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DISCOVERY INDEX
Results for “HBM”
14 grouped results shown across 3 collections. Product coverage is evidence status, not a claim that every item has a public price series.
High Bandwidth Memory (HBM)Exact HBM family match · A canonical HBM workspace separating verified manufacturer status from unavailable comparable price, volume, and market-share evidence.Canonical workspaceHBM2EHighest-ranked technology match · Memory & Storage · technology generation · stacked memory packageTechnologyHBM3Highest-ranked technology match · Memory & Storage · technology generation · stacked memory packageTechnologyHBM3EHighest-ranked technology match · Memory & Storage · technology generation · stacked memory packageTechnologyHBM4Highest-ranked technology match · Memory & Storage · technology generation · stacked memory packageTechnologyAlixLabs ABHighest-ranked company match · Lund, Sweden · Atomic-layer-etch pitch splitting. Atomic Layer Etching Pitch Splitting process and equipment for sub-7nm logic, DRAM, and HBM patterning.Startup
High Bandwidth MemoryMemory & Storage · market category · stacked memory packageNo verified price seriesHBM2EMemory & Storage · technology generation · stacked memory packageNo verified price seriesHBM3Memory & Storage · technology generation · stacked memory packageNo verified price seriesHBM3EMemory & Storage · technology generation · stacked memory packageNo verified price seriesHBM4Memory & Storage · technology generation · stacked memory packageNo verified price series2.5D Interposer PackagingManufacturing, Packaging & EDA · market category · multi-die packageNo verified price series3D IC & Hybrid BondingManufacturing, Packaging & EDA · market category · stacked-die package or processNo verified price series
AlixLabs ABLund, Sweden · Atomic-layer-etch pitch splitting. Atomic Layer Etching Pitch Splitting process and equipment for sub-7nm logic, DRAM, and HBM patterning.StartupDreamBig Semiconductor, Inc.San Jose, California, United States · Open chiplet platforms for AI and automotive systems. MARS chiplet platform combining high-speed networking, memory connectivity, and modular compute for large AI and automotive systems.StartupFuriosaAI, Inc.Seoul, South Korea · Power-efficient AI inference. Tensor Contraction Processor architecture and HBM3-equipped RNGD inference accelerators.StartupHanmi Semiconductor Co., Ltd.Republic of Korea · Korean assembly-equipment supplier with HBM and advanced-packaging bonding systems.Supply ChainRebellions Inc.Seongnam, South Korea · Energy-efficient generative-AI inference. Generative-AI inference NPUs including the REBEL chiplet architecture with HBM3E and rack-scale systems.StartupSK hynix Inc.Republic of Korea · Company revenue must not be treated as DRAM-only, NAND-only, or HBM-only revenue without an explicit disclosure.Memory