Explore product prices, forecasts, foundry customers and manufacturing mix. Inspect reported facts, reproducible calculations and explicit model assumptions.
ASTRIA research release · 2026-09-09
150Product & quote identities
49Dated numeric references
4 + 8Forecast series + density scenarios
15Foundry–product evidence records
Research and estimates by VLSI ASTRIA: AI-assisted public-source research, reproducible statistical models and explicit assumptions. Original publisher facts remain separately attributed. Forecasts are experimental.
Company-specific revenue shares, physical capacity shares and area-equivalent shares use different denominators. Node names also differ by foundry and do not identify equal process capability.
Q2 2026 · revenue composition, not wafer-count or capacity shares
Foundry
Metric
Segment
Share
Denominator / source
TSMC
Process-node revenue mix
2nm
3.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
3nm
30.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
5nm
33.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
7nm
11.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
16/20nm
6.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
28nm
6.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
40/45nm
2.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
65nm
4.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
90nm–0.13µm
2.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
TSMC
Process-node revenue mix
≥0.15µm
3.0%
percent of wafer revenuePublished 2026-07-16 · Issuer source ↗
UMC
Process-node revenue mix
14nm and below
0.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>14nm to 28nm
37.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>28nm to 40nm
15.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>40nm to 65nm
18.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>65nm to 90nm
7.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>90nm to 0.13µm
8.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>0.13µm to 0.18µm
10.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
>0.18µm to 0.35µm
4.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
UMC
Process-node revenue mix
0.5µm and above
1.0%
percent of wafer revenuePublished 2026-07-29 · Issuer source ↗
SMIC
Wafer-diameter revenue mix
8-inch wafers
21.8%
percent of wafer revenuePublished 2026-08-13 · Issuer source ↗
SMIC
Wafer-diameter revenue mix
12-inch wafers
78.2%
percent of wafer revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Wafer-diameter revenue mix
8-inch wafers
37.9%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Wafer-diameter revenue mix
12-inch wafers
62.1%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
65nm and below
28.6%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
90nm and 95nm
24.3%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
0.11µm and 0.13µm
10.9%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
0.15µm and 0.18µm
5.3%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
0.25µm
0.3%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
Hua Hong Grace
Process-node revenue mix
0.35µm and above
30.6%
percent of total revenuePublished 2026-08-13 · Issuer source ↗
UMC physical wafer capacity by diameter
derived
All 12 production fabs listed in the FY2025 Form 20-F table, including Wavetek 150mm · As of December 31, 2025 · Estimated full capacity.
Complete 12-fab denominator · physical wafer capacity per month
Diameter
Wafers / month
Physical-count share
Area-equivalent share
150mm
26,564
4.03%
1.53%
200mm
367,750
55.80%
37.59%
300mm
264,753
40.17%
60.89%
This is estimated full capacity, not actual wafer starts, output, shipments, utilization, revenue, or customer allocation. Area equivalence measures wafer surface area only. It does not normalize process complexity, layer count, yield, die size, ASP, or value. The filing identifies all rows as production fabs, but all calculated claims retain the table's 2025 fab-capacity scope and cannot be generalized to market capacity. UMC FY2025 Form 20-F ↗
Enter relative average selling prices per physical wafer for every segment. For example, a ratio of 2 means twice the wafer price of a segment assigned 1. Values are your assumptions, not disclosed foundry prices.
Assumed relative wafer ASP · all segments required