VLSI KoreaRevenue
TWD 1.27TQ2 2026
1,270,380 TWD millionIFRS · ConsolidatedPublished 2026-07-16 · SourceCONNECTED RESEARCH
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Bring quarterly results, product evidence, facilities and company announcements into one view. Then choose a research question to go deeper.
Foundry · Taiwan
TSMC
NYSE: TSM · IR snapshot 2026-10-14
Operating margin
60.3%Q2 2026
60.3 percentIFRS · ConsolidatedPublished 2026-07-16 · SourceCapital expenditure
TWD 496BQ2 2026
496,000 TWD millionIFRS · ConsolidatedPublished 2026-07-16 · SourceEach section keeps its own date. Financial results, physical output, capacity and company schedules describe different things; the links below do not establish causation.
PRODUCT CONTEXT
Products & named components
- Named componentRaspberry Pi 5
TSMC 40LP · TSMC
Reviewed 2026-08-28Source ↗ - Named componentNVIDIA DGX H100
TSMC 4N · TSMC
Reviewed 2026-08-28Source ↗ - Named componentFramework Laptop 13 (AMD Ryzen 7040)
TSMC 4 nm
Reviewed 2026-08-28Source ↗
MANUFACTURING CONTEXT
Source-linked facilities
- OperatingFab 18A
Tainan, Taiwan · 12-inch semiconductor manufacturing
Capacity not disclosed in the selected sourceReviewed 2026-08-26Source ↗ - Fab 12A
Hsinchu, Taiwan · 12-inch wafer fabrication
Capacity not disclosed in selected sourceReviewed 2026-08-26Source ↗ - Fab 14
Tainan, Taiwan · 12-inch wafer fabrication
Capacity not disclosed in selected sourceReviewed 2026-08-26Source ↗ - Fab 15
Taichung, Taiwan · 12-inch wafer fabrication
Capacity not disclosed in selected sourceReviewed 2026-08-26Source ↗
COMPANY ANNOUNCEMENTS
From the company
- TSMC reports September and year-to-date 2026 revenueTSMC · Official announcement
- TSMC files August corporate and capital-appropriation reportTSMC · Official announcement
- TSMC reports August 2026 consolidated revenueTSMC · Official announcement
- Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image SensorsTSMC · Official announcement
Other publishers mentioning this company · 12
Text mentions are related reading, not announcements issued by this company or proof of a supplier relationship.
- TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of ChipsSemiWiki · 2026-09-11
- [News] Samsung Reportedly Eyes In-House Silicon Photonics PIC Testing by End-2026 with TSMC-Qualified ToolsTrendForce · 2026-09-08
- [News] ASML Japan to Boost Workforce 40% by 2030 to Support Rapidus, TSMC Advanced Chip PushTrendForce · 2026-09-04
- [News] U.S. Chip Tariffs Could Hinge on Investment Scale: What’s at Stake for TSMC, Samsung, SK hynix?TrendForce · 2026-09-04
RESEARCH PATH
Choose a question. Read the connected evidence.
What can we verify about AI memory and packaging supply?
Start with the industry context, then examine HBM and advanced-packaging disclosures.
- 01Industry contextAI infrastructure context
Identify the systems, investment categories and limits of available evidence.
- 02Reported historyReported HBM records
Check dated technology and production disclosures with each source's scope.
- 03Reported historyAdvanced-packaging records
Read packaging milestones and measurements alongside their original disclosures.
Infrastructure capex includes buildings, power and networking. These separate records do not prove a supply contract or customer allocation.
Read each source in context
Connections identify the same issuer or an explicitly named product/component. They are not an inferred supply chain. Figures keep their own currency, period, scope and source.
Open the company's official IR site ↗