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Stocks & financials5

Prices & forecasts6

Companies & capital5

Fabs & supply chain7

Products & industry8

News & research tools4

CONNECTED RESEARCH

See the company. Follow the evidence.

Bring quarterly results, product evidence, facilities and company announcements into one view. Then choose a research question to go deeper.

45 companies in the reviewed IR collection
Samsung ElectronicsSK hynixTSMCNVIDIAASML

Equipment ยท United States

Applied Materials

NASDAQ: AMAT ยท IR snapshot 2026-10-14

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Each section keeps its own date. Financial results, physical output, capacity and company schedules describe different things; the links below do not establish causation.

MANUFACTURING CONTEXT

Source-linked facilities

4 of 7 facility records
  • UnknownApplied Materials Santa Clara

    Santa Clara, California, United States ยท Semiconductor equipment manufacturing or R&D site

    Facility-level capacity is not disclosed in the selected source
    Reviewed 2026-08-28Source โ†—
  • UnknownApplied Materials Austin

    Austin, Texas, United States ยท Semiconductor equipment manufacturing or R&D site

    Facility-level capacity is not disclosed in the selected source
    Reviewed 2026-08-28Source โ†—
  • UnknownApplied Materials Gloucester

    Gloucester, Massachusetts, United States ยท Semiconductor equipment manufacturing or R&D site

    Facility-level capacity is not disclosed in the selected source
    Reviewed 2026-08-28Source โ†—
  • UnknownApplied Materials Kalispell

    Kalispell, Montana, United States ยท Semiconductor equipment manufacturing or R&D site

    Facility-level capacity is not disclosed in the selected source
    Reviewed 2026-08-28Source โ†—
Open the full facility directory

SUPPLY CONTEXT

Capabilities & disclosures

Broad wafer-fabrication equipment supplier across materials engineering and process control.

  • deposition systems
  • etch systems
  • CMP systems
  • ion implantation
  • inspection systems

Capabilities describe what the company supplies; they do not establish a customer contract, production volume or market share.

Applied Materials semiconductor products ยท 2026-08-06 โ†—
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RELATED READING

Text mentions are related reading, not announcements issued by this company or proof of a supplier relationship.

Open the newsroom

RESEARCH PATH

Choose a question. Read the connected evidence.

What can we verify about AI memory and packaging supply?

Start with the industry context, then examine HBM and advanced-packaging disclosures.

  1. 01
    Industry contextAI infrastructure context

    Identify the systems, investment categories and limits of available evidence.

  2. 02
    Reported historyReported HBM records

    Check dated technology and production disclosures with each source's scope.

  3. 03
    Reported historyAdvanced-packaging records

    Read packaging milestones and measurements alongside their original disclosures.

Infrastructure capex includes buildings, power and networking. These separate records do not prove a supply contract or customer allocation.

Related comparison setNVIDIATSMCOpen comparison

Read each source in context

Connections identify the same issuer or an explicitly named product/component. They are not an inferred supply chain. Figures keep their own currency, period, scope and source.

Open the company's official IR site โ†—