{
  "industry_stages": {
    "materials": [
      "소재",
      "Materials"
    ],
    "components": [
      "전자부품·기판",
      "Components and substrates"
    ],
    "equipment": [
      "제조·시험 장비",
      "Manufacturing and test equipment"
    ],
    "equipment_components": [
      "장비 부품·서브시스템",
      "Equipment parts and subsystems"
    ],
    "displays": [
      "디스플레이",
      "Displays"
    ],
    "assembly_test": [
      "조립·패키징·테스트",
      "Assembly and test"
    ],
    "device_manufacturing": [
      "반도체 제조·메모리",
      "Device manufacturing and memory"
    ],
    "industry_aggregate": [
      "산업 합계",
      "Industry aggregates"
    ]
  },
  "measurement_families": {
    "physical_output": [
      "실제 생산 물량",
      "Actual physical output"
    ],
    "physical_input": [
      "실제 투입 물량·최대 관측월",
      "Physical inputs and observed monthly peaks"
    ],
    "physical_capacity": [
      "물량 기준 생산능력",
      "Physical production capacity"
    ],
    "physical_shipments": [
      "물량 출하·판매",
      "Physical shipments and sales"
    ],
    "physical_inventory": [
      "물량 재고",
      "Physical inventory"
    ],
    "equipment_stock_flow": [
      "장비·챔버 설치·출하·수주",
      "Equipment and chamber stock / flows"
    ],
    "utilization": [
      "가동률",
      "Utilization"
    ],
    "financial": [
      "매출·투자·생산금액 등",
      "Revenue, investment and monetary measures"
    ],
    "technology_other": [
      "기술·비중·성장률·기타",
      "Technology, mix, growth and other"
    ],
    "missing_disclosure": [
      "수치 미공시",
      "Undisclosed measurements"
    ]
  },
  "new_categories": {
    "materials_chemicals": [
      "전자 화학소재",
      "Electronic chemicals"
    ],
    "materials_photomasks": [
      "포토마스크",
      "Photomasks"
    ],
    "materials_gases": [
      "전자·산업가스",
      "Electronic and industrial gases"
    ],
    "materials_consumables": [
      "CMP·공정 소모재",
      "CMP and process consumables"
    ],
    "components_passives": [
      "MLCC·수동부품",
      "MLCC and passive components"
    ],
    "components_substrates_pcb": [
      "패키지 기판·PCB",
      "Package substrates and PCB"
    ],
    "components_interconnect": [
      "연결·인터커넥트 부품",
      "Interconnect components"
    ],
    "equipment_frontend": [
      "전공정 장비",
      "Front-end equipment"
    ],
    "equipment_metrology_inspection": [
      "계측·검사 장비",
      "Metrology and inspection"
    ],
    "equipment_subsystems": [
      "진공·밸브·전원·가스 공급",
      "Vacuum, valves, power and gas delivery"
    ],
    "components_precision_test": [
      "정밀부품·프로브·소켓",
      "Precision parts, probes and sockets"
    ],
    "display_panels": [
      "디스플레이 패널",
      "Display panels"
    ],
    "display_materials_equipment": [
      "디스플레이 소재·장비",
      "Display materials and equipment"
    ],
    "assembly_test_osat": [
      "반도체 조립·패키징·테스트",
      "Assembly, packaging and test"
    ],
    "equipment_assembly_test": [
      "후공정·시험 장비",
      "Assembly and test equipment"
    ]
  },
  "research_components": {
    "materials": "화학소재·포토마스크·가스·공정 소모재",
    "components_substrates": "MLCC·수동부품·패키지 기판·PCB",
    "frontend_equipment": "전공정·계측·검사 장비",
    "subsystems": "장비 부품·진공·전원·프로브·소켓",
    "displays": "LCD·OLED·유리·Nikon·Canon 장비",
    "backend_osat": "조립·패키징·테스트·후공정 장비"
  }
}