VLSI KoreaRevenue
KRW 79.32TQ2 2026 consolidated
79,318,700 KRW millionIFRS · ConsolidatedPublished 2026-07-29 · SourceCONNECTED RESEARCH
See the company. Follow the evidence.
Bring quarterly results, product evidence, facilities and company announcements into one view. Then choose a research question to go deeper.
Memory · South Korea
SK hynix
KRX: 000660 · IR snapshot 2026-10-14
Operating margin
76%Q2 2026 consolidated
76 percentIFRS · ConsolidatedPublished 2026-07-29 · SourceEach section keeps its own date. Financial results, physical output, capacity and company schedules describe different things; the links below do not establish causation.
MANUFACTURING CONTEXT
Source-linked facilities
- UnknownIcheon M10
Icheon, South Korea · Memory semiconductor production or expansion site
Historical commissioning disclosure: 100,000 wafers per month three months after equipment installation; current operating state and capacity are not assertedReviewed 2026-08-28Source ↗ - UnknownIcheon M14
Icheon, South Korea · Memory semiconductor production or expansion site
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source ↗ - UnknownIcheon M16
Icheon, South Korea · Memory semiconductor production or expansion site
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source ↗ - UnknownCheongju M11
Cheongju, South Korea · Memory semiconductor production or expansion site
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source ↗
COMPANY ANNOUNCEMENTS
From the company
- [AI Ecosystem] The real bottleneck: Data, not computeSK hynix · Official announcement
- [AI Ecosystem] The real bottleneck: Data, not computeSK hynix · Official announcement
- [AI Infrastructure Insight] Why faster GPUs alone can’t deliver AI performanceSK hynix · Official announcement
- [AI Infrastructure Insight] Why faster GPUs alone can’t deliver AI performanceSK hynix · Official announcement
Other publishers mentioning this company · 6
Text mentions are related reading, not announcements issued by this company or proof of a supplier relationship.
- [News] The Race to 2028: Samsung, SK hynix Set High-NA EUV Timelines for DRAM as Micron Stays Tight-LippedTrendForce · 2026-09-09
- [News] U.S. Chip Tariffs Could Hinge on Investment Scale: What’s at Stake for TSMC, Samsung, SK hynix?TrendForce · 2026-09-04
- SK Hynix’s $4B HBM Project Targets U.S. Chipmaking GapEE Times · 2026-09-01
- [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, IntelTrendForce · 2026-06-30
RESEARCH PATH
Choose a question. Read the connected evidence.
What can we verify about AI memory and packaging supply?
Start with the industry context, then examine HBM and advanced-packaging disclosures.
- 01Industry contextAI infrastructure context
Identify the systems, investment categories and limits of available evidence.
- 02Reported historyReported HBM records
Check dated technology and production disclosures with each source's scope.
- 03Reported historyAdvanced-packaging records
Read packaging milestones and measurements alongside their original disclosures.
Infrastructure capex includes buildings, power and networking. These separate records do not prove a supply contract or customer allocation.
Read each source in context
Connections identify the same issuer or an explicitly named product/component. They are not an inferred supply chain. Figures keep their own currency, period, scope and source.
Open the company's official IR site ↗