TSMCSony Semiconductor Solutions
Next-generation smartphone image sensorsdefinitive agreement conditional · 2026-08-11SEMICONDUCTOR INVESTOR PROFILE
SFPIM
Source-linked semiconductor financing relationships. Participation never implies check size, ownership, board rights, or a current investment mandate.
Semiconductor investor relationship workspace
218named investor entities
257source-linked relationships
40company disclosures
2issuer-nondisclosed lists
Interactive capital network
See where disclosed semiconductor funding is concentrated.
Capital is counted once per comparable USD financing event. The graph shows a readable top slice, then opens every visible one-hop relationship when you search or select a node.
Startup · round sizeInvestor · relationship countNamed relationship · constant edge width
Disclosed USD rounds≥$6.4BUnique financing events · no FX conversion
Largest covered sectorAI accelerators≥$3.5B
Companies with named participants37Financing-event scope only
Named relationships257Never individual check size
Where disclosed capital is concentrated
USD financing-event totals are counted once per startup. Bars never allocate a round across named investors.
Accessible relationship table257 canonical English rows
| Investor | Startup | Sector | Stage | Round | Role | Announced | Scope |
|---|---|---|---|---|---|---|---|
| AI accelerators | Series A | $350M | Planned participant | 2026-08-17 | Financing event | ||
| Compute & IP | Series G | $400M | Strategic investor | 2026-04-09 | Financing event | ||
| Photonics & interconnect | Series A add-on | $37M | Existing participant | 2026-03-11 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Strategic investor | 2026-03-03 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Participant | 2026-03-03 | Financing event | ||
| AI accelerators | Series C | $275M | Participant | 2025-11-12 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Lead | 2025-05-14 | Financing event | ||
| AI accelerators | Series B | >$100M | Lead | 2025-02-13 | Financing event | ||
| Equipment & metrology | Series D | $380M | Lead | 2026-06-22 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Photonics & interconnect | Series D | $400M | Existing participant | 2024-10-16 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| AI accelerators | Series A extension | $5M | Co-lead | 2024-06-27 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Participant | 2025-05-14 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| Compute & IP | Series B | >$36M | Lead | 2025-01-23 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| Compute & IP | Series A · final tranche | €32M | Participant | 2025-07-08 | Financing event | ||
| AI accelerators | Series A extension | $5M | Existing participant | 2024-06-27 | Financing event | ||
| Compute & IP | Series G | $400M | Existing participant | 2026-04-09 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Participant | 2025-05-14 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Existing participant | 2023-12-06 | Financing event | ||
| Compute & IP | Series G | $400M | Lead | 2026-04-09 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| Display & microLED | Series C | $40.5M | Lead | 2025-01-30 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Lead | 2026-02-24 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| Packaging & integration | Series B | $75M | Co-lead | 2024-07-16 | Financing event | ||
| Packaging & integration | Series C | $145M | Lead | 2026-07-29 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| AI accelerators | Series C | $275M | Co-lead | 2025-11-12 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Participant | 2026-02-24 | Financing event | ||
| Power semiconductors | Series C | $32M | Participant | 2025-02-18 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Existing participant | 2023-12-06 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| Power semiconductors | Series C | $32M | Existing participant | 2025-02-18 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Existing participant | 2023-12-06 | Financing event | ||
| Photonics & interconnect | Strategic investment | $17.5M | Strategic investor | 2026-03-25 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Strategic investor | 2025-12-17 | Financing event | ||
| Photonics & interconnect | Strategic investment | Undisclosed | Strategic investor | 2024-09-10 | Financing event | ||
| Photonics & interconnect | Series A add-on | $37M | Existing participant | 2026-03-11 | Financing event | ||
| Equipment & metrology | Series B | $40M | Participant | 2025-07-22 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Compute & IP | Series B | >$36M | Existing participant | 2025-01-23 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Compute & IP | Company-level backing | Not attributed | Capital backer | 2024-08-13 | Company capital backer | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| Packaging & integration | Series B | $75M | Strategic investor | 2024-07-16 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| Photonics & interconnect | Series B | $65M | Strategic investor | 2025-05-14 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| Display & microLED | Series C | $40.5M | Existing participant | 2025-01-30 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Participant | 2025-05-14 | Financing event | ||
| Photonics & interconnect | Series A add-on | $37M | Lead | 2026-03-11 | Financing event | ||
| Compute & IP | Series D | >$693M | Co-lead | 2024-12-02 | Financing event | ||
| Display & microLED | Series A | $20M | Lead | 2022-02-22 | Financing event | ||
| AI accelerators | Series C | $275M | Co-lead | 2025-11-12 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Co-lead | 2026-03-10 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Co-lead | 2025-10-30 | Financing event | ||
| Sensors & MEMS | Series A | >$13M | Lead | 2025-01-30 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Lead | 2025-12-17 | Financing event | ||
| AI accelerators | Series A | $350M | Lead | 2026-08-17 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Lead | 2026-07-08 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Co-lead | 2026-03-10 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Co-lead | 2025-10-30 | Financing event | ||
| AI accelerators | Series A extension | $5M | Co-lead | 2024-06-27 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Lead | 2026-08-18 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Co-lead | 2026-03-10 | Financing event | ||
| AI accelerators | Pre-IPO | $400M | Co-lead | 2026-03-30 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Co-lead | 2023-12-06 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Co-lead | 2026-03-10 | Financing event | ||
| AI accelerators | Pre-IPO | $400M | Co-lead | 2026-03-30 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Co-lead | 2023-12-06 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Lead | 2026-03-03 | Financing event | ||
| Equipment & metrology | Series B | $40M | Lead | 2025-07-22 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Co-lead | 2024-06-12 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Co-lead | 2024-06-12 | Financing event | ||
| Compute & IP | Series D | >$693M | Co-lead | 2024-12-02 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Co-lead | 2026-03-10 | Financing event | ||
| Packaging & integration | Series B | $75M | Co-lead | 2024-07-16 | Financing event | ||
| Photonics & interconnect | Series D | $400M | Lead | 2024-10-16 | Financing event | ||
| AI accelerators | Series C | $275M | Co-lead | 2025-11-12 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Co-lead | 2025-10-30 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Participant | 2026-03-03 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Strategic investor | 2026-03-03 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| Photonics & interconnect | Series B-related investment extension | Undisclosed | Strategic investor | 2025-07-22 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Strategic investor | 2026-03-03 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| Compute & IP | Series G | $400M | Participant | 2026-04-09 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Participant | 2026-03-03 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Follow-on investment | Undisclosed | Strategic investor | 2026-04-15 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Display & microLED | Series C | $40.5M | Existing participant | 2025-01-30 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Power semiconductors | Series C | $32M | Existing participant | 2025-02-18 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Equipment & metrology | Series B | $40M | Participant | 2025-07-22 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| Packaging & integration | Series B | $75M | Existing participant | 2024-07-16 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| Compute & IP | Series A · final tranche | €32M | Final-close investor | 2025-07-08 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Participant | 2025-05-14 | Financing event | ||
| Packaging & integration | Series C | $145M | Strategic investor | 2026-07-29 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Series B | >$100M | Strategic investor | 2025-02-13 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| Display & microLED | Series C | $40.5M | Existing participant | 2025-01-30 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Series A extension | $5M | Existing participant | 2024-06-27 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Final-close investor | 2025-10-30 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| AI accelerators | Series C | $275M | Participant | 2025-11-12 | Financing event | ||
| Packaging & integration | Series B | $75M | Participant | 2024-07-16 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| Compute & IP | Company-level backing | Not attributed | Capital backer | 2024-08-13 | Company capital backer | ||
| Power semiconductors | Series C | $32M | Existing participant | 2025-02-18 | Financing event | ||
| Compute & IP | Series A · final tranche | €32M | Participant | 2025-07-08 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| Equipment & metrology | Series A | €15M | Participant | 2026-04-14 | Financing event | ||
| Packaging & integration | Series B | $75M | Existing participant | 2024-07-16 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| Photonics & interconnect | Series D | $400M | Existing participant | 2024-10-16 | Financing event | ||
| Packaging & integration | Series B | $75M | Strategic investor | 2024-07-16 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Series B | >$100M | Strategic investor | 2025-02-13 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Strategic investor | 2025-05-14 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Packaging & integration | Series B | $75M | Existing participant | 2024-07-16 | Financing event | ||
| AI accelerators | Series B | >$100M | Strategic investor | 2025-02-13 | Financing event | ||
| AI accelerators | Series C bridge | $125M | Participant | 2025-07-30 | Financing event | ||
| AI accelerators | Series C | $275M | Existing participant | 2025-11-12 | Financing event | ||
| Equipment & metrology | Series D | $380M | Existing participant | 2026-06-22 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Participant | 2026-03-03 | Financing event | ||
| Power semiconductors | Series C | $32M | Existing participant | 2025-02-18 | Financing event | ||
| Photonics & interconnect | Series B-related investment extension | Undisclosed | Strategic investor | 2025-07-22 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| AI accelerators | Series C bridge | $125M | Participant | 2025-07-30 | Financing event | ||
| AI accelerators | Series C bridge | $125M | Participant | 2025-07-30 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| AI accelerators | Series C bridge | $125M | Participant | 2025-07-30 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| Sensors & MEMS | Series A | >$13M | Existing participant | 2025-01-30 | Financing event | ||
| Photonics & interconnect | Series B | $65M | Strategic investor | 2025-05-14 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Participant | 2023-12-06 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Strategic investor | 2025-12-17 | Financing event | ||
| Packaging & integration | Series C | $145M | Strategic investor | 2026-07-29 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| AI accelerators | Series C | $275M | Participant | 2025-11-12 | Financing event | ||
| Equipment & metrology | Series B | $40M | Participant | 2025-07-22 | Financing event | ||
| Compute & IP | Series B | >$36M | Existing participant | 2025-01-23 | Financing event | ||
| AI accelerators | Series A extension | $5M | Existing participant | 2024-06-27 | Financing event | ||
| Compute & IP | Company-level backing | Not attributed | Capital backer | 2024-08-13 | Company capital backer | ||
| Photonics & interconnect | Series E | $500M | Strategic investor | 2026-03-03 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Strategic investment | Undisclosed | Strategic investor | 2026-04-08 | Financing event | ||
| AI accelerators | Series A extension | $5M | Existing participant | 2024-06-27 | Financing event | ||
| AI accelerators | Series C | $275M | Existing participant | 2025-11-12 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| Equipment & metrology | Series B | $40M | Participant | 2025-07-22 | Financing event | ||
| AI accelerators | Follow-on investment | Undisclosed | Participant | 2026-04-15 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Participant | 2023-12-06 | Financing event | ||
| AI accelerators | Series C | $275M | Existing participant | 2025-11-12 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Flexible & printed electronics | Series D · first close | £162M | Participant | 2023-12-06 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| Power semiconductors | Series C | $32M | Existing participant | 2025-02-18 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| AI accelerators | Series C bridge | $125M | Participant | 2025-07-30 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| Compute & IP | Series G | $400M | Participant | 2026-04-09 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Packaging & integration | Series B | $75M | Participant | 2024-07-16 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| AI accelerators | Series B | >$100M | Strategic investor | 2025-02-13 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Strategic investor | 2024-06-12 | Financing event | ||
| AI accelerators | Series B | >$100M | Existing participant | 2025-02-13 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Photonics & interconnect | Series E | $500M | Participant | 2026-03-03 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Participant | 2026-02-24 | Financing event | ||
| AI accelerators | Company-level backing | Not attributed | Capital backer | 2026-03-30 | Company capital backer | ||
| Display & microLED | Series A | $20M | Existing participant | 2022-02-22 | Financing event | ||
| Equipment & metrology | Series A | €15M | Final-close investor | 2026-04-14 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $700M | Participant | 2026-08-18 | Financing event | ||
| Compute & IP | Series G | $400M | Existing participant | 2026-04-09 | Financing event | ||
| Compute & IP | Series B | >$36M | Strategic investor | 2025-01-23 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Compute & IP | Series G | $400M | Participant | 2026-04-09 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| Equipment & metrology | Series D | $380M | Existing participant | 2026-06-22 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Strategic investor | 2025-10-30 | Financing event | ||
| Packaging & integration | Series B | $75M | Existing participant | 2024-07-16 | Financing event | ||
| AI accelerators | Funding round · stage not stated | $125M | Participant | 2025-12-17 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event | ||
| AI accelerators | Funding round · stage not stated | >$250M | Existing participant | 2026-02-24 | Financing event | ||
| Photonics & interconnect | Series A · final close | $80M | Participant | 2025-10-30 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| AI accelerators | Series F · first close | $1.0B | Participant | 2026-07-08 | Financing event | ||
| Photonics & interconnect | Equity financing | €25.7M | Participant | 2024-06-12 | Financing event | ||
| Equipment & metrology | Series D | $380M | Participant | 2026-06-22 | Financing event | ||
| Compute & IP | Series D | >$693M | Participant | 2024-12-02 | Financing event | ||
| Compute & IP | Series A | Undisclosed | Participant | 2026-03-10 | Financing event | ||
| AI accelerators | Series B | >$100M | Participant | 2025-02-13 | Financing event | ||
| AI accelerators | Series C extension | $120M | Participant | 2024-04-02 | Financing event |
Semiconductor ecosystem
See the industry stack without inventing commercial ties.
Explore EDA and IP, fabless and device design, foundries, equipment, and packaging as one readable workflow. Verified company relationships are separated below.
Capability stageOfficial portfolio taxonomy
Capability flow
From design tools to packaged chips
Portfolio taxonomy, not an inferred customer or supplier relationship.
Verified company links
Only relationships disclosed by a party to the relationship
These are the company-to-company links. Everything above is a capability map and does not imply a commercial tie.
Samsung FoundryTesla, Inc.
contract manufacturing agreementcontract effective · 2025-07-31Intel FoundryFortinet
Fortinet Security Processor 6collaboration announced · 2026-07-23Intel FoundryIntel Products
Intel Core Ultra Series 3 · Panther Lake subsetsubset high volume manufacturing · 2026-07-23Investor explorer
Screen relationships. Inspect the round.
A relationship means the controlling public announcement names the investor. Financing-event participation and company-level capital-backer disclosure remain separate; neither implies check size, ownership, board rights, current mandate, or a complete portfolio.
Investors218 matches
NVIDIAAI accelerators · Compute & IP4companies · 0 leadQatar Investment AuthorityAI accelerators · Equipment & metrology4companies · 0 leadTiger GlobalAI accelerators · Photonics & interconnect3companies · 2 leadFidelity Management & Research CompanyCompute & IP · Equipment & metrology3companies · 1 leadInvest-NLAI accelerators · Equipment & metrology3companies · 1 leadMaverick SiliconAI accelerators · Compute & IP3companies · 1 leadEuropean Innovation Council FundAI accelerators · Compute & IP3companies · 0 leadProsperity7 VenturesCompute & IP · Flexible & printed electronics3companies · 0 leadAtreides ManagementAI accelerators · Compute & IP2companies · 1 leadExport Development CanadaCompute & IP · Display & microLED2companies · 1 leadInnovation IndustriesAI accelerators · Equipment & metrology2companies · 1 leadSamsung Catalyst FundAI accelerators · Packaging & integration2companies · 1 leadSeligman VenturesAI accelerators · Packaging & integration2companies · 1 leadTemasekAI accelerators · Equipment & metrology2companies · 1 lead
1–14 of 218
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DISCLOSED INVESTMENT RELATIONSHIP
1 COMPANIESSFPIM
AI accelerators
- Named relationships
- 1Current validated disclosures
- Lead / co-lead roles
- 0Only when the source states the role
- Sectors reached
- 1AI accelerators
- Latest disclosure
- Feb 24, 2026Axelera AI
This is a sourced relationship graph. A company-capital-backer disclosure is never relabeled as round participation, and neither scope implies a complete portfolio, ownership, or allocation.
Relationship disclosure timeline
Company, stated role, relationship scope, amount basis, and public evidence class.
Axelera AIAI accelerators · NetherlandsExisting participant
- Disclosure scope
- Financing event
- Amount
- >$250M
- Announced
- Feb 24, 2026
Co-disclosed investors
Named in the same controlling disclosure; no partnership or syndicate continuity is inferred.
Bitfury1 shared disclosureBlackRock-managed funds and accounts1 shared disclosureCDP Venture Capital1 shared disclosureEuropean Innovation Council Fund1 shared disclosureInnovation Industries1 shared disclosureInvest-NL1 shared disclosureSamsung Catalyst Fund1 shared disclosureSiteGround Capital1 shared disclosureVerve Investments1 shared disclosure
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Attach a public source when possible. Feedback is delivered to VLSI Korea; this page does not keep a public copy.
Optional relationship viewOpen investor coverage analyticsDisclosure counts, not investment value or portfolio shareOpen insights
Most repeated named investors
Distinct covered companies in validated investment disclosures
View chart data
| Investor | Companies | Lead roles |
|---|---|---|
| NVIDIA | 4 | 0 |
| Qatar Investment Authority | 4 | 0 |
| Tiger Global | 3 | 2 |
| Fidelity Management & Research Company | 3 | 1 |
| Invest-NL | 3 | 1 |
| Maverick Silicon | 3 | 1 |
| European Innovation Council Fund | 3 | 0 |
| Prosperity7 Ventures | 3 | 0 |
| Atreides Management | 2 | 1 |
| Export Development Canada | 2 | 1 |
| Innovation Industries | 2 | 1 |
| Samsung Catalyst Fund | 2 | 1 |
| Seligman Ventures | 2 | 1 |
| Temasek | 2 | 1 |
| BlackRock-managed funds and accounts | 2 | 0 |
| British Patient Capital | 2 | 0 |
| Cambium Capital | 2 | 0 |
| Cambridge Innovation Capital | 2 | 0 |
Disclosed relationship roles
Role and scope labels retained from the announcement
View chart data
| Role | Relationships |
|---|---|
| Participant | 127 |
| Existing participant | 47 |
| Strategic investor | 27 |
| Co-lead | 23 |
| Lead | 18 |
| Capital backer | 11 |
| Final-close investor | 3 |
| Planned participant | 1 |