Only priceable products. No empty cards. Every result has a value, unit, date, basis, and source.
Price, production, shipments, inventory—together.
Every selected price record now carries a separate six-layer activity matrix: production, shipments, sales, inventory, utilization, and trade. Broader industry evidence remains visibly separated from exact-product facts. Generic classes such as SRAM, ASIC, FPGA, and CPU do not appear as products.
Labels preserve the source wording while showing a consistent public price type. Open the price dictionary.
Verified product price recordsOpen technology taxonomy
Lines require at least two compatible observations.
Official one-date references are never drawn as trends.
Production, shipments, sales, inventory, utilization, and trade remain separately scoped. Total observations 81.
Verified numeric references23 matches
VERIFIED NUMERIC MARKET REFERENCE
Verified price historyDDR3 4Gb annual spot reference
Market-wide reference · DRAM · die
- Vendor / company
- Market-wide reference
- Vendor scope
- Not vendor-specific
- Price type
- Public market reference
- Source wording
- Official annual-average spot-price reference
- Unit
- USD / chip
- As of
- 2025
- Observations
- 13
Verified reference history
DDR3 4Gb annual spot reference · Market-wide reference · Public market reference
Compatible annual-average spot references are connected for readability. This is not a live spot quote, DIMM retail price, contract price, manufacturer ASP, shipment series, or forecast. This is a market-wide reference, not a Samsung, SK hynix, Micron, CXMT, or other vendor-specific price.
- Latest reference
- 1.74 · USD / chip
- As of
- 2025
- Market basis
- Public annual spot reference
- Source publication
- 2026-06-10
- Revision ID
- 2025-12-31:dram-price:2025
MANUFACTURER & SUPPLIER EVIDENCE
2 SOURCE-LINKEDWho is source-linked to this market?
2 manufacturers with official DDR3 evidence
memory manufacturerOfficial generation catalog
MicronAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 1
- Latest signal
- official production catalog
memory manufacturerOfficial generation catalog
Samsung ElectronicsAn official source verifies at least one product in this generation; it does not prove every density, package, module, or price.
- Attached evidence
- 2
- Latest signal
- official legacy specification
Relationship scope2 manufacturers with official DDR3 evidence
Supply coverageProduct and production status; no comparable volume
Market-share claimNot inferred
Review 3 company evidence recordsOriginal scope, period, source, and guardrail stay attached.Open evidence ledger
official production statusRetrieved 2026-08-05
Micron · MT41K256M16TW-107 AIT:P catalog statusofficial production catalog
package · 4Gb · The Micron catalog marks this 4Gb x16 DDR3 component as Production. No reusable Micron price history is published at this part-number grain.DDR3 SDRAM part catalogofficial product catalogRetrieved 2026-08-05
Samsung Electronics · M378B5173BH0-CK0 catalog statusofficial legacy specification
module · 4GB · Official legacy 4GB UDIMM specification based on 4Gb B-die. The DDR3 die reference cannot be relabeled as this module's price.DDR3 4Gb B-die based unbuffered DIMM specificationofficial product catalogRetrieved 2026-08-05
Samsung Electronics · M378B1G73BH0-CK0 catalog statusofficial legacy specification
module · 8GB · Official legacy 8GB UDIMM specification based on 4Gb B-die. Module capacity is GB and is not interchangeable with die density in Gb.DDR3 4Gb B-die based unbuffered DIMM specificationPRODUCTION & SUPPLY CONTEXT
6/6 CONNECTEDRead the cycle around the product.
Production, shipments, sales, inventory, utilization, and trade stay separate—and keep their original scope.
0 unavailable; missing is not zero.
Closest available evidence, not an automatic product-level claim.
All connected series are broader context.
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
ShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
Sales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
Inspect all six activity layersAvailable, unavailable, and not-applicable states are shown side by side.Open full matrix
ProductionIndustry context
114.1 · EU27 index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesShipmentsIndustry context
113.0 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
2 separately scoped evidence seriesSales / revenueCompany disclosure context
4 issuer-defined scopes · FY2023–FY2025Compare only within the issuer's reported scope or as an indexed company trajectory; do not create a market denominator.
InventoryIndustry context
73.2 · Japan index · 2026-05Use to frame broad industry-cycle conditions with geography and industry scope visible.
3 separately scoped evidence seriesUtilizationIndustry context
72.2% · U.S. · 2026-06Use to frame broad industry-cycle conditions with geography and industry scope visible.
Trade flowMarket-category proxy
$214.9B · 38.5 kt reported mass · 2024Use as broader market-category context; keep the selected node and source category visibly distinct.
These layers describe the closest reusable public evidence. Industry, company, and HS-code context is never relabeled as exact-product units, sales, inventory, or market share.