MarketVLSI ASTRIA / FOUNDRY INVESTOR DESK
Foundry earnings & manufacturing mix
United Microelectronics Corporation · Pure-play company total
Native NTD revenue, process mix, utilization, and shipment growth disclosed. Official investor materials ↗
Financial & operating statements
Native currency and issuer-reported wafer basis. Margin changes are percentage points (pp); other changes use comparable positive prior-period values. † Calculated from issuer statements; calculation details are in the downloadable data.
| Metric / Unit | 2026-Q2 | 2026-Q1 | 2025-Q2 | QoQ | YoY | Evidence |
|---|---|---|---|---|---|---|
| Consolidated revenueNTD billion · Company-reported; US$2.18B disclosed translation | 68.73 | 61.04 | — | +12.6 % | — | Issuer filing ↗ |
| Capacity utilizationpercent · Company-defined quarterly capacity utilization | 85 | — | — | — | — | Issuer filing ↗ |
| Wafer shipment growthpercent QoQ · Issuer disclosed growth only; not a shipment count | 10.6 | — | — | — | — | Issuer filing ↗ |
| Gross marginpercent · Consolidated company | 32.5 | — | — | — | — | Issuer filing ↗ |
| Operating marginpercent · Consolidated company | 21.8 | — | — | — | — | Issuer filing ↗ |
| Net income attributable to shareholders of the parentNTD billion · Attributable net income | 42.26 | — | — | — | — | Issuer filing ↗ |
| Earnings per shareNTD per ordinary share · Issuer reported EPS | 3.39 | — | — | — | — | Issuer filing ↗ |
Revenue by technology
Revenue by platform
Platform or end-market revenue shares are not separately disclosed for this foundry and period.
Platform growth (QoQ)
Platform growth rates are not separately disclosed for this period.
Revenue history
Gross margin history
Comparable historical observations have not been disclosed or verified for this series.
Wafer diameter revenue mix
Revenue share by wafer diameter is not disclosed. Revenue mix, physical wafer count and wafer-area capacity are different measures.
Revenue composition data
| Dimension / Category | Revenue share | Growth QoQ | Source |
|---|---|---|---|
| >14nm to 28nmnode · Share of wafer revenue. | 37% | — | Issuer filing ↗ |
| 14nm and belownode · Share of wafer revenue; issuer-disclosed zero. | 0% | — | Issuer filing ↗ |
| >28nm to 40nmnode · Share of wafer revenue. | 15% | — | Issuer filing ↗ |
| >40nm to 65nmnode · Share of wafer revenue. | 18% | — | Issuer filing ↗ |
| >65nm to 90nmnode · Share of wafer revenue. | 7% | — | Issuer filing ↗ |
| >90nm to 0.13µmnode · Share of wafer revenue. | 8% | — | Issuer filing ↗ |
| >0.13µm to 0.18µmnode · Share of wafer revenue. | 10% | — | Issuer filing ↗ |
| >0.18µm to 0.35µmnode · Share of wafer revenue. | 4% | — | Issuer filing ↗ |
| 0.5µm and abovenode · Share of wafer revenue. | 1% | — | Issuer filing ↗ |
Open source-linked foundry facilities
Explore customer products and wafer-mix estimates
GLOBAL FOUNDRY MONITOR
The manufacturing layer, scope intact.
Latest official monthly and quarterly results sit above the FY2025 annual baseline across eight major foundries. Pure-play revenue, internal manufacturing segments, wafer shipments, utilization, capacity, and node mix remain separate.
Data throughAug 17, 2026 issuer filings · Jul 2026 monthly sales · complete disclosed TSMC and UMC Q2 2026 process-node revenue buckets · Q2 and H1 2026 actuals and Q3 guidance · FY2025 annual baseline
Last checked24 Aug 2026
Last changed30 Aug 2026
Dataset vintage2026.08.30-foundry-10
Validated snapshotreportedIssuer filing
SMIC Q2 2026 revenueUS$3,005.588M+20.0% QoQ · +36.1% YoYGross margin was 25.3%, shipments were 2,869,495 standard-logic 8-inch-equivalent wafers, and utilization was 93.7%. Q3 revenue-growth and margin ranges remain separate guidance records.
reportedIssuer filing
Hua Hong Grace Q2 2026 revenueUS$717.537M+8.6% QoQ · +26.8% YoYGross margin was 16.5%, shipments were 1.538M 8-inch-equivalent wafers, and utilization was 102.8%. Q3 revenue and margin ranges remain separate guidance records.
reportedIssuer filing
TSMC July 2026 net revenueNT$467.580B+44.7% YoYJanuary–July net revenue was NT$2,872.064B, up 37.0% YoY; the monthly and year-to-date observations remain separate, unaudited, and unallocated to products or customers.
reportedIssuer filing
UMC July 2026 net salesNT$23.844B+18.98% YoYJanuary–July net sales were NT$153.615B, up 12.41% YoY; the monthly and year-to-date observations remain separate and are not annualized.
Foundry relationship ledger
Officially disclosed customer, collaborator, and internal-product relationships. A partnership is never promoted into an undisclosed production design win.
TSMC → Sony Semiconductor Solutionsjoint venture definitive agreementReported
- Product
- Next-generation smartphone image sensors
- Scope
- external counterparty
- Status
- definitive agreement conditional
- Supported claim
- Sony and TSMC executed a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation in Koshi City, Kumamoto Prefecture.
- Sony is planned to be the sole controlling shareholder; TSMC plans approximately JPY282B of cash contributions and Sony approximately JPY465B through cash and transferred assets, phased based on demand and business conditions.
- The joint venture expects 2029 volume production, subject to regulatory approvals and customary closing conditions.
- Not disclosed
- process node · wafer volume · installed capacity · customer allocation · unit shipments · revenue · Japanese-government support amount
- Evidence
- Official disclosure · confirmed 11 Aug 2026 · official filing
Samsung Foundry → Tesla, Inc.contract manufacturing agreementReported
- Product
- Not disclosed
- Scope
- external counterparty
- Status
- contract effective
- Supported claim
- Samsung Electronics disclosed a semiconductor contract-manufacturing supply agreement with Tesla.
- The disclosed contract value is KRW 22,764,764,160,000 for the effective period from July 24, 2025 through December 31, 2033.
- Not disclosed
- product · process node · fab · package · wafer volume · production status · realized revenue
- Evidence
- Official disclosure · confirmed 31 Jul 2025 · official filing
Intel Foundry → Fortinetstrategic co developmentReported
- Product
- Fortinet Security Processor 6
- Scope
- external counterparty
- Status
- collaboration announced
- Supported claim
- Intel disclosed a strategic collaboration with Fortinet to develop Fortinet Security Processor 6.
- The disclosure identifies Intel design, packaging, and manufacturing capabilities as part of the collaboration.
- Not disclosed
- process node · fab · package · wafer volume · contract value · tape-out date · production status
- Evidence
- Official disclosure · confirmed 23 Jul 2026 · official filing
Intel Foundry → Intel Productsinternal manufacturingReported
- Product
- Intel Core Ultra Series 3 · Panther Lake subset
- Scope
- internal product
- Status
- subset high volume manufacturing
- Supported claim
- Intel Foundry disclosed high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors code-named Panther Lake.
- The disclosed manufacturing relationship is internal to Intel rather than an external foundry customer design win.
- Not disclosed
- full product coverage · wafer volume · yield · fab · customer revenue · external-customer allocation
- Evidence
- Official disclosure · confirmed 23 Jul 2026 · official filing
| Foundry | Counterparty | Product | Relationship & status | Supported claim | Not disclosed | Source |
|---|---|---|---|---|---|---|
| TSMCexternal counterparty | Sony Semiconductor Solutionsjoint-venture controlling shareholder | Next-generation smartphone image sensors | joint venture definitive agreementdefinitive agreement conditional | Sony and TSMC executed a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation in Koshi City, Kumamoto Prefecture.Sony is planned to be the sole controlling shareholder; TSMC plans approximately JPY282B of cash contributions and Sony approximately JPY465B through cash and transferred assets, phased based on demand and business conditions.The joint venture expects 2029 volume production, subject to regulatory approvals and customary closing conditions. | process node · wafer volume · installed capacity · customer allocation · unit shipments · revenue · Japanese-government support amountThe definitive agreement does not establish current production, capacity, shipments, revenue, market share, or a process node. The 2029 volume-production date is planned, contributions are phased, closing remains conditional, and Japanese-government support is contemplated without a disclosed amount. | Official disclosureConfirmed 11 Aug 2026 · official filing |
| Samsung Foundryexternal counterparty | Tesla, Inc.customer | Not disclosedProduct remains confidential. | contract manufacturing agreementcontract effective | Samsung Electronics disclosed a semiconductor contract-manufacturing supply agreement with Tesla.The disclosed contract value is KRW 22,764,764,160,000 for the effective period from July 24, 2025 through December 31, 2033. | product · process node · fab · package · wafer volume · production status · realized revenueThe agreement value is a multi-year contractual amount, not annual revenue, realized sales, backlog, shipment volume, or proof of production. Samsung states that key terms remain confidential and may change or terminate. | Official disclosureConfirmed 31 Jul 2025 · official filing |
| Intel Foundryexternal counterparty | Fortinetstrategic collaborator | Fortinet Security Processor 6Open ASIC class | strategic co developmentcollaboration announced | Intel disclosed a strategic collaboration with Fortinet to develop Fortinet Security Processor 6.The disclosure identifies Intel design, packaging, and manufacturing capabilities as part of the collaboration. | process node · fab · package · wafer volume · contract value · tape-out date · production statusA strategic collaboration is not a confirmed manufacturing order, revenue observation, production shipment, or market-share claim. The source does not identify a node, fab, package, volume, value, or lifecycle stage beyond the announced collaboration. | Official disclosureConfirmed 23 Jul 2026 · official filing |
| Intel Foundryinternal product | Intel Productsinternal product group | Intel Core Ultra Series 3 · Panther Lake subsetOpen CPU class | internal manufacturingsubset high volume manufacturing | Intel Foundry disclosed high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors code-named Panther Lake.The disclosed manufacturing relationship is internal to Intel rather than an external foundry customer design win. | full product coverage · wafer volume · yield · fab · customer revenue · external-customer allocationThe high-volume-manufacturing statement applies only to a subset of Panther Lake. It must not be generalized to every Core Ultra Series 3 processor or presented as an external foundry customer win. | Official disclosureConfirmed 23 Jul 2026 · official filing |
Capital and partnership events
Approval and planned-contribution events remain separate from fiscal-period results.
| Company | Event date | Metric | Native value | Scope & status | Source |
|---|---|---|---|---|---|
| TSMCPublished 11 Aug 2026 | Aug 11, 2026Issuer event date | Board-approved capital appropriations | Approx. US$29,442.50MUSD million | Board-approved aggregate investment programApproved mainly for advanced-technology capacity, advanced packaging and mature/specialty capacity, fab construction, and fab facility systems. This is an approved appropriation, not realized cash spend, physical capacity, shipments, revenue, or a product allocation.approved | Official disclosure |
| TSMCPublished 11 Aug 2026 | Aug 11, 2026 agreementIssuer event date | Planned cash contribution to Sony image-sensor JV | Approx. JPY282BJPY billion | TSMC planned cash contribution · phased and conditionalThe definitive agreement states that contributions are expected in phases based on market demand and other business conditions, with closing subject to regulatory approvals and customary conditions. Sony separately plans approximately JPY465B of cash and transferred assets; Japanese-government support is contemplated but no amount is disclosed.planned | Official disclosure |
Latest official issuer disclosures
Monthly, year-to-date, quarterly, and guidance grains remain separate in native units and issuer scopes.
| Company | Period | Metric | Reported value | Scope & status | Source |
|---|---|---|---|---|---|
| TSMCPublished 10 Aug 2026 | Jul 2026Issuer fiscal label | Monthly consolidated net revenue | NT$467,580M · +44.7% YoYNTD million | Consolidated company net revenue · single monthOfficial unaudited July observation in the issuer's native monthly unit; it is not annualized, converted into market share, or allocated to a process, customer, product, or geography.reported | Official result |
| TSMCPublished 10 Aug 2026 | Jan–Jul 2026Issuer fiscal label | Cumulative consolidated net revenue | NT$2,872,064M · +37.0% YoYNTD million | Consolidated company net revenue · year to dateIssuer-reported January–July cumulative revenue; this year-to-date total is distinct from July, remains unaudited, and is not treated as an annual result.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Net revenue | US$40.20B / NT$1,270.38BUSD billion | Pure-play company totalBoth currency values are company-reported; no annualization or FX conversion is applied.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Gross margin | 67.7%percent | Consolidated company marginActual quarter, not Q3 guidance.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Wafer shipments | 4,336 Kpcs · 12-inch equivalentthousand 12-inch-equivalent wafers | Company-reported quarterly shipment basis+3.9% QoQ and +16.6% YoY; the native 12-inch-equivalent basis is not converted.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | Operating margin | 60.3%percent | Consolidated company marginActual quarter, not Q3 guidance.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 2nm share of wafer revenue | 3%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 3nm share of wafer revenue | 30%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 5nm share of wafer revenue | 33%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 7nm share of wafer revenue | 11%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 16/20nm share of wafer revenue | 6%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 28nm share of wafer revenue | 6%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 40/45nm share of wafer revenue | 2%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 65nm share of wafer revenue | 4%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | 90nm–0.13µm share of wafer revenue | 2%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| TSMCPublished 16 Jul 2026 | Q2 2026Issuer fiscal label | ≥0.15µm share of wafer revenue | 3%percent of wafer revenue | TSMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| Intel FoundryPublished 23 Jul 2026 | Q2 2026Issuer fiscal label | Foundry segment revenue | US$5.8B · +31% YoYUSD billion | Operating segment including intersegment transactionsThe segment total is intersegment-inclusive and does not enter the pure-play revenue comparison.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Consolidated revenue | NT$68.73B / US$2.18BNTD billion | Pure-play company totalThe NT dollar value is primary; U.S. dollars are the company's disclosed translation.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | 14nm and below share of wafer revenue | 0%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >14nm to 28nm share of wafer revenue | 37%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >28nm to 40nm share of wafer revenue | 15%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >40nm to 65nm share of wafer revenue | 18%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >65nm to 90nm share of wafer revenue | 7%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >90nm to 0.13µm share of wafer revenue | 8%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >0.13µm to 0.18µm share of wafer revenue | 10%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | >0.18µm to 0.35µm share of wafer revenue | 4%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | 0.5µm and above share of wafer revenue | 1%percent of wafer revenue | UMC process-node revenue mix · denominator: wafer revenueIssuer-disclosed Q2 process-node share within wafer revenue; this company-specific composition is not cross-company foundry market share, capacity mix, shipment mix, or physical wafer volume.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Capacity utilization | 85%percent | Company-defined quarterly capacity utilizationQ3 90%+ is guidance and is not stored as this actual observation.reported | Official result |
| UMCPublished 29 Jul 2026 | Q2 2026Issuer fiscal label | Wafer shipment growth | +10.6% QoQpercent quarter over quarter | Company-reported wafer shipment changeGrowth rate only; no absolute quarterly wafer count is inferred.reported | Official result |
| UMCPublished 29 Jul 2026 | FY2026 planIssuer fiscal label | Capital expenditure budget | US$2.0BUSD billion | Revised company capex planBudget guidance, not Q2 cash capex or realized capacity.guidance | Official result |
| UMCPublished 6 Aug 2026 | Jul 2026Issuer fiscal label | Monthly net sales | NT$23,844,045 thousand · +18.98% YoYNTD thousand | Consolidated company net sales · single monthOfficial July observation in the issuer's native monthly unit; it is not annualized or converted into market share.reported | Official result |
| UMCPublished 6 Aug 2026 | Jan–Jul 2026Issuer fiscal label | Cumulative net sales | NT$153,614,609 thousand · +12.41% YoYNTD thousand | Consolidated company net sales · year to dateIssuer-reported January–July cumulative sales; this year-to-date total is distinct from July and is not treated as an annual result.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Revenue | US$3,005.588M · +20.0% QoQ · +36.1% YoYUSD million | Consolidated IFRS company revenue · actual quarterActual quarter in the filing's USD-million presentation; it is not annualized, allocated to products, or converted into foundry market share.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Gross profit | US$760.640MUSD million | Consolidated IFRS gross profit · actual quarterActual Q2 gross profit; this profit measure remains separate from revenue, guidance, shipments, capacity, and capex.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Gross margin | 25.3%percent | Consolidated IFRS gross margin · actual quarterActual Q2 margin; Q3 gross-margin guidance is stored as a separate forward-looking record.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Profit attributable to owners | US$479.197MUSD million | Consolidated IFRS profit attributable to owners of the company · actual quarterActual Q2 profit attributable to owners; it remains distinct from gross profit, operating profit, revenue, and forward guidance.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Wafer shipments | 2,869,495 · standard-logic 8-inch equivalentstandard-logic 8-inch-equivalent wafers | Company-reported quarterly shipment basis+14.4% QoQ and +20.1% YoY. The native standard-logic 8-inch-equivalent basis is not converted into die output, wafer starts, or market share.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Utilization rate | 93.7%percent | Total wafers out divided by estimated total quarterly capacityCompany-defined actual-quarter utilization; it is not physical output, installed capacity, or a supply forecast.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026 period endIssuer fiscal label | Period-end monthly capacity | 1,096,500 per month · standard-logic 8-inch equivalentstandard-logic 8-inch-equivalent wafers per month | Monthly capacity at the end of Q2 2026Period-end monthly capacity is not quarterly capacity, shipments, wafer starts, utilization, or annualized output.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Capital expenditure | US$1,835.7MUSD million | Company-reported actual quarterly capital expenditureActual Q2 capital expenditure; it is not a future budget, installed capacity, shipments, customer allocation, or revenue.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | China share of total revenue | 90.2%percent of total revenue | SMIC geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | America share of total revenue | 8.2%percent of total revenue | SMIC geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Eurasia share of total revenue | 1.6%percent of total revenue | SMIC geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Wafers share of total revenue | 94.6%percent of total revenue | SMIC service type mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Other services share of total revenue | 5.4%percent of total revenue | SMIC service type mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Smartphone share of wafer revenue | 16.9%percent of wafer revenue | SMIC application mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Computer and tablet share of wafer revenue | 15.6%percent of wafer revenue | SMIC application mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Consumer electronics share of wafer revenue | 44.2%percent of wafer revenue | SMIC application mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Connectivity and IoT share of wafer revenue | 6.8%percent of wafer revenue | SMIC application mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Industrial and automotive share of wafer revenue | 16.5%percent of wafer revenue | SMIC application mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 8-inch wafers share of wafer revenue | 21.8%percent of wafer revenue | SMIC wafer size mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 12-inch wafers share of wafer revenue | 78.2%percent of wafer revenue | SMIC wafer size mix · denominator: wafer revenueIssuer-disclosed Q2 composition within wafer revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| SMICPublished 13 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Revenue growth guidance | +2% to +4% QoQpercent quarter over quarter midpoint | Company IFRS revenue guidance rangeThe numeric value is the derived midpoint of the disclosed range for machine use; the 2% lower bound and 4% upper bound remain visible. This is forward guidance, not reported Q3 revenue.guidance | Official result |
| SMICPublished 13 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Gross margin guidance midpoint | 26% to 28%percent midpoint | Company IFRS gross-margin guidance rangeThe numeric value is the derived midpoint of the disclosed range for machine use; the 26% lower bound and 28% upper bound remain visible. This is forward guidance, not an actual margin.guidance | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Revenue | US$717.537M · +8.6% QoQ · +26.8% YoYUSD million | Consolidated specialty-foundry company revenue · actual quarterActual unaudited quarter in the filing's USD-million presentation; it is not annualized or converted into foundry market share.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Gross profit | US$118.404MUSD million | Consolidated gross profit · actual quarterActual Q2 gross profit; this profit measure remains separate from revenue, guidance, shipments, capacity, and utilization.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Gross margin | 16.5%percent | Consolidated gross margin · actual quarterActual Q2 margin; Q3 gross-margin guidance is stored as a separate forward-looking record.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Net profit attributable to owners of the parent | US$38.639MUSD million | Consolidated net profit attributable to owners of the parent · actual quarterActual Q2 net profit attributable to owners of the parent; it remains distinct from gross profit, revenue, and forward guidance.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Wafer shipments | 1,538K · 8-inch equivalentthousand 8-inch-equivalent wafers | Company-reported quarterly shipment basis+5.8% QoQ and +17.9% YoY. The native 8-inch-equivalent basis is not converted into die output, wafer starts, or market share.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Capacity utilization | 102.8%percent | Average monthly equivalent wafer output divided by estimated monthly capacityThe company-defined actual-quarter rate can exceed 100%; it is not physical output, installed capacity, or a supply forecast.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026 period endIssuer fiscal label | Period-end monthly capacity | 508K per month · 8-inch equivalentthousand 8-inch-equivalent wafers per month | Monthly capacity at the end of Q2 2026Period-end monthly capacity is not quarterly capacity, shipments, wafer starts, utilization, or annualized output.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Wafers share of total revenue | 96.5%percent of total revenue | Hua Hong Grace service type mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Other services share of total revenue | 3.5%percent of total revenue | Hua Hong Grace service type mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 8-inch wafers share of total revenue | 37.9%percent of total revenue | Hua Hong Grace wafer size mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 12-inch wafers share of total revenue | 62.1%percent of total revenue | Hua Hong Grace wafer size mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | China share of total revenue | 78.6%percent of total revenue | Hua Hong Grace geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | North America share of total revenue | 13.1%percent of total revenue | Hua Hong Grace geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Other Asia share of total revenue | 4.4%percent of total revenue | Hua Hong Grace geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Europe share of total revenue | 3.9%percent of total revenue | Hua Hong Grace geography mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Embedded NVM share of total revenue | 27.9%percent of total revenue | Hua Hong Grace technology platform mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Standalone NVM share of total revenue | 9.6%percent of total revenue | Hua Hong Grace technology platform mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Power discrete share of total revenue | 25.4%percent of total revenue | Hua Hong Grace technology platform mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Logic and RF share of total revenue | 11.6%percent of total revenue | Hua Hong Grace technology platform mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Analog and power management share of total revenue | 25.5%percent of total revenue | Hua Hong Grace technology platform mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 65nm and below share of total revenue | 28.6%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 90nm and 95nm share of total revenue | 24.3%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 0.11µm and 0.13µm share of total revenue | 10.9%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 0.15µm and 0.18µm share of total revenue | 5.3%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 0.25µm share of total revenue | 0.3%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | 0.35µm and above share of total revenue | 30.6%percent of total revenue | Hua Hong Grace process technology node mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Consumer electronics share of total revenue | 67.1%percent of total revenue | Hua Hong Grace end market mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Industrial and automotive share of total revenue | 22.6%percent of total revenue | Hua Hong Grace end market mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Communications share of total revenue | 8.7%percent of total revenue | Hua Hong Grace end market mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q2 2026Issuer fiscal label | Computing share of total revenue | 1.6%percent of total revenue | Hua Hong Grace end market mix · denominator: total revenueIssuer-disclosed Q2 composition within total revenue; this is not cross-company market share, physical shipment mix, capacity mix, or a product-sales estimate.reported | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Revenue guidance midpoint | US$770M to US$780MUSD million midpoint | Company revenue guidance rangeThe numeric value is the derived US$775M midpoint of the disclosed range for machine use; the US$770M lower bound and US$780M upper bound remain visible. This is forward guidance, not reported Q3 revenue.guidance | Official result |
| Hua Hong GracePublished 13 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Gross margin guidance midpoint | 16% to 18%percent midpoint | Company gross-margin guidance rangeThe numeric value is the derived midpoint of the disclosed range for machine use; the 16% lower bound and 18% upper bound remain visible. This is forward guidance, not an actual margin.guidance | Official result |
| GlobalFoundriesPublished 5 Aug 2026 | Q2 2026Issuer fiscal label | Net revenue | US$1.786BUSD billion | Pure-play company totalActual quarter in the issuer's reported currency; it is not annualized or converted into market share.reported | Official result |
| GlobalFoundriesPublished 5 Aug 2026 | Q2 2026Issuer fiscal label | Gross margin | 28.3%percent | Consolidated IFRS gross marginActual IFRS quarter, kept separate from the company's non-IFRS margin and forward guidance.reported | Official result |
| GlobalFoundriesPublished 5 Aug 2026 | Q2 2026Issuer fiscal label | Wafer shipments | 625K · 300mm equivalentthousand 300mm-equivalent wafers | Company-reported quarterly shipment basisActual quarterly shipments on the issuer's native 300mm-equivalent basis; no capacity or market share is inferred.reported | Official result |
| TowerPublished 4 Aug 2026 | Q2 2026Issuer fiscal label | Consolidated revenue | US$460MUSD billion | Pure-play specialty-foundry company totalActual quarter rounded in the Aug. 4 earnings release; +24% year over year. The later Aug. 17 interim filing supplies exact USD-thousand precision without creating a second Q2 sale. It is not annualized or converted into market share.reported | Official result |
| TowerPublished 4 Aug 2026 | Q2 2026Issuer fiscal label | Gross profit | US$138MUSD billion | Consolidated GAAP gross profitActual quarter rounded in the Aug. 4 earnings release; the later Aug. 17 interim filing supplies exact USD-thousand precision without creating a second Q2 profit. The value is a profit measure, not revenue, shipment volume, or capacity.reported | Official result |
| TowerPublished 17 Aug 2026 | Q2 2026Issuer fiscal label | Consolidated revenue | US$460.079MUSD thousand | Consolidated company total · three months ended Jun. 30, 2026Exact unaudited filed-statement value. This is the same Q2 economic observation as the rounded US$460M Aug. 4 earnings-release record, not additional revenue, a restatement, or a second sale.reported | Official result |
| TowerPublished 17 Aug 2026 | Q2 2026Issuer fiscal label | Gross profit | US$137.772MUSD thousand | Consolidated company gross profit · three months ended Jun. 30, 2026Exact unaudited filed-statement value. This is the same Q2 economic observation as the rounded US$138M Aug. 4 earnings-release record and remains a profit measure, not sales, shipments, or capacity.reported | Official result |
| TowerPublished 17 Aug 2026 | Q2 2026Issuer fiscal label | Operating profit | US$90.290MUSD thousand | Consolidated company operating profit · three months ended Jun. 30, 2026Exact unaudited filed-statement value; it is a Q2 operating-profit observation, not revenue, shipment volume, capacity, or guidance.reported | Official result |
| TowerPublished 17 Aug 2026 | Q2 2026Issuer fiscal label | Net profit attributable to the company | US$90.769MUSD thousand | Net profit attributable to the company · three months ended Jun. 30, 2026Exact unaudited filed-statement value; attributable net profit remains distinct from gross profit, operating profit, revenue, and noncontrolling interests.reported | Official result |
| TowerPublished 17 Aug 2026 | H1 2026Issuer fiscal label | Consolidated revenue | US$873.710MUSD thousand | Consolidated company total · six months ended Jun. 30, 2026Exact unaudited six-month cumulative value. H1 is a year-to-date period and is not added to Q2, annualized, or treated as a separate quarter.reported | Official result |
| TowerPublished 17 Aug 2026 | H1 2026Issuer fiscal label | Gross profit | US$248.723MUSD thousand | Consolidated company gross profit · six months ended Jun. 30, 2026Exact unaudited six-month cumulative value; it remains a profit measure and is not a quarter, sale, shipment, or capacity observation.reported | Official result |
| TowerPublished 17 Aug 2026 | H1 2026Issuer fiscal label | Operating profit | US$154.855MUSD thousand | Consolidated company operating profit · six months ended Jun. 30, 2026Exact unaudited six-month cumulative value; it remains distinct from gross profit, attributable net profit, revenue, and guidance.reported | Official result |
| TowerPublished 17 Aug 2026 | H1 2026Issuer fiscal label | Net profit attributable to the company | US$155.801MUSD thousand | Net profit attributable to the company · six months ended Jun. 30, 2026Exact unaudited six-month cumulative attributable-net-profit value; it is not revenue, realized cash flow, shipment volume, or capacity.reported | Official result |
| TowerPublished 4 Aug 2026 | Q3 2026 guidanceIssuer fiscal label | Revenue guidance midpoint | US$520M ±5%USD billion | Company revenue guidanceForward guidance is retained separately from the Q2 actual and is not treated as a reported sale.guidance | Official result |
FY2025 pure-play company revenue
Official company totals in U.S. dollars; this is not a market-share table.
INTEL FOUNDRYScope alert
US$17.826Bsegment total · substantially intersegmentUS$0.307Bexternal foundry + assembly/test subset
Intel’s segment total does not enter the pure-play comparison. The external subset also combines foundry with assembly and test.
Issuer annual filingSAMSUNG FOUNDRYNot disclosed
Standalone revenue: NDFoundry sits inside Device Solutions reporting.No residual from Samsung’s combined non-memory businesses is presented as foundry revenue. Technology and disclosed contract facts remain available separately.
Issuer FY2025 resultWhy no “public market share”?
A complete licensed denominator is not available from these filings. A partial cohort would reward broader reporting scope, not necessarily foundry demand.
FY2025 wafer shipments
Area-normalized to 12-inch equivalents; native disclosures stay visible below.
TSMC advanced-node mix
Share of wafer revenue at 7nm and below; company-specific definition.
| Company | FY2025 revenue | YoY | Wafer shipments | Operating disclosure | Source |
|---|---|---|---|---|---|
| TSMCTaiwan · pure-play foundry | US$122.42BPure-play company total | +35.9%reported | 15.0M 12-inch-equivalent wafersreported | ≤7nm share of wafer revenue: 74%FY2025 · Up from 69% in 2024; 3nm alone represented 24% of wafer revenue.Annual manufacturing capacity: >17.0MFY2025 · 12-inch-equivalent wafers; annual capacity exceeded 17 million. | Issuer filing |
| Samsung FoundryRepublic of Korea · integrated device manufacturer | Not separately disclosedSamsung publishes Device Solutions totals and Foundry commentary, but no standalone Foundry revenue value. | ND | Not disclosedNo complete comparable FY2025 observation. | Disclosed long-term contract value: KRW 22.765T2025–2033 · Tesla semiconductor contract-manufacturing agreement (US$16.544B disclosure translation); this 2025–2033 total is not annual or realized revenue, and key terms remain confidential. | Issuer filing |
| Intel FoundryUnited States · integrated device manufacturer | US$17.83BSegment total · mostly intersegment | +2.9%derived | Not disclosedNo complete comparable FY2025 observation. | Third-party external revenue: US$0.307BFY2025 · External foundry and assembly/test revenue, separate from the US$17.826B segment total. | Issuer filing |
| SMICChina · pure-play foundry | US$9.327BPure-play company total | +16.2%reported | 9.697M 8-inch-equivalent wafersderived | Year-end monthly capacity: 1.059MDec 2025 · Standard-logic 8-inch-equivalent wafers per month.Annualized utilization: 93.5%FY2025 · Company-defined annualized capacity utilization rate. | Issuer filing |
| UMCTaiwan · pure-play foundry | US$7.573BPure-play company total | +5.3%reported | 3.870M 12-inch-equivalent wafersderived | Capacity utilization: 78%Q4 2025 · Quarterly wafer out divided by estimated quarterly capacity.Annual calculated max capacity: 5.163MFY2025 · 12-inch-equivalent wafers; calculated maximum output, not designed capacity. | Issuer filing |
| GlobalFoundriesUnited States · pure-play foundry | US$6.791BPure-play company total | +1.0%reported | 2.345M 300mm-equivalent wafersreported | Average shipment utilization: 86%FY2025 · Company-defined average shipment utilization; numeric production capacity is not disclosed. | Issuer filing |
| Hua Hong GraceChina · pure-play foundry | US$2.402BPure-play company total | +5.1%derived | 5.384M 8-inch-equivalent wafersderived | Capacity utilization: 106.1%FY2025 · Can exceed 100% under the company's practical-output definition; year-end monthly capacity was 486K 8-inch equivalents. | Issuer filing |
| TowerIsrael · pure-play foundry | US$1.566BPure-play company total | +9.0%reported | Not disclosedNo complete comparable FY2025 observation. | Not disclosed | Issuer filing |
Issuer-disclosed process mix
25 numeric process rows across 3 of 8 foundries. Each company keeps its own disclosed denominator.
2nm3%
3nm30%
5nm33%
7nm11%
16/20nm6%
28nm6%
40/45nm2%
65nm4%
90nm–0.13µm2%
≥0.15µm3%
14nm and below0%
>14nm to 28nm37%
>28nm to 40nm15%
>40nm to 65nm18%
>65nm to 90nm7%
>90nm to 0.13µm8%
>0.13µm to 0.18µm10%
>0.18µm to 0.35µm4%
0.5µm and above1%
65nm and below28.6%
90nm and 95nm24.3%
0.11µm and 0.13µm10.9%
0.15µm and 0.18µm5.3%
0.25µm0.3%
0.35µm and above30.6%
Numeric process mix not disclosed: Samsung Foundry · Intel Foundry · SMIC · GlobalFoundries · Tower. Product and roadmap milestones remain available below without being presented as output.
Technology and capacity timeline
Reported milestones stay distinct from management targets.
Aug 11, 2026Tower
OpenLight PH18DA PDK became available in Cadence tools
The SEC-filed announcement supports a qualitative design-enablement milestone for Tower's PH18DA InP-on-silicon platform and 400G/1.6T laser-integrated PIC application development. It is not evidence of sales, a design win, tape-out, production, shipments, or revenue.
reportedIssuer filing
Q2 2026TSMC
2nm entered the reported wafer-revenue mix
TSMC reported 2nm at 3% of Q2 wafer revenue; the process mix is company-specific and is not a foundry market-share estimate.
reportedIssuer filing
Q2 2026Intel Foundry
Intel 18A-P entered risk production
The earnings release describes the milestone as risk production, not customer volume, yield, revenue, or high-volume manufacturing.
reportedIssuer filing
Q2 2026Intel Foundry
A subset of Panther Lake entered high-volume manufacturing
Intel limited the statement to a subset of Core Ultra Series 3 processors and did not disclose external-customer wafer volume.
reportedIssuer filing
Jul 2026 approvalUMC
Singapore cleanroom and Tainan fab expansion approved
UMC approved phased Singapore P4 cleanroom/tool expansion and a new Tainan building shell; the revised FY2026 capex budget is US$2.0B guidance.
guidanceIssuer filing
Jul 14, 2026Tower
Japan SiPho, SiGe and optical-packaging expansion announced
Tower described a dual-track plan with Q4 2027 production readiness for the first track and a multi-fold capacity target for the second; both remain forward-looking.
guidanceIssuer filing
Q4 2025TSMC
2nm entered high-volume manufacturing
TSMC reported good yield and expects a fast 2026 ramp; N2P and A16 remain scheduled for H2 2026.
reportedIssuer filing
Q3 2025Samsung Foundry
First-generation 2nm GAA mass production started
Revenue remains undisclosed, so technology progress is not converted into a market-share estimate.
reportedIssuer filing
FY2025Intel Foundry
Intel 18A ramped into high-volume production
Intel identifies 18A as its first significant node for government and enterprise foundry customers.
reportedIssuer filing
Dec 2025SMIC
Monthly capacity passed 1M 8-inch-equivalent wafers
Year-end monthly capacity reached 1,058,750; FY2025 shipments rose 20.9% to 9.697M on the same basis.
reportedIssuer filing
2027 targetTower
Silicon-photonics capacity targeted above 5× Q4 2025 run-rate
The target is guidance backed by a stated US$920M SiPho/SiGe investment program, not current capacity.
guidanceIssuer filing
PRESS DESK
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VLSI Market (VLSI Korea), “Global Foundry Monitor: latest official issuer disclosures and FY2025 annual baseline,” dataset 2026.08.30-foundry-10, data through Aug 17, 2026 issuer filings · Jul 2026 monthly sales · complete disclosed TSMC and UMC Q2 2026 process-node revenue buckets · Q2 and H1 2026 actuals and Q3 guidance · FY2025 annual baseline, accessed 24 Aug 2026, https://market.vlsi.kr/foundry. Underlying sources: company filings and exchange disclosures.
Free to cite with attribution. Underlying source terms still apply. Figures are informational, not investment advice.