VLSI KoreaAMD Instinct MI300X Platform
Official AMD accelerator platform record.
official · 2026-08-28AMD data-center portfolio announcement ↗Data center platform · source-linked
AMD Instinct MI300X platform
공식 AMD 자료가 직접 식별한 구성만 표시합니다. HBM supplier, substrate/package assembly partner, fab/node and server BOM unknown.- Maker
- AMD
- Facilities in Market graph
- 0
- Evidence as of
- 2026-08-26
- Entity links
- 9
Verified and explicitly unknown relationships
UBB 2.0 · eight MI300X OAMs
AMD states the platform uses an industry-standard UBB 2.0 design with eight accelerators.
official · 2026-08-28AMD data-center portfolio announcement ↗MI300X OAM
AMD lists the OAM form factor and PCIe Gen5 ×16 interface.
official · 2026-08-28AMD Instinct MI300X data sheet ↗XCD ×8
AMD documentation lists eight XCDs, paired and 3D-stacked on IODs.
official · 2026-08-28AMD Instinct MI300X architecture overview ↗IOD ×4
Four IODs form the base for paired 3D-stacked XCDs.
official · 2026-08-28AMD Instinct MI300X architecture overview ↗5 nm XCD lithography
AMD publishes 5 nm lithography; the selected sources do not name the foundry.
official · 2026-08-28AMD Instinct MI300X data sheet ↗6 nm IOD lithography
AMD publishes 6 nm lithography for the IOD; no foundry is asserted here.
official · 2026-08-28AMD Instinct MI300X data sheet ↗192 GB HBM3 · eight stacks
AMD states 192 GB HBM3 per accelerator and eight stacks; supplier allocation is not disclosed.
official · 2026-08-28AMD data-center portfolio announcement ↗Foundry undisclosed in selected sources
A process node does not authorize VLSI Inside to infer a foundry.
undisclosed · 2026-08-28AMD INSTINCT MI300X PLATFORM │ ├─ PUBLICLY NAMED SILICON / PLATFORM │ └─ AMD describes MI300X accelerator with 8 accelerator dies and 8 HBM3 stacks in its architecture presentation. │ └─ EXPLICIT UNKNOWNS └─ HBM supplier, substrate/package assembly partner, fab/node and server BOM unknown.