VLSI KoreaRevenue
USD 6.72BQ4 FY2026
6,722.238 USD millionGAAP ยท ConsolidatedPublished 2026-08-07 ยท SourceCONNECTED RESEARCH
See the company. Follow the evidence.
Bring quarterly results, product evidence, facilities and company announcements into one view. Then choose a research question to go deeper.
Equipment ยท United States
Lam Research
NASDAQ: LRCX ยท IR snapshot 2026-10-14
Operating margin
37.4%Q4 FY2026
37.3906 percentGAAP ยท ConsolidatedPublished 2026-08-07 ยท SourceCapital expenditure
USD 188.8MQ4 FY2026
188.801 USD millionGAAP ยท ConsolidatedPublished 2026-08-07 ยท SourceEach section keeps its own date. Financial results, physical output, capacity and company schedules describe different things; the links below do not establish causation.
MANUFACTURING CONTEXT
Source-linked facilities
- UnknownLam Research Fremont
Fremont, California, United States ยท Headquarters, pilot manufacturing and labs
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source โ - UnknownLam Research Tualatin
Tualatin, Oregon, United States ยท Manufacturing and labs campus
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source โ - UnknownLam Research Livermore
Livermore, California, United States ยท Semiconductor equipment manufacturing, component or lab site
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source โ - UnknownLam Research Eaton
Eaton, Ohio, United States ยท Semiconductor equipment manufacturing, component or lab site
Facility-level capacity is not disclosed in the selected sourceReviewed 2026-08-28Source โ
SUPPLY CONTEXT
Capabilities & disclosures
Wafer-fabrication equipment supplier focused on etch, deposition, and clean.
- plasma etch systems
- deposition systems
- wafer cleaning systems
- advanced packaging systems
Capabilities describe what the company supplies; they do not establish a customer contract, production volume or market share.
Open full supply profileCOMPANY ANNOUNCEMENTS
From the company
- Lam Research Corporation Announces a 27% Increase in Quarterly DividendLam Research ยท Official announcement
- Lam Research Announces Retirement of Michael R. Cannon and Sohail U. Ahmed from Board of DirectorsLam Research ยท Official announcement
- Lam Research Corporation Announces Participation at Upcoming ConferencesLam Research ยท Official announcement
- Lam Research Breaks Ground on New Oregon Lab to Accelerate AI Era Semiconductor Research & Development Locally, GloballyLam Research ยท Official announcement
RESEARCH PATH
Choose a question. Read the connected evidence.
What can we verify about AI memory and packaging supply?
Start with the industry context, then examine HBM and advanced-packaging disclosures.
- 01Industry contextAI infrastructure context
Identify the systems, investment categories and limits of available evidence.
- 02Reported historyReported HBM records
Check dated technology and production disclosures with each source's scope.
- 03Reported historyAdvanced-packaging records
Read packaging milestones and measurements alongside their original disclosures.
Infrastructure capex includes buildings, power and networking. These separate records do not prove a supply contract or customer allocation.
Read each source in context
Connections identify the same issuer or an explicitly named product/component. They are not an inferred supply chain. Figures keep their own currency, period, scope and source.
Open the company's official IR site โ