VLSI Korea
Annual average, not the commercial daily/session quote board; source specification and period remain attached.
Open public seriesMemory exchange coverage terminal
Every quote object. No disguised blanks.
A product-level map of the professional memory-price workflows readers expect: DRAM, NAND, modules, GDDR, LPDDR, wafers, eMMC, UFS, memory cards, and SSDs. Public facts open directly; commercial values remain visibly license-gated instead of being copied, zero-filled, or replaced with a different metric.
Product-level exchange map
6 of 68 shownAll 68 public quote identities are first-class records
Gb die density and GB finished-device capacity stay distinct. Spot, contract, fixed reference, and street prices never share an unlabeled series.
| Quote object | Board / basis | Object / specification | Expected quote fields | Coverage | Public context |
|---|---|---|---|---|---|
| LPDDR3 32GbLPDDR3 · 32 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package32Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
| LPDDR3 16GbLPDDR3 · 16 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package16Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
| LPDDR3 8GbLPDDR3 · 8 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package8Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
| LPDDR4 32GbLPDDR4 · 32 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package32Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
| LPDDR4 16GbLPDDR4 · 16 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package16Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
| LPDDR4 8GbLPDDR4 · 8 Gb density | LPDDR Spotcommercial spot quote · periodic / source-defined | mobile memory package8Gb mobile DRAM quote object | Not publicly disclosedThe public surface exposes an identity or workflow, not a verified column schema. | License requiredMissing is not zero; internal acquisition routes are access-controlled. | No same-object open seriesNo proxy or zero is substituted. |
Open numeric layer
Related public references stay visibly different
These are not replacements for a DRAMeXchange row. They are source-linked facts with different periods or bases.
Government-reported monthly fixed reference, not a live spot quote, contract reference, manufacturer price, or the specified 3200/eTT series.
Open public seriesGovernment-reported monthly fixed reference; organization, speed grade, eTT state, and commercial quote basis are not inferred.
Open public seriesManufacturer boundary: the DRAM, NAND, module, GDDR, LPDDR, and contract boards are anonymous market references, not Samsung, SK hynix, Micron, or CXMT price histories. Manufacturer-specific prices are shown only when a primary, licensed, or reusable supplier source identifies that manufacturer.
Public price indexes & issuer disclosures
Industry indexes describe long-term price trends. Issuer ASP changes also reflect the company’s product mix. Read these separately from individual DRAM, NAND and HBM transaction prices.
Semiconductor and related device manufacturing producer price index
28.472 · 2026-08 · Index Dec 1998=100
United States · monthly · not seasonally adjusted · BLS / FRED · 715 observations
Source update: 2026-09-10 · Checked: 2026-10-03. Earlier observations may be revised by the source.
Latest 24 monthly observations
| Month | Index |
|---|---|
| 2026-08 | 28.472 |
| 2026-07 | 29.058 |
| 2026-06 | 29.855 |
| 2026-05 | 30.215 |
| 2026-04 | 30.602 |
| 2026-03 | 30.132 |
| 2026-02 | 30.138 |
| 2026-01 | 29.620 |
| 2025-12 | 29.668 |
| 2025-11 | 29.646 |
| 2025-10 | 29.640 |
| 2025-09 | 29.450 |
| 2025-08 | 29.392 |
| 2025-07 | 29.798 |
| 2025-06 | 29.882 |
| 2025-05 | 29.982 |
| 2025-04 | 30.235 |
| 2025-03 | 30.322 |
| 2025-02 | 30.132 |
| 2025-01 | 30.118 |
| 2024-12 | 30.561 |
| 2024-11 | 30.729 |
| 2024-10 | 30.724 |
| 2024-09 | 30.487 |
Semiconductor machinery manufacturing producer price index
108.223 · 2026-08 · Index Dec 2003=100
United States · monthly · not seasonally adjusted · BLS / FRED · 273 observations
Source update: 2026-09-10 · Checked: 2026-10-03. Earlier observations may be revised by the source.
Latest 24 monthly observations
| Month | Index |
|---|---|
| 2026-08 | 108.223 |
| 2026-07 | 108.223 |
| 2026-06 | 108.229 |
| 2026-05 | 108.144 |
| 2026-04 | 108.144 |
| 2026-03 | 106.645 |
| 2026-02 | 106.645 |
| 2026-01 | 106.645 |
| 2025-12 | 106.623 |
| 2025-11 | 106.623 |
| 2025-10 | 106.623 |
| 2025-09 | 106.623 |
| 2025-08 | 106.623 |
| 2025-07 | 106.623 |
| 2025-06 | 106.623 |
| 2025-05 | 106.623 |
| 2025-04 | 106.623 |
| 2025-03 | 105.971 |
| 2025-02 | 105.559 |
| 2025-01 | 105.954 |
| 2024-12 | 106.245 |
| 2024-11 | 106.231 |
| 2024-10 | 106.842 |
| 2024-09 | 106.842 |
Issuer-reported average selling price changes
Issuer fiscal quarters and comparison bases are retained. No market-wide or absolute HBM price is inferred.
| Issuer / portfolio | Reported change | Period / precision | Original source |
|---|---|---|---|
| Micron · DRAM | Increase in the high-teens percentage range | FY2026 Q4 · qualitative | Earnings deck, PDF page 34 ↗2026-09-30 |
| Micron · NAND | Approximately +30% | FY2026 Q4 · approximate | Earnings deck, PDF page 34 ↗2026-09-30 |