Source locator
Global IC Wafer Capacity Leaders chart; exact numeric table also IS15
Notes
Knometa 2022 publication vintage, includes image sensors. 2020 baseline differs from IC Insights 2021 vintage; keep separate series. Exact table values independently checked against readable Evertiq table IS15.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicscapacitywafer historyDevice manufacturing and memorySCE0003902021-12point in time200mm equivalent4,050,000Physical production capacitywafers/monthsecondary estimatenumeric pointIS14Top Five Leaders Continue Expanding Share of Global IC Fab CapacityPublished: 2022-04-07Verified available: 2022-04-07
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Physical production capacity
Scope
Installed monthly IC wafer capacity, including image sensors, per Knometa 2022.
Wafer basis
200mm_equivalent
Source locator
Global IC Wafer Capacity Leaders chart; exact numeric table also IS15
Notes
Knometa 2022 publication vintage, includes image sensors. 2020 baseline differs from IC Insights 2021 vintage; keep separate series. Exact table values independently checked against readable Evertiq table IS15.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-16
Metric identifier
capacity
Samsung Electronicstechnology launchadvanced packagingDevice manufacturing and memorySCE0011282018milestoneI-Cube2I-Cube2 launched in 2018.Technology, mix, growth and othermilestonereported actualmilestonePKG017Samsung Announces Availability of I-Cube4 2.5D IntegrationPublished: 2021-05-06Verified available: 2021-05-06
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
technology_or_product_specific
Product / technology
I-Cube2
Source locator
Retrospective launch-history paragraph, web line85
Notes
Explicit retrospective date in the 2021 company release. Launch year is not a quantified production start or installed capacity.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
technology_launch
Samsung Electronicstechnology availabilityadvanced packagingDevice manufacturing and memorySCE0011292020-08-13milestoneX-Cube 7nm/5nmSilicon-proven 3D IC design methodology and flow became immediately available for 7nm and 5nm.Technology, mix, growth and othermilestonereported actualmilestonePKG018Samsung Announces Silicon-Proven X-Cube 3D IC AvailabilityPublished: 2020-08-13Verified available: 2020-08-13
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
technology_or_product_specific
Product / technology
X-Cube 7nm/5nm
Source locator
Availability and methodology paragraphs, web lines75–84
Notes
Includes a 7nm test chip with SRAM stacked on logic using TSV. Availability does not establish mass production or shipment volume.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
technology_availability
Samsung Electronicstechnology availabilityadvanced packagingDevice manufacturing and memorySCE0011302021-05-06milestoneI-Cube4Commercial 2.5D solution became immediately available, integrating four HBMs and one logic die.Technology, mix, growth and othermilestonereported actualmilestonePKG017Samsung Announces Availability of I-Cube4 2.5D IntegrationPublished: 2021-05-06Verified available: 2021-05-06
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
technology_or_product_specific
Product / technology
I-Cube4
Source locator
Immediate-availability paragraph, web lines73–83
Notes
Four HBMs describes integration configuration, not four wafers or packaging throughput. No absolute capacity was stated.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
technology_availability
Samsung Electronicsbit shipments growth qoqmemory dramDevice manufacturing and memorySCE0011652024-Q4calendar quarterDRAMdecline by a low-teens percentageTechnology, mix, growth and otherpercent_qoqApproximate value / source wordingreported actualqualitativeMEM011Samsung Electronics CY2024 Q4 Earnings Call scriptPublished: 2025-01-31Verified available: 2025-01-31
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
company DRAM products
Product / technology
DRAM
Comparison basis
previous_quarter
Source locator
Q&A PDF p25
Notes
전분기 대비. 출하 bits 감소는 웨이퍼 생산량 감소와 동일하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
bit_shipments_growth_qoq
Samsung Electronicsasp change qoqmemory dramDevice manufacturing and memorySCE0011662024-Q4calendar quarterDRAM≈ 20Technology, mix, growth and otherpercent_qoqApproximate value / source wordingreported actualnumeric pointMEM011Samsung Electronics CY2024 Q4 Earnings Call scriptPublished: 2025-01-31Verified available: 2025-01-31
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
company DRAM products
Product / technology
DRAM
Comparison basis
previous_quarter
Source locator
Q&A PDF p25
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
asp_change_qoq
Samsung Electronicsproduct revenue mixmemory dramDevice manufacturing and memorySCE0011672024calendar yearDDR4 + LPDDR4low-30% or so of salesRevenue, investment and monetary measurespercent_of_DRAM_revenueApproximate value / source wordingreported actualqualitativeMEM011Samsung Electronics CY2024 Q4 Earnings Call scriptPublished: 2025-01-31Verified available: 2025-01-31
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Revenue, investment and monetary measures
Scope
company DRAM products
Product / technology
DDR4 + LPDDR4
Source locator
Q&A PDF p36
Notes
해당 DRAM시장 답변에서 공개한 제품 매출비중. 생산bit/wafer 비중이 아님.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
product_revenue_mix
Samsung Electronicsproduct revenue mixmemory dramDevice manufacturing and memorySCE0011682025calendar yearDDR4 + LPDDR4single-digit percent targetRevenue, investment and monetary measurespercent_of_DRAM_revenueApproximate value / source wordingcompany forecastqualitativeForecast / plan2025-01-31MEM011Samsung Electronics CY2024 Q4 Earnings Call scriptPublished: 2025-01-31Verified available: 2025-01-31
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Revenue, investment and monetary measures
Scope
company DRAM products
Product / technology
DDR4 + LPDDR4
Source locator
Q&A PDF p36
Notes
2025-01-31 당시 계획. 사후 실적처럼 취급 금지.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
product_revenue_mix
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011692016-01-19eventHBM2 4GBmass_production_startedTechnology, mix, growth and otherstagereported actualmilestoneMEM012Samsung begins mass producing 4GB HBM2Published: 2016-01-19Verified available: 2016-01-19
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 4GB
Source locator
Main release
Notes
buffer die 1개는 DRAM core die 수에 포함하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsstack capacitymemory hbmDevice manufacturing and memorySCE0011702016-01-19eventHBM2 4GB4Technology, mix, growth and otherGB_per_stackreported actualnumeric pointMEM012Samsung begins mass producing 4GB HBM2Published: 2016-01-19Verified available: 2016-01-19
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 4GB
Source locator
Main release
Notes
buffer die 1개는 DRAM core die 수에 포함하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_capacity
Samsung Electronicsdram die stack heightmemory hbmDevice manufacturing and memorySCE0011712016-01-19eventHBM2 4GB4Technology, mix, growth and otherDRAM_dies_per_stackreported actualnumeric pointMEM012Samsung begins mass producing 4GB HBM2Published: 2016-01-19Verified available: 2016-01-19
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 4GB
Source locator
Main release
Notes
buffer die 1개는 DRAM core die 수에 포함하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
dram_die_stack_height
Samsung Electronicsstack bandwidthmemory hbmDevice manufacturing and memorySCE0011722016-01-19eventHBM2 4GB256Technology, mix, growth and otherGB/s_per_stackreported actualnumeric pointMEM012Samsung begins mass producing 4GB HBM2Published: 2016-01-19Verified available: 2016-01-19
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 4GB
Source locator
Main release
Notes
buffer die 1개는 DRAM core die 수에 포함하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_bandwidth
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011732018-01-11eventHBM2 Aquaboltmass_production_startedTechnology, mix, growth and otherstagereported actualmilestoneMEM013Samsung starts mass production of Aquabolt 8GB HBM2Published: 2018-01-11Verified available: 2018-01-11
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 Aquabolt
Source locator
Main release
Notes
본문307GB/s; 각주 계산값307.2GB/s. 2nd-generation HBM2는 Samsung내제품세대이며 JEDEC HBM2E와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsstack capacitymemory hbmDevice manufacturing and memorySCE0011742018-01-11eventHBM2 Aquabolt8Technology, mix, growth and otherGB_per_stackreported actualnumeric pointMEM013Samsung starts mass production of Aquabolt 8GB HBM2Published: 2018-01-11Verified available: 2018-01-11
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 Aquabolt
Source locator
Main release
Notes
본문307GB/s; 각주 계산값307.2GB/s. 2nd-generation HBM2는 Samsung내제품세대이며 JEDEC HBM2E와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_capacity
Samsung Electronicsdram die stack heightmemory hbmDevice manufacturing and memorySCE0011752018-01-11eventHBM2 Aquabolt8Technology, mix, growth and otherDRAM_dies_per_stackreported actualnumeric pointMEM013Samsung starts mass production of Aquabolt 8GB HBM2Published: 2018-01-11Verified available: 2018-01-11
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 Aquabolt
Source locator
Main release
Notes
본문307GB/s; 각주 계산값307.2GB/s. 2nd-generation HBM2는 Samsung내제품세대이며 JEDEC HBM2E와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
dram_die_stack_height
Samsung Electronicspin data ratememory hbmDevice manufacturing and memorySCE0011762018-01-11eventHBM2 Aquabolt2.4Technology, mix, growth and otherGb/s_per_pinreported actualnumeric pointMEM013Samsung starts mass production of Aquabolt 8GB HBM2Published: 2018-01-11Verified available: 2018-01-11
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 Aquabolt
Source locator
Main release
Notes
본문307GB/s; 각주 계산값307.2GB/s. 2nd-generation HBM2는 Samsung내제품세대이며 JEDEC HBM2E와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
pin_data_rate
Samsung Electronicsstack bandwidthmemory hbmDevice manufacturing and memorySCE0011772018-01-11eventHBM2 Aquabolt307Technology, mix, growth and otherGB/s_per_stackreported actualnumeric pointMEM013Samsung starts mass production of Aquabolt 8GB HBM2Published: 2018-01-11Verified available: 2018-01-11
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2 Aquabolt
Source locator
Main release
Notes
본문307GB/s; 각주 계산값307.2GB/s. 2nd-generation HBM2는 Samsung내제품세대이며 JEDEC HBM2E와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_bandwidth
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011782020-02-04eventHBM2E Flashboltmarket_launchTechnology, mix, growth and otherstagereported actualmilestoneMEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Main release
Notes
1y DRAM. 최대시험치4.2Gbps/538GB/s와 안정동작3.2Gbps/410GB/s를 혼합하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsstack capacitymemory hbmDevice manufacturing and memorySCE0011792020-02-04eventHBM2E Flashbolt16Technology, mix, growth and otherGB_per_stackreported actualnumeric pointMEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Main release
Notes
1y DRAM. 최대시험치4.2Gbps/538GB/s와 안정동작3.2Gbps/410GB/s를 혼합하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_capacity
Samsung Electronicsdram die stack heightmemory hbmDevice manufacturing and memorySCE0011802020-02-04eventHBM2E Flashbolt8Technology, mix, growth and otherDRAM_dies_per_stackreported actualnumeric pointMEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Main release
Notes
1y DRAM. 최대시험치4.2Gbps/538GB/s와 안정동작3.2Gbps/410GB/s를 혼합하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
dram_die_stack_height
Samsung Electronicspin data ratememory hbmDevice manufacturing and memorySCE0011812020-02-04eventHBM2E Flashbolt3.2Technology, mix, growth and otherGb/s_per_pinreported actualnumeric pointMEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Main release
Notes
1y DRAM. 최대시험치4.2Gbps/538GB/s와 안정동작3.2Gbps/410GB/s를 혼합하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
pin_data_rate
Samsung Electronicsstack bandwidthmemory hbmDevice manufacturing and memorySCE0011822020-02-04eventHBM2E Flashbolt410Technology, mix, growth and otherGB/s_per_stackreported actualnumeric pointMEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Main release
Notes
1y DRAM. 최대시험치4.2Gbps/538GB/s와 안정동작3.2Gbps/410GB/s를 혼합하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_bandwidth
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011832020-H1eventHBM2E Flashboltvolume_production_plannedTechnology, mix, growth and otherstageannounced planmilestoneForecast / plan2020-02-04MEM014Samsung launches Flashbolt 16GB HBM2EPublished: 2020-02-04Verified available: 2020-02-04
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM2E Flashbolt
Source locator
Final paragraph
Notes
2020-02-04 발표 당시 향후계획. 이날 양산완료를 의미하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011842024-02-27eventHBM3E 12Hdeveloped_and_sampling_startedTechnology, mix, growth and otherstagereported actualmilestoneMEM015Samsung develops 36GB HBM3E 12HPublished: 2024-02-27Verified available: 2024-02-27
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Main release
Notes
최대 대역폭 spec이며 실제 wafer output 아님. 양산단계와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsstack capacitymemory hbmDevice manufacturing and memorySCE0011852024-02-27eventHBM3E 12H36Technology, mix, growth and otherGB_per_stackreported actualnumeric pointMEM015Samsung develops 36GB HBM3E 12HPublished: 2024-02-27Verified available: 2024-02-27
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Main release
Notes
최대 대역폭 spec이며 실제 wafer output 아님. 양산단계와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
stack_capacity
Samsung Electronicsdram die stack heightmemory hbmDevice manufacturing and memorySCE0011862024-02-27eventHBM3E 12H12Technology, mix, growth and otherDRAM_dies_per_stackreported actualnumeric pointMEM015Samsung develops 36GB HBM3E 12HPublished: 2024-02-27Verified available: 2024-02-27
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Main release
Notes
최대 대역폭 spec이며 실제 wafer output 아님. 양산단계와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
dram_die_stack_height
Samsung Electronicsmaximum stack bandwidthmemory hbmDevice manufacturing and memorySCE0011872024-02-27eventHBM3E 12H1,280Technology, mix, growth and otherGB/s_per_stackreported actualnumeric pointMEM015Samsung develops 36GB HBM3E 12HPublished: 2024-02-27Verified available: 2024-02-27
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Main release
Notes
최대 대역폭 spec이며 실제 wafer output 아님. 양산단계와 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
maximum_stack_bandwidth
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011882024-H1eventHBM3E 12Hmass_production_plannedTechnology, mix, growth and otherstageannounced planmilestoneForecast / plan2024-02-27MEM015Samsung develops 36GB HBM3E 12HPublished: 2024-02-27Verified available: 2024-02-27
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Final production-timing paragraph
Notes
발표시점 계획.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011892024-04eventHBM3E 8Hmass_production_startedTechnology, mix, growth and otherstagereported actualmilestoneMEM016Samsung Electronics first quarter 2024 resultsPublished: 2024-04-30Verified available: 2024-04-30
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 8H
Source locator
Memory Business
Notes
this month는 공시월2024년4월. 실적기간Q1과 이정표월4월을 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011902024-Q2eventHBM3E 12Hmass_production_plannedTechnology, mix, growth and otherstageannounced planmilestoneForecast / plan2024-04-30MEM016Samsung Electronics first quarter 2024 resultsPublished: 2024-04-30Verified available: 2024-04-30
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM3E 12H
Source locator
Memory Business
Notes
2024-04-30 당시Q2내계획; 개발발표만으로 실제양산이행을 추정하지 않음.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage
Samsung Electronicsmilestone stagememory hbmDevice manufacturing and memorySCE0011912026-02-12eventHBM4mass_production_and_commercial_shipments_startedTechnology, mix, growth and otherstagereported actualmilestoneMEM017Samsung commercial HBM4 shipments and mass productionPublished: 2026-02-12Verified available: 2026-02-12
Classification, scope, notes & source locator
Industry stage
Device manufacturing and memory
Measure family
Technology, mix, growth and other
Scope
single HBM stack/product
Product / technology
HBM4
Source locator
Main release
Notes
1c DRAM core +4nm logic base die. 핀속도 최대13Gbps와 안정11.7Gbps 구분.
Aggregation rule
Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.
Retrieved
2026-10-17
Metric identifier
milestone_stage

Read each measurement in context

01 / WAFERS & BITS

Capacity, output and bits differ

Monthly capacity differs from actual output, inputs and bit shipments. Some companies define capacity as their observed maximum monthly input. Check the source definition, wafer diameter and equivalent basis.

02 / EUV & TECHNOLOGY

Systems, chambers, shipments and fleet

One system can contain multiple chambers. Keep annual shipments, cumulative shipments and installed base separate, and avoid adding High-NA subtotals to an EUV total.

03 / MATERIALS, COMPONENTS & DISPLAYS

Mass, area, units and value differ

Materials in tonnes or litres, component pieces and panel area or shipments are not interchangeable. Check the scope of plant capacity, output, sales and company or segment revenue.

04 / DATES & UNCERTAINTY

Forecasts and missing values stay visible

Qualitative ranges are not invented numbers, and missing disclosure is not zero. For model training, verify publication dates, fiscal periods, plans and source vintages.

RESEARCH RELEASE V3 / 2026-10-17

Download the research release

These files contain the complete release with the latest additions. Use CSV / JSONL above the table for filtered results. The gap registry explains undisclosed and uncollected measures.

Full package ZIP ↓
XLSXExcel workbookSQLiteRelational databaseCSVAll observationsJSONLAll observationsJSONLKorean RAG factsCSVMetric dictionaryCSVDisclosure and coverage gapsJSONIndustry and measure classificationsCSVSource registryJSONSchema and definitionsPDFDetailed Korean report
Standalone report HTML ↗Dataset README ↗Baseline wafer research PDF ↗