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{"company_id": "GLOBALWAFERS", "metric": "wafer_shipments", "period": "2023", "period_type": "annual", "value": 40235000, "unit": "wafers/year", "wafer_basis": "raw_silicon_mixed_physical", "scope": "Group semiconductor wafer sales; domestic+export", "status": "reported_actual", "source_id": "RW03", "locator": "printed p.164", "notes": "원문 thousand pieces×1,000. 혼합 구경 실물 장수; 면적환산 수량이 아님. 웨이퍼 소재 회사 연결기준으로 가공팹의 chip wafer output과 별도. 판매지역 합계: 8,550+31,685 thousand pieces. 생산량과 달리 외부판매 수량.", "research_file": "raw_wafers.json", "observation_id": "SCE000106", "company_name": "GlobalWafers Co., Ltd.", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.sas-globalwafers.com/wp-content/uploads/2024/05/GlobalWafers_2023-Annual-Report-EN.pdf", "source_title": "GlobalWafers 2023 Annual Report", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00106", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "wafer_shipments", "metric_ko": "웨이퍼 출하량", "native_comparator": "as_reported", "native_value": 40235000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"GLOBALWAFERS\",\"metric\":\"wafer_shipments\",\"period\":\"2023\",\"period_type\":\"annual\",\"value\":40235000,\"unit\":\"wafers/year\",\"wafer_basis\":\"raw_silicon_mixed_physical\",\"scope\":\"Group semiconductor wafer sales; domestic+export\",\"status\":\"reported_actual\",\"source_id\":\"RW03\",\"locator\":\"printed p.164\",\"notes\":\"원문 thousand pieces×1,000. 혼합 구경 실물 장수; 면적환산 수량이 아님. 웨이퍼 소재 회사 연결기준으로 가공팹의 chip wafer output과 별도. 판매지역 합계: 8,550+31,685 thousand pieces. 생산량과 달리 외부판매 수량.\",\"research_file\":\"raw_wafers.json\",\"observation_id\":\"WH00106\",\"company_name\":\"GlobalWafers Co., Ltd.\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.sas-globalwafers.com/wp-content/uploads/2024/05/GlobalWafers_2023-Annual-Report-EN.pdf\",\"source_title\":\"GlobalWafers 2023 Annual Report\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "GLOBAL_FAB", "metric": "capacity", "period": "2016-12", "period_type": "point_in_time", "value": 17800000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "IC industry capacity in IC Insights 2017–2021 vintage, reproduced by Atomera.", "status": "secondary_estimate", "source_id": "IS12", "locator": "Slide 9", "notes": "Rounded 17.8 million total; narrower than SEMI global semiconductor fab universe.", "series_id": "IC_INSIGHTS_2017_VINTAGE_ATOMERA", "research_file": "industry_stats.json", "observation_id": "SCE000108", "company_name": "Worldwide semiconductor fabrication capacity", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm", "source_title": "Atomera Investor Presentation, March 2018", "source_publication_date": "2018-03-12", "available_date_verified": "2018-03-12", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00108", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 17800000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"GLOBAL_FAB\",\"metric\":\"capacity\",\"period\":\"2016-12\",\"period_type\":\"point_in_time\",\"value\":17800000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"IC industry capacity in IC Insights 2017–2021 vintage, reproduced by Atomera.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS12\",\"locator\":\"Slide 9\",\"notes\":\"Rounded 17.8 million total; narrower than SEMI global semiconductor fab universe.\",\"series_id\":\"IC_INSIGHTS_2017_VINTAGE_ATOMERA\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00108\",\"company_name\":\"Worldwide semiconductor fabrication capacity\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm\",\"source_title\":\"Atomera Investor Presentation, March 2018\",\"source_publication_date\":\"2018-03-12\",\"available_date_verified\":\"2018-03-12\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "GLOBAL_FAB", "metric": "capacity", "period": "2023", "period_type": "year_capacity_snapshot_unspecified", "value": 29600000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "SEMI World Fab Forecast global semiconductor capacity, broader than IC-only rankings.", "status": "secondary_estimate", "source_id": "IS16", "locator": "Opening paragraph", "notes": "Source says capacity rose to 29.6 million wpm in 2023. Reference year given; precise snapshot date not explicitly stated. This is installed capacity, not actual production.", "series_id": "SEMI_WFF_DEC2023_VINTAGE", "research_file": "industry_stats.json", "observation_id": "SCE000109", "company_name": "Worldwide semiconductor fabrication capacity", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.semi.org/en/news-media-press-releases/semi-press-releases/global-semiconductor-capacity-projected-to-reach-record-high-30-million-wafers-per-month-in-2024-semi-reports", "source_title": "Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports", "source_publication_date": "2024-01-02", "available_date_verified": "2024-01-02", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00109", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 29600000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"GLOBAL_FAB\",\"metric\":\"capacity\",\"period\":\"2023\",\"period_type\":\"year_capacity_snapshot_unspecified\",\"value\":29600000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"SEMI World Fab Forecast global semiconductor capacity, broader than IC-only rankings.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS16\",\"locator\":\"Opening paragraph\",\"notes\":\"Source says capacity rose to 29.6 million wpm in 2023. Reference year given; precise snapshot date not explicitly stated. This is installed capacity, not actual production.\",\"series_id\":\"SEMI_WFF_DEC2023_VINTAGE\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00109\",\"company_name\":\"Worldwide semiconductor fabrication capacity\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.semi.org/en/news-media-press-releases/semi-press-releases/global-semiconductor-capacity-projected-to-reach-record-high-30-million-wafers-per-month-in-2024-semi-reports\",\"source_title\":\"Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports\",\"source_publication_date\":\"2024-01-02\",\"available_date_verified\":\"2024-01-02\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "GLOBAL_FAB", "metric": "capacity", "period": "2025", "period_type": "year_capacity_forecast_unspecified", "value": 33600000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "SEMI World Fab Forecast global semiconductor capacity forecast.", "status": "announced_plan", "source_id": "IS17", "locator": "Advanced Nodes Lead Semiconductor Industry Expansion", "notes": "Forecast made 2025-01-07 based on December 2024 report; not a 2025 realized capacity measurement. Broad global semiconductor device scope.", "series_id": "SEMI_WFF_DEC2024_FORECAST_VINTAGE", "research_file": "industry_stats.json", "observation_id": "SCE000110", "company_name": "Worldwide semiconductor fabrication capacity", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.semi.org/en/semi-press-release/eighteen-new-semiconductor-fabs-to-start-construction-in-2025-semi-reports", "source_title": "Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports", "source_publication_date": "2025-01-07", "available_date_verified": "2025-01-07", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00110", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 33600000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2025-01-07", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"GLOBAL_FAB\",\"metric\":\"capacity\",\"period\":\"2025\",\"period_type\":\"year_capacity_forecast_unspecified\",\"value\":33600000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"SEMI World Fab Forecast global semiconductor capacity forecast.\",\"status\":\"announced_plan\",\"source_id\":\"IS17\",\"locator\":\"Advanced Nodes Lead Semiconductor Industry Expansion\",\"notes\":\"Forecast made 2025-01-07 based on December 2024 report; not a 2025 realized capacity measurement. Broad global semiconductor device scope.\",\"series_id\":\"SEMI_WFF_DEC2024_FORECAST_VINTAGE\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00110\",\"company_name\":\"Worldwide semiconductor fabrication capacity\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.semi.org/en/semi-press-release/eighteen-new-semiconductor-fabs-to-start-construction-in-2025-semi-reports\",\"source_title\":\"Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports\",\"source_publication_date\":\"2025-01-07\",\"available_date_verified\":\"2025-01-07\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "metric": "capacity", "period": "2013-12", "period_type": "point_in_time", "value": 1380000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.", "status": "secondary_estimate", "source_id": "IS11", "locator": "Figure 1, p.2", "notes": "Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.", "series_id": "IC_INSIGHTS_2014_VINTAGE", "research_file": "industry_stats.json", "observation_id": "SCE000285", "company_name": "Micron Technology", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.icinsights.com/data/articles/documents/632.pdf", "source_title": "Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders", "source_publication_date": "2014-01-08", "available_date_verified": "2014-01-08", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00285", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 1380000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"metric\":\"capacity\",\"period\":\"2013-12\",\"period_type\":\"point_in_time\",\"value\":1380000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS11\",\"locator\":\"Figure 1, p.2\",\"notes\":\"Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.\",\"series_id\":\"IC_INSIGHTS_2014_VINTAGE\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00285\",\"company_name\":\"Micron Technology\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.icinsights.com/data/articles/documents/632.pdf\",\"source_title\":\"Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders\",\"source_publication_date\":\"2014-01-08\",\"available_date_verified\":\"2014-01-08\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "metric": "capacity", "period": "2013-Q2", "period_type": "quarter", "value": null, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Elpida_Hiroshima_plus_Rexchip_fabs_only", "status": "reported_actual", "source_id": "MKMU2013", "locator": "PDF p.5, Elpida acquisition section", "notes": "Lower-bound company estimate: capable of more than180,000. Proposed-acquisition scope, not Micron total, not newly built capacity. Company-reported estimate of existing facilities, not a third-party estimate; the expected acquisition itself was still pending.", "value_qualifier": "greater_than", "research_file": "memory_korea.json", "value_min": 180000, "comparator": "greater_than", "observation_id": "SCE000286", "company_name": "Micron Technology", "value_max": null, "capacity_kind": "unspecified", "source_url": "https://investors.micron.com/static-files/1a13f1ba-d6b9-4b9d-9138-a1b09042eb48", "source_title": "Micron FY2013 Q2 Form10-Q MD&A", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00286", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "greater_than", "native_value": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_bound", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"metric\":\"capacity\",\"period\":\"2013-Q2\",\"period_type\":\"quarter\",\"value\":null,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Elpida_Hiroshima_plus_Rexchip_fabs_only\",\"status\":\"reported_actual\",\"source_id\":\"MKMU2013\",\"locator\":\"PDF p.5, Elpida acquisition section\",\"notes\":\"Lower-bound company estimate: capable of more than180,000. Proposed-acquisition scope, not Micron total, not newly built capacity. Company-reported estimate of existing facilities, not a third-party estimate; the expected acquisition itself was still pending.\",\"value_qualifier\":\"greater_than\",\"research_file\":\"memory_korea.json\",\"value_min\":180000,\"comparator\":\"greater_than\",\"observation_id\":\"WH00286\",\"company_name\":\"Micron Technology\",\"value_max\":null,\"capacity_kind\":\"unspecified\",\"source_url\":\"https://investors.micron.com/static-files/1a13f1ba-d6b9-4b9d-9138-a1b09042eb48\",\"source_title\":\"Micron FY2013 Q2 Form10-Q MD&A\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null}
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{"company_id": "NANYA", "metric": "capacity", "period": "2016-12", "period_type": "point_in_time", "value": 135000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.", "status": "secondary_estimate", "source_id": "IS12", "locator": "Slide 9: Largest Companies with fabs", "notes": "Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.", "series_id": "IC_INSIGHTS_2017_VINTAGE_ATOMERA", "research_file": "industry_stats.json", "observation_id": "SCE000300", "company_name": "Nanya Technology", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm", "source_title": "Atomera Investor Presentation, March 2018", "source_publication_date": "2018-03-12", "available_date_verified": "2018-03-12", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00300", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 135000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"NANYA\",\"metric\":\"capacity\",\"period\":\"2016-12\",\"period_type\":\"point_in_time\",\"value\":135000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS12\",\"locator\":\"Slide 9: Largest Companies with fabs\",\"notes\":\"Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.\",\"series_id\":\"IC_INSIGHTS_2017_VINTAGE_ATOMERA\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00300\",\"company_name\":\"Nanya Technology\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm\",\"source_title\":\"Atomera Investor Presentation, March 2018\",\"source_publication_date\":\"2018-03-12\",\"available_date_verified\":\"2018-03-12\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "NANYA", "metric": "capacity", "period": "2019", "period_type": "year", "value": 840000, "unit": "wafers/year", "wafer_basis": "physical_diameter_unspecified", "scope": "company_memory_annual_production_table_capacity", "status": "reported_actual", "source_id": "MKNA2020", "locator": "PDF p.132, Memory capacity column", "notes": "Diameter not stated in this table. Do not auto-convert. In 2020–2023 reports note says production capacity refers to total output; header retained as capacity, not assumed installed nameplate.", "research_file": "memory_korea.json", "observation_id": "SCE000304", "company_name": "Nanya Technology", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://companiesmarketcap.com/annual-reports/9257.ar.en.2020.pdf", "source_title": "Nanya Technology 2020 Annual Report", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00304", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 840000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"NANYA\",\"metric\":\"capacity\",\"period\":\"2019\",\"period_type\":\"year\",\"value\":840000,\"unit\":\"wafers/year\",\"wafer_basis\":\"physical_diameter_unspecified\",\"scope\":\"company_memory_annual_production_table_capacity\",\"status\":\"reported_actual\",\"source_id\":\"MKNA2020\",\"locator\":\"PDF p.132, Memory capacity column\",\"notes\":\"Diameter not stated in this table. Do not auto-convert. In 2020–2023 reports note says production capacity refers to total output; header retained as capacity, not assumed installed nameplate.\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00304\",\"company_name\":\"Nanya Technology\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://companiesmarketcap.com/annual-reports/9257.ar.en.2020.pdf\",\"source_title\":\"Nanya Technology 2020 Annual Report\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "NANYA", "metric": "capacity", "period": "2020", "period_type": "year", "value": 840000, "unit": "wafers/year", "wafer_basis": "physical_diameter_unspecified", "scope": "company_memory_annual_production_table_capacity", "status": "reported_actual", "source_id": "MKNA2020", "locator": "PDF p.132, Memory capacity column", "notes": "Diameter not stated in this table. Do not auto-convert. In 2020–2023 reports note says production capacity refers to total output; header retained as capacity, not assumed installed nameplate.", "research_file": "memory_korea.json", "observation_id": "SCE000305", "company_name": "Nanya Technology", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://companiesmarketcap.com/annual-reports/9257.ar.en.2020.pdf", "source_title": "Nanya Technology 2020 Annual Report", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00305", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 840000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"NANYA\",\"metric\":\"capacity\",\"period\":\"2020\",\"period_type\":\"year\",\"value\":840000,\"unit\":\"wafers/year\",\"wafer_basis\":\"physical_diameter_unspecified\",\"scope\":\"company_memory_annual_production_table_capacity\",\"status\":\"reported_actual\",\"source_id\":\"MKNA2020\",\"locator\":\"PDF p.132, Memory capacity column\",\"notes\":\"Diameter not stated in this table. Do not auto-convert. In 2020–2023 reports note says production capacity refers to total output; header retained as capacity, not assumed installed nameplate.\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00305\",\"company_name\":\"Nanya Technology\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://companiesmarketcap.com/annual-reports/9257.ar.en.2020.pdf\",\"source_title\":\"Nanya Technology 2020 Annual Report\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "PSMC", "metric": "wafer_shipments", "period": "2023", "period_type": "annual", "value": 830000, "unit": "wafers/year", "wafer_basis": "300mm_equivalent", "scope": "logic_wafer_products", "status": "derived_calculation", "source_id": "FW27", "locator": "Shipments and Sales, Logic row, domestic plus export", "notes": "Calculated sum of domestic and export quantities: 414+416 thousand; excludes die products.", "research_file": "foundry_west.json", "observation_id": "SCE000375", "company_name": "Powerchip Semiconductor Manufacturing Corporation", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.powerchip.com/upload/media/financials/annual_reports/Annual_Reports_2023_EN.pdf", "source_title": "PSMC 2023 Annual Report", "source_publication_date": "2024-02-20", "available_date_verified": "2024-02-20", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00375", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "wafer_shipments", "metric_ko": "웨이퍼 출하량", "native_comparator": "as_reported", "native_value": 830000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"PSMC\",\"metric\":\"wafer_shipments\",\"period\":\"2023\",\"period_type\":\"annual\",\"value\":830000,\"unit\":\"wafers/year\",\"wafer_basis\":\"300mm_equivalent\",\"scope\":\"logic_wafer_products\",\"status\":\"derived_calculation\",\"source_id\":\"FW27\",\"locator\":\"Shipments and Sales, Logic row, domestic plus export\",\"notes\":\"Calculated sum of domestic and export quantities: 414+416 thousand; excludes die products.\",\"research_file\":\"foundry_west.json\",\"observation_id\":\"WH00375\",\"company_name\":\"Powerchip Semiconductor Manufacturing Corporation\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.powerchip.com/upload/media/financials/annual_reports/Annual_Reports_2023_EN.pdf\",\"source_title\":\"PSMC 2023 Annual Report\",\"source_publication_date\":\"2024-02-20\",\"available_date_verified\":\"2024-02-20\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "PSMC", "metric": "wafer_shipments", "period": "2023", "period_type": "annual", "value": 287000, "unit": "wafers/year", "wafer_basis": "300mm_equivalent", "scope": "memory_wafer_products", "status": "derived_calculation", "source_id": "FW27", "locator": "Shipments and Sales, Memory wafer row, domestic plus export", "notes": "Calculated sum of domestic and export quantities: 139+148 thousand; excludes memory die products.", "research_file": "foundry_west.json", "observation_id": "SCE000376", "company_name": "Powerchip Semiconductor Manufacturing Corporation", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.powerchip.com/upload/media/financials/annual_reports/Annual_Reports_2023_EN.pdf", "source_title": "PSMC 2023 Annual Report", "source_publication_date": "2024-02-20", "available_date_verified": "2024-02-20", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00376", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "wafer_shipments", "metric_ko": "웨이퍼 출하량", "native_comparator": "as_reported", "native_value": 287000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"PSMC\",\"metric\":\"wafer_shipments\",\"period\":\"2023\",\"period_type\":\"annual\",\"value\":287000,\"unit\":\"wafers/year\",\"wafer_basis\":\"300mm_equivalent\",\"scope\":\"memory_wafer_products\",\"status\":\"derived_calculation\",\"source_id\":\"FW27\",\"locator\":\"Shipments and Sales, Memory wafer row, domestic plus export\",\"notes\":\"Calculated sum of domestic and export quantities: 139+148 thousand; excludes memory die products.\",\"research_file\":\"foundry_west.json\",\"observation_id\":\"WH00376\",\"company_name\":\"Powerchip Semiconductor Manufacturing Corporation\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.powerchip.com/upload/media/financials/annual_reports/Annual_Reports_2023_EN.pdf\",\"source_title\":\"PSMC 2023 Annual Report\",\"source_publication_date\":\"2024-02-20\",\"available_date_verified\":\"2024-02-20\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "PSMC", "metric": "capacity", "period": "2026-01-21", "period_type": "snapshot", "value": 50000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Hsinchu_memory_fabs", "status": "reported_actual", "source_id": "FW29", "locator": "Current Hsinchu memory capacity", "notes": "Memory-only capacity snapshot; excludes logic foundry and Tongluo.", "research_file": "foundry_west.json", "observation_id": "SCE000377", "company_name": "Powerchip Semiconductor Manufacturing Corporation", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.powerchip.com/en-global/insights/press-releases/content/20260121", "source_title": "PSMC memory capacity update", "source_publication_date": "2026-01-21", "available_date_verified": "2026-01-21", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00377", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 50000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"PSMC\",\"metric\":\"capacity\",\"period\":\"2026-01-21\",\"period_type\":\"snapshot\",\"value\":50000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Hsinchu_memory_fabs\",\"status\":\"reported_actual\",\"source_id\":\"FW29\",\"locator\":\"Current Hsinchu memory capacity\",\"notes\":\"Memory-only capacity snapshot; excludes logic foundry and Tongluo.\",\"research_file\":\"foundry_west.json\",\"observation_id\":\"WH00377\",\"company_name\":\"Powerchip Semiconductor Manufacturing Corporation\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.powerchip.com/en-global/insights/press-releases/content/20260121\",\"source_title\":\"PSMC memory capacity update\",\"source_publication_date\":\"2026-01-21\",\"available_date_verified\":\"2026-01-21\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "PSMC", "metric": "capacity", "period": "2026-10-16", "period_type": "snapshot", "value": 400000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "consolidated_company", "status": "undated_company_statement", "source_id": "FW30", "locator": "Manufacturing Services introduction", "notes": "Undated live website retrieved 2026-10-16. Potentially stale after 2026 Tongluo sale; do not interpret as verified 2026 installed capacity.", "research_file": "foundry_west.json", "observation_id": "SCE000378", "company_name": "Powerchip Semiconductor Manufacturing Corporation", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.powerchip.com/en-global/services/manufacturing-services-en", "source_title": "PSMC manufacturing services capacity profile", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00378", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 400000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"PSMC\",\"metric\":\"capacity\",\"period\":\"2026-10-16\",\"period_type\":\"snapshot\",\"value\":400000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"consolidated_company\",\"status\":\"undated_company_statement\",\"source_id\":\"FW30\",\"locator\":\"Manufacturing Services introduction\",\"notes\":\"Undated live website retrieved 2026-10-16. Potentially stale after 2026 Tongluo sale; do not interpret as verified 2026 installed capacity.\",\"research_file\":\"foundry_west.json\",\"observation_id\":\"WH00378\",\"company_name\":\"Powerchip Semiconductor Manufacturing Corporation\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.powerchip.com/en-global/services/manufacturing-services-en\",\"source_title\":\"PSMC manufacturing services capacity profile\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "PSMC", "metric": "capacity", "period": "full_ramp_as_announced_2024-05-02", "period_type": "milestone", "value": 50000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Tongluo_P5", "status": "announced_plan", "source_id": "FW28", "locator": "Tongluo fab capacity plan", "notes": "Announced capacity target, not actual 2024 wafer output. Subsequent 2026 sale to Micron changes ownership and requires separate event tracking.", "research_file": "foundry_west.json", "observation_id": "SCE000379", "company_name": "Powerchip Semiconductor Manufacturing Corporation", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.powerchip.com/ja-jp/insights/press-releases/content/20240502", "source_title": "PSMC opens Tongluo fab", "source_publication_date": "2024-05-02", "available_date_verified": "2024-05-02", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00379", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 50000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2024-05-02", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"PSMC\",\"metric\":\"capacity\",\"period\":\"full_ramp_as_announced_2024-05-02\",\"period_type\":\"milestone\",\"value\":50000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Tongluo_P5\",\"status\":\"announced_plan\",\"source_id\":\"FW28\",\"locator\":\"Tongluo fab capacity plan\",\"notes\":\"Announced capacity target, not actual 2024 wafer output. Subsequent 2026 sale to Micron changes ownership and requires separate event tracking.\",\"research_file\":\"foundry_west.json\",\"observation_id\":\"WH00379\",\"company_name\":\"Powerchip Semiconductor Manufacturing Corporation\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.powerchip.com/ja-jp/insights/press-releases/content/20240502\",\"source_title\":\"PSMC opens Tongluo fab\",\"source_publication_date\":\"2024-05-02\",\"available_date_verified\":\"2024-05-02\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "RENESAS", "metric": "capacity", "period": "2016-12", "period_type": "point_in_time", "value": 236124, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.", "status": "secondary_estimate", "source_id": "IS12", "locator": "Slide 9: Largest Companies with fabs", "notes": "Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.", "series_id": "IC_INSIGHTS_2017_VINTAGE_ATOMERA", "research_file": "industry_stats.json", "observation_id": "SCE000380", "company_name": "Renesas Electronics", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm", "source_title": "Atomera Investor Presentation, March 2018", "source_publication_date": "2018-03-12", "available_date_verified": "2018-03-12", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00380", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 236124, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"RENESAS\",\"metric\":\"capacity\",\"period\":\"2016-12\",\"period_type\":\"point_in_time\",\"value\":236124,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS12\",\"locator\":\"Slide 9: Largest Companies with fabs\",\"notes\":\"Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.\",\"series_id\":\"IC_INSIGHTS_2017_VINTAGE_ATOMERA\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00380\",\"company_name\":\"Renesas Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm\",\"source_title\":\"Atomera Investor Presentation, March 2018\",\"source_publication_date\":\"2018-03-12\",\"available_date_verified\":\"2018-03-12\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2008", "period_type": "year", "value": 60000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Austin_new_300mm_NAND_fab_only", "status": "announced_plan", "source_id": "MKSS2007", "locator": "Paragraph2", "notes": "Plan announced2007; do not assume actual2008 attainment; later Austin logic conversion breaks a simple memory capacity series.", "research_file": "memory_korea.json", "observation_id": "SCE000381", "company_name": "Samsung Electronics", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://semiconductor.samsung.com/news-events/news/samsung-opens-largest-wafer-plant-in-austin-texas/", "source_title": "Samsung Opens Largest Wafer Plant in Austin Texas", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00381", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 60000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2008\",\"period_type\":\"year\",\"value\":60000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Austin_new_300mm_NAND_fab_only\",\"status\":\"announced_plan\",\"source_id\":\"MKSS2007\",\"locator\":\"Paragraph2\",\"notes\":\"Plan announced2007; do not assume actual2008 attainment; later Austin logic conversion breaks a simple memory capacity series.\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00381\",\"company_name\":\"Samsung Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://semiconductor.samsung.com/news-events/news/samsung-opens-largest-wafer-plant-in-austin-texas/\",\"source_title\":\"Samsung Opens Largest Wafer Plant in Austin Texas\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2011-09", "period_type": "month", "value": null, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Hwaseong_Line16_initial_NAND_ramp", "status": "announced_plan", "source_id": "MKSS2011L16", "locator": "Projected volume paragraph", "notes": "Projected volume more than10,000; not audited realized starts, and not contradictory to future200k buildout target.", "value_qualifier": "greater_than", "research_file": "memory_korea.json", "value_min": 10000, "comparator": "greater_than", "observation_id": "SCE000382", "company_name": "Samsung Electronics", "value_max": null, "capacity_kind": "unspecified", "source_url": "https://news.samsung.com/global/world%E2%80%99s-largest-memory-fabrication-facility-line-16memory", "source_title": "World Largest Fabrication Facility Line16", "source_publication_date": "2011-09-26", "available_date_verified": "2011-09-26", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00382", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "greater_than", "native_value": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2011-09-26", "record_kind": "numeric_bound", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2011-09\",\"period_type\":\"month\",\"value\":null,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Hwaseong_Line16_initial_NAND_ramp\",\"status\":\"announced_plan\",\"source_id\":\"MKSS2011L16\",\"locator\":\"Projected volume paragraph\",\"notes\":\"Projected volume more than10,000; not audited realized starts, and not contradictory to future200k buildout target.\",\"value_qualifier\":\"greater_than\",\"research_file\":\"memory_korea.json\",\"value_min\":10000,\"comparator\":\"greater_than\",\"observation_id\":\"WH00382\",\"company_name\":\"Samsung Electronics\",\"value_max\":null,\"capacity_kind\":\"unspecified\",\"source_url\":\"https://news.samsung.com/global/world%E2%80%99s-largest-memory-fabrication-facility-line-16memory\",\"source_title\":\"World Largest Fabrication Facility Line16\",\"source_publication_date\":\"2011-09-26\",\"available_date_verified\":\"2011-09-26\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2011-10", "period_type": "month", "value": 40000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Austin_S2_logic_only", "status": "reported_actual", "source_id": "MKSS2011S2", "locator": "Opening paragraph", "notes": "Achieved targeted wafer-start capacity,45nm low-power logic; separate from memory. Does not represent all Samsung foundry.", "research_file": "memory_korea.json", "observation_id": "SCE000383", "company_name": "Samsung Electronics", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://news.samsung.com/global/samsung%E2%80%99s-austin-logic-line-breaks-record-achievements", "source_title": "Samsung Austin Logic Line Breaks Record Achievements", "source_publication_date": "2011-12-13", "available_date_verified": "2011-12-13", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00383", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 40000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2011-10\",\"period_type\":\"month\",\"value\":40000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Austin_S2_logic_only\",\"status\":\"reported_actual\",\"source_id\":\"MKSS2011S2\",\"locator\":\"Opening paragraph\",\"notes\":\"Achieved targeted wafer-start capacity,45nm low-power logic; separate from memory. Does not represent all Samsung foundry.\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00383\",\"company_name\":\"Samsung Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://news.samsung.com/global/samsung%E2%80%99s-austin-logic-line-breaks-record-achievements\",\"source_title\":\"Samsung Austin Logic Line Breaks Record Achievements\",\"source_publication_date\":\"2011-12-13\",\"available_date_verified\":\"2011-12-13\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2011_onward", "period_type": "target_window", "value": null, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Hwaseong_Line16_planned_buildout", "status": "announced_plan", "source_id": "MKSS2010L16", "locator": "반도체 부문, Line16", "notes": "Source says more than200,000 and phased investment; not demonstrated output in2011.", "value_qualifier": "greater_than", "research_file": "memory_korea.json", "value_min": 200000, "comparator": "greater_than", "observation_id": "SCE000384", "company_name": "Samsung Electronics", "value_max": null, "capacity_kind": "unspecified", "source_url": "https://news.samsung.com/kr/삼성전자-2010년-사상-최대-26조원-투자-계획", "source_title": "Samsung 2010 Investment Plan / Line16 Groundbreaking", "source_publication_date": "2010-05-17", "available_date_verified": "2010-05-17", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00384", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "greater_than", "native_value": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2010-05-17", "record_kind": "numeric_bound", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2011_onward\",\"period_type\":\"target_window\",\"value\":null,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Hwaseong_Line16_planned_buildout\",\"status\":\"announced_plan\",\"source_id\":\"MKSS2010L16\",\"locator\":\"반도체 부문, Line16\",\"notes\":\"Source says more than200,000 and phased investment; not demonstrated output in2011.\",\"value_qualifier\":\"greater_than\",\"research_file\":\"memory_korea.json\",\"value_min\":200000,\"comparator\":\"greater_than\",\"observation_id\":\"WH00384\",\"company_name\":\"Samsung Electronics\",\"value_max\":null,\"capacity_kind\":\"unspecified\",\"source_url\":\"https://news.samsung.com/kr/삼성전자-2010년-사상-최대-26조원-투자-계획\",\"source_title\":\"Samsung 2010 Investment Plan / Line16 Groundbreaking\",\"source_publication_date\":\"2010-05-17\",\"available_date_verified\":\"2010-05-17\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2013-12", "period_type": "point_in_time", "value": 1867000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.", "status": "secondary_estimate", "source_id": "IS11", "locator": "Figure 1, p.2", "notes": "Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.", "series_id": "IC_INSIGHTS_2014_VINTAGE", "research_file": "industry_stats.json", "observation_id": "SCE000385", "company_name": "Samsung Electronics", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.icinsights.com/data/articles/documents/632.pdf", "source_title": "Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders", "source_publication_date": "2014-01-08", "available_date_verified": "2014-01-08", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00385", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 1867000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2013-12\",\"period_type\":\"point_in_time\",\"value\":1867000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS11\",\"locator\":\"Figure 1, p.2\",\"notes\":\"Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.\",\"series_id\":\"IC_INSIGHTS_2014_VINTAGE\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00385\",\"company_name\":\"Samsung Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.icinsights.com/data/articles/documents/632.pdf\",\"source_title\":\"Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders\",\"source_publication_date\":\"2014-01-08\",\"available_date_verified\":\"2014-01-08\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "metric": "capacity", "period": "2016-12", "period_type": "point_in_time", "value": 2598750, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.", "status": "secondary_estimate", "source_id": "IS12", "locator": "Slide 9: Largest Companies with fabs", "notes": "Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.", "series_id": "IC_INSIGHTS_2017_VINTAGE_ATOMERA", "research_file": "industry_stats.json", "observation_id": "SCE000386", "company_name": "Samsung Electronics", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm", "source_title": "Atomera Investor Presentation, March 2018", "source_publication_date": "2018-03-12", "available_date_verified": "2018-03-12", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00386", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 2598750, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"metric\":\"capacity\",\"period\":\"2016-12\",\"period_type\":\"point_in_time\",\"value\":2598750,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS12\",\"locator\":\"Slide 9: Largest Companies with fabs\",\"notes\":\"Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.\",\"series_id\":\"IC_INSIGHTS_2017_VINTAGE_ATOMERA\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00386\",\"company_name\":\"Samsung Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm\",\"source_title\":\"Atomera Investor Presentation, March 2018\",\"source_publication_date\":\"2018-03-12\",\"available_date_verified\":\"2018-03-12\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "SILAN", "metric": "actual_production", "period": "2025", "period_type": "annual", "value": 819500, "unit": "wafers/year", "wafer_basis": "mixed_physical", "scope": "Silan_Jixin_200_300mm", "status": "reported_actual", "source_id": "CN032", "locator": "Management review, main manufacturing facility operating performance", "notes": "Fab-specific; equity investee must not be treated as consolidated subsidiary. Mixed-size physical counts where specified.", "research_file": "china_foundries.json", "observation_id": "SCE000410", "company_name": "Hangzhou Silan Microelectronics / 士兰微", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://static.cninfo.com.cn/finalpage/2026-04-25/1225189603.PDF", "source_title": "Silan 2025 Annual Report", "source_publication_date": "2026-04-25", "available_date_verified": "2026-04-25", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00410", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "actual_production", "metric_ko": "실제 웨이퍼 생산량", "native_comparator": "as_reported", "native_value": 819500, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SILAN\",\"metric\":\"actual_production\",\"period\":\"2025\",\"period_type\":\"annual\",\"value\":819500,\"unit\":\"wafers/year\",\"wafer_basis\":\"mixed_physical\",\"scope\":\"Silan_Jixin_200_300mm\",\"status\":\"reported_actual\",\"source_id\":\"CN032\",\"locator\":\"Management review, main manufacturing facility operating performance\",\"notes\":\"Fab-specific; equity investee must not be treated as consolidated subsidiary. Mixed-size physical counts where specified.\",\"research_file\":\"china_foundries.json\",\"observation_id\":\"WH00410\",\"company_name\":\"Hangzhou Silan Microelectronics / 士兰微\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://static.cninfo.com.cn/finalpage/2026-04-25/1225189603.PDF\",\"source_title\":\"Silan 2025 Annual Report\",\"source_publication_date\":\"2026-04-25\",\"available_date_verified\":\"2026-04-25\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SILTRONIC", "metric": "capacity", "period": "2010-target", "period_type": "target_point_in_time", "value": 300000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "SingaporeSiltronicSamsungWaferJV designcapacity", "status": "announced_plan", "source_id": "RW25", "locator": "pressreleasebulletpoints", "notes": "2006계획;초기양산2008예정. 회사전체능력아님.", "research_file": "raw_wafers.json", "observation_id": "SCE000411", "company_name": "Siltronic AG", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.siltronic.com/en/press/press-releases/samsung-electronics-and-siltronic-to-jointly-construct-300-mm-wafer-fab-in-singapore.html", "source_title": "Siltronic Samsung Singapore JV capacity announcement", "source_publication_date": "2006-07-14", "available_date_verified": "2006-07-14", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00411", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 300000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2006-07-14", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SILTRONIC\",\"metric\":\"capacity\",\"period\":\"2010-target\",\"period_type\":\"target_point_in_time\",\"value\":300000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"SingaporeSiltronicSamsungWaferJV designcapacity\",\"status\":\"announced_plan\",\"source_id\":\"RW25\",\"locator\":\"pressreleasebulletpoints\",\"notes\":\"2006계획;초기양산2008예정. 회사전체능력아님.\",\"research_file\":\"raw_wafers.json\",\"observation_id\":\"WH00411\",\"company_name\":\"Siltronic AG\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.siltronic.com/en/press/press-releases/samsung-electronics-and-siltronic-to-jointly-construct-300-mm-wafer-fab-in-singapore.html\",\"source_title\":\"Siltronic Samsung Singapore JV capacity announcement\",\"source_publication_date\":\"2006-07-14\",\"available_date_verified\":\"2006-07-14\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SILTRONIC", "metric": "capacity", "period": "2019-H1", "period_type": "target_point_in_time", "value": 70000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Additional300mmcapacity toexistingfacilities", "status": "announced_plan", "source_id": "RW27", "locator": "capacityexpansionparagraph", "notes": "2017년결정증설분;회사전체능력·생산실적아님.", "research_file": "raw_wafers.json", "observation_id": "SCE000412", "company_name": "Siltronic AG", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.siltronic.com/en/press/press-releases/siltronic-closes-2017-fiscal-year-successfully-and-anticipates-highly-positive-2018-fiscal-year-1.html", "source_title": "Siltronic 2017 fiscal year results", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00412", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 70000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SILTRONIC\",\"metric\":\"capacity\",\"period\":\"2019-H1\",\"period_type\":\"target_point_in_time\",\"value\":70000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Additional300mmcapacity toexistingfacilities\",\"status\":\"announced_plan\",\"source_id\":\"RW27\",\"locator\":\"capacityexpansionparagraph\",\"notes\":\"2017년결정증설분;회사전체능력·생산실적아님.\",\"research_file\":\"raw_wafers.json\",\"observation_id\":\"WH00412\",\"company_name\":\"Siltronic AG\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.siltronic.com/en/press/press-releases/siltronic-closes-2017-fiscal-year-successfully-and-anticipates-highly-positive-2018-fiscal-year-1.html\",\"source_title\":\"Siltronic 2017 fiscal year results\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SK_HYNIX", "metric": "capacity", "period": "2005-Q3", "period_type": "quarter", "value": 25000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Icheon_M10_only", "status": "reported_actual", "source_id": "MKHY2005", "locator": "Operational highlights paragraph", "notes": "Approximately25k achieved capacity; quarter observation expressed as monthly rate.", "value_qualifier": "approximately", "research_file": "memory_korea.json", "observation_id": "SCE000413", "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "value_min": null, "value_max": null, "comparator": "approximately", "capacity_kind": "unspecified", "source_url": "https://news.skhynix.com/en/hynix-semiconductor-inc-reports-the-results-for-the-third-quarter-of-fy-2005/", "source_title": "Hynix Q3 FY2005 Results", "source_publication_date": "2005-10-13", "available_date_verified": "2005-10-13", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00413", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "approximately", "native_value": 25000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SK_HYNIX\",\"metric\":\"capacity\",\"period\":\"2005-Q3\",\"period_type\":\"quarter\",\"value\":25000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Icheon_M10_only\",\"status\":\"reported_actual\",\"source_id\":\"MKHY2005\",\"locator\":\"Operational highlights paragraph\",\"notes\":\"Approximately25k achieved capacity; quarter observation expressed as monthly rate.\",\"value_qualifier\":\"approximately\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00413\",\"company_name\":\"SK hynix (formerly Hynix/Hyundai Electronics)\",\"value_min\":null,\"value_max\":null,\"comparator\":\"approximately\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://news.skhynix.com/en/hynix-semiconductor-inc-reports-the-results-for-the-third-quarter-of-fy-2005/\",\"source_title\":\"Hynix Q3 FY2005 Results\",\"source_publication_date\":\"2005-10-13\",\"available_date_verified\":\"2005-10-13\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null}
{"company_id": "SK_HYNIX", "metric": "capacity", "period": "2008-09", "period_type": "month", "value": 40000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Cheongju_M11_initial_NAND_only", "status": "announced_plan", "source_id": "MKHY2008M11", "locator": "M11 start schedule", "notes": "Scheduled production start, not proof of realized output.", "research_file": "memory_korea.json", "observation_id": "SCE000414", "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://news.skhynix.com/en/hynix-semiconductor-inc-completed-construction-of-300mm-fabrication-plant-of-3rd-factory-in-cheongju/", "source_title": "Hynix Completes Third Cheongju Factory", "source_publication_date": "2008-08-28", "available_date_verified": "2008-08-28", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00414", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 40000, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2008-08-28", "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SK_HYNIX\",\"metric\":\"capacity\",\"period\":\"2008-09\",\"period_type\":\"month\",\"value\":40000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Cheongju_M11_initial_NAND_only\",\"status\":\"announced_plan\",\"source_id\":\"MKHY2008M11\",\"locator\":\"M11 start schedule\",\"notes\":\"Scheduled production start, not proof of realized output.\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00414\",\"company_name\":\"SK hynix (formerly Hynix/Hyundai Electronics)\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://news.skhynix.com/en/hynix-semiconductor-inc-completed-construction-of-300mm-fabrication-plant-of-3rd-factory-in-cheongju/\",\"source_title\":\"Hynix Completes Third Cheongju Factory\",\"source_publication_date\":\"2008-08-28\",\"available_date_verified\":\"2008-08-28\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "TSMC", "metric": "capacity", "period": "2020-12", "period_type": "point_in_time", "value": 2647000, "unit": "wafers/month", "wafer_basis": "200mm_equivalent", "scope": "Installed monthly IC wafer capacity, including image sensors, per Knometa 2022.", "status": "secondary_estimate", "source_id": "IS14", "locator": "Global IC Wafer Capacity Leaders chart; exact numeric table also IS15", "notes": "Knometa 2022 publication vintage, includes image sensors. 2020 baseline differs from IC Insights 2021 vintage; keep separate series. Exact table values independently checked against readable Evertiq table IS15.", "series_id": "KNOMETA_2022_VINTAGE_INCLUDES_IMAGE_SENSORS", "research_file": "industry_stats.json", "observation_id": "SCE000620", "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://www.knometa.com/news/?post=top-five-leaders-continue-expanding-share-of-global-ic-fab-capacity", "source_title": "Top Five Leaders Continue Expanding Share of Global IC Fab Capacity", "source_publication_date": "2022-04-07", "available_date_verified": "2022-04-07", "retrieved_date": "2026-10-16", "legacy_observation_id": "WH00620", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "as_reported", "native_value": 2647000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"metric\":\"capacity\",\"period\":\"2020-12\",\"period_type\":\"point_in_time\",\"value\":2647000,\"unit\":\"wafers/month\",\"wafer_basis\":\"200mm_equivalent\",\"scope\":\"Installed monthly IC wafer capacity, including image sensors, per Knometa 2022.\",\"status\":\"secondary_estimate\",\"source_id\":\"IS14\",\"locator\":\"Global IC Wafer Capacity Leaders chart; exact numeric table also IS15\",\"notes\":\"Knometa 2022 publication vintage, includes image sensors. 2020 baseline differs from IC Insights 2021 vintage; keep separate series. Exact table values independently checked against readable Evertiq table IS15.\",\"series_id\":\"KNOMETA_2022_VINTAGE_INCLUDES_IMAGE_SENSORS\",\"research_file\":\"industry_stats.json\",\"observation_id\":\"WH00620\",\"company_name\":\"TSMC / Taiwan Semiconductor Manufacturing Company\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.knometa.com/news/?post=top-five-leaders-continue-expanding-share-of-global-ic-fab-capacity\",\"source_title\":\"Top Five Leaders Continue Expanding Share of Global IC Fab Capacity\",\"source_publication_date\":\"2022-04-07\",\"available_date_verified\":\"2022-04-07\",\"retrieved_date\":\"2026-10-16\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "TSMC", "metric": "wafer_shipments", "period": "2024", "period_type": "annual", "value": 12910000, "unit": "wafers/year", "wafer_basis": "300mm_equivalent", "scope": "consolidated", "status": "reported_actual", "source_id": "TS_F2024", "locator": "Item 5, Year-to-Year Comparisons, Net Revenue and Gross Margin", "notes": "연결 연간 출하, 원자료 천 장. Letter to Shareholders 반올림 값보다 정밀한 표 사용.", "research_file": "tsmc.json", "observation_id": "SCE000635", "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "value_min": null, "value_max": null, "comparator": "equal", "capacity_kind": "unspecified", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2024%2020-F.pdf", "source_title": "TSMC Form 20-F 2024", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00635", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "wafer_shipments", "metric_ko": "웨이퍼 출하량", "native_comparator": "as_reported", "native_value": 12910000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"metric\":\"wafer_shipments\",\"period\":\"2024\",\"period_type\":\"annual\",\"value\":12910000,\"unit\":\"wafers/year\",\"wafer_basis\":\"300mm_equivalent\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"TS_F2024\",\"locator\":\"Item 5, Year-to-Year Comparisons, Net Revenue and Gross Margin\",\"notes\":\"연결 연간 출하, 원자료 천 장. Letter to Shareholders 반올림 값보다 정밀한 표 사용.\",\"research_file\":\"tsmc.json\",\"observation_id\":\"WH00635\",\"company_name\":\"TSMC / Taiwan Semiconductor Manufacturing Company\",\"value_min\":null,\"value_max\":null,\"comparator\":\"as_reported\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://investor.tsmc.com/sites/ir/sec-filings/2024%2020-F.pdf\",\"source_title\":\"TSMC Form 20-F 2024\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "metric": "capacity", "period": "2025", "period_type": "annual", "value": null, "unit": "wafers/year", "wafer_basis": "300mm_equivalent", "scope": "annual_capacity_rounded_narrative", "status": "reported_actual", "source_id": "TS_AR2025", "locator": "About TSMC", "notes": "exceeded 17 million; 상한 미공시.", "value_min": 17000000, "comparator": "greater_than", "research_file": "tsmc.json", "observation_id": "SCE000636", "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "value_max": null, "capacity_kind": "unspecified", "source_url": "https://investor.tsmc.com/static/annualReports/2025/english/index.html", "source_title": "TSMC Annual Report 2025", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00636", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "greater_than", "native_value": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_bound", "has_numeric_value": true, "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"metric\":\"capacity\",\"period\":\"2025\",\"period_type\":\"annual\",\"value\":null,\"unit\":\"wafers/year\",\"wafer_basis\":\"300mm_equivalent\",\"scope\":\"annual_capacity_rounded_narrative\",\"status\":\"reported_actual\",\"source_id\":\"TS_AR2025\",\"locator\":\"About TSMC\",\"notes\":\"exceeded 17 million; 상한 미공시.\",\"value_min\":17000000,\"comparator\":\"greater_than\",\"research_file\":\"tsmc.json\",\"observation_id\":\"WH00636\",\"company_name\":\"TSMC / Taiwan Semiconductor Manufacturing Company\",\"value_max\":null,\"capacity_kind\":\"unspecified\",\"source_url\":\"https://investor.tsmc.com/static/annualReports/2025/english/index.html\",\"source_title\":\"TSMC Annual Report 2025\",\"source_publication_date\":null,\"available_date_verified\":null,\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "WINBOND", "metric": "capacity", "period": "2024", "period_type": "year", "value": 15000, "unit": "wafers/month", "wafer_basis": "300mm_physical", "scope": "Kaohsiung_fab_only", "status": "reported_actual", "source_id": "MKWB2024", "locator": "Company Profile, major business developments in past year", "notes": "Approximately15k/month achieved; subset of memory total, not additive to annual total.", "value_qualifier": "approximately", "research_file": "memory_korea.json", "observation_id": "SCE000770", "company_name": "Winbond Electronics", "value_min": null, "value_max": null, "comparator": "approximately", "capacity_kind": "unspecified", "source_url": "https://www.winbond.com/export/sites/winbond/about-winbond/investor/financial-information/annual-report/report/2024-Winbond-Annual-Report_Final_EN.pdf", "source_title": "Winbond2024 Annual Report", "source_publication_date": "2025-03-16", "available_date_verified": "2025-03-16", "retrieved_date": "2026-10-16", "series_id": "", "legacy_observation_id": "WH00770", "release_component": "wafer_history_v1", "category": "wafer_history", "category_ko": "웨이퍼 생산·출하·능력", "native_metric": "capacity", "metric_ko": "생산능력", "native_comparator": "approximately", "native_value": 15000, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"WINBOND\",\"metric\":\"capacity\",\"period\":\"2024\",\"period_type\":\"year\",\"value\":15000,\"unit\":\"wafers/month\",\"wafer_basis\":\"300mm_physical\",\"scope\":\"Kaohsiung_fab_only\",\"status\":\"reported_actual\",\"source_id\":\"MKWB2024\",\"locator\":\"Company Profile, major business developments in past year\",\"notes\":\"Approximately15k/month achieved; subset of memory total, not additive to annual total.\",\"value_qualifier\":\"approximately\",\"research_file\":\"memory_korea.json\",\"observation_id\":\"WH00770\",\"company_name\":\"Winbond Electronics\",\"value_min\":null,\"value_max\":null,\"comparator\":\"approximately\",\"capacity_kind\":\"unspecified\",\"source_url\":\"https://www.winbond.com/export/sites/winbond/about-winbond/investor/financial-information/annual-report/report/2024-Winbond-Annual-Report_Final_EN.pdf\",\"source_title\":\"Winbond2024 Annual Report\",\"source_publication_date\":\"2025-03-16\",\"available_date_verified\":\"2025-03-16\",\"retrieved_date\":\"2026-10-16\",\"series_id\":\"\"}", "period_end": null, "product_or_technology": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "shared_asset_id": null, "derivation": null, "shared_asset_note": null}
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{"company_id": "TSMC", "category": "advanced_packaging", "metric": "production_start", "period": "2024", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "SoIC CoW Face-to-Back Gen-2", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG012", "locator": "Printed p.100, 3DIC and TSMC-SoIC subsection", "notes": "The source says production, without explicitly labeling high volume; the observation preserves that qualification.", "value_text": "Qualified and started production in 2024.", "legacy_observation_id": "", "observation_id": "SCE001121", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "production_start", "metric_ko": "생산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/static/annualReports/2024/english/ebook/files/basic-html/page102.html", "source_title": "TSMC 2024 Annual Report – 3DIC, SoIC and CoWoS", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"production_start\",\"period\":\"2024\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"SoIC CoW Face-to-Back Gen-2\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG012\",\"locator\":\"Printed p.100, 3DIC and TSMC-SoIC subsection\",\"notes\":\"The source says production, without explicitly labeling high volume; the observation preserves that qualification.\",\"value_text\":\"Qualified and started production in 2024.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "interposer_size_at_production_start", "period": "2024", "period_type": "milestone", "value": 3.5, "comparator": "equal", "unit": "reticle_equivalent_area", "product_or_technology": "CoWoS-L first generation", "scope": "initial_CoWoS_L_reconstituted_interposer", "status": "reported_actual", "source_id": "PKG012", "locator": "Printed p.100, CoWoS subsection", "notes": "The first CoWoS-L at 3.5-reticle size entered production in 2024. Reticle equivalent area measures interposer scale; it is not wafer volume or installed capacity. The 5.5-reticle version remained development in this report.", "value_text": "First 3.5-reticle CoWoS-L entered production in 2024.", "legacy_observation_id": "", "observation_id": "SCE001122", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "interposer_size_at_production_start", "metric_ko": "양산 시작 시 인터포저 크기", "native_comparator": "equal", "native_value": 3.5, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/static/annualReports/2024/english/ebook/files/basic-html/page102.html", "source_title": "TSMC 2024 Annual Report – 3DIC, SoIC and CoWoS", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"interposer_size_at_production_start\",\"period\":\"2024\",\"period_type\":\"milestone\",\"value\":3.5,\"comparator\":\"equal\",\"unit\":\"reticle_equivalent_area\",\"product_or_technology\":\"CoWoS-L first generation\",\"scope\":\"initial_CoWoS_L_reconstituted_interposer\",\"status\":\"reported_actual\",\"source_id\":\"PKG012\",\"locator\":\"Printed p.100, CoWoS subsection\",\"notes\":\"The first CoWoS-L at 3.5-reticle size entered production in 2024. Reticle equivalent area measures interposer scale; it is not wafer volume or installed capacity. The 5.5-reticle version remained development in this report.\",\"value_text\":\"First 3.5-reticle CoWoS-L entered production in 2024.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "capacity_ratio_target", "period": "2024-12-31", "period_type": "snapshot", "value": 2, "comparator": "equal", "unit": "times_reference_capacity", "product_or_technology": "CoWoS all variants", "scope": "company_CoWoS_capacity", "status": "company_forecast", "source_id": "PKG013", "locator": "Q&A, printed p.17 / PDF index16", "notes": "As of 2023-10-19, target to double capacity by end-2024. The comparison is to the then-referenced existing/2023 capacity; no exact reference date, absolute wafers/month or utilization was given. Do not interpret as realized annual 2024 capacity.", "legacy_observation_id": "", "observation_id": "SCE001123", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "capacity_ratio_target", "metric_ko": "생산능력 배율 목표", "native_comparator": "equal", "native_value": 2, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2023-10-19", "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/japanese/encrypt/files/encrypt_file/reports/2023-10/b2fc08165bbaf6fc1a2db26500e6f78f1db85ebd/TSMC%203Q23%20Transcript.pdf", "source_title": "TSMC 3Q2023 Earnings Conference Call Transcript", "source_publication_date": "2023-10-19", "available_date_verified": "2023-10-19", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"capacity_ratio_target\",\"period\":\"2024-12-31\",\"period_type\":\"snapshot\",\"value\":2,\"comparator\":\"equal\",\"unit\":\"times_reference_capacity\",\"product_or_technology\":\"CoWoS all variants\",\"scope\":\"company_CoWoS_capacity\",\"status\":\"company_forecast\",\"source_id\":\"PKG013\",\"locator\":\"Q&A, printed p.17 / PDF index16\",\"notes\":\"As of 2023-10-19, target to double capacity by end-2024. The comparison is to the then-referenced existing/2023 capacity; no exact reference date, absolute wafers/month or utilization was given. Do not interpret as realized annual 2024 capacity.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "annual_output_ratio_forecast", "period": "2024", "period_type": "annual", "value": null, "comparator": "greater_than", "unit": "times_2023_annual_output", "product_or_technology": "CoWoS all variants", "scope": "company_CoWoS_total_output", "status": "company_forecast", "source_id": "PKG013", "locator": "Q&A, printed p.17 / PDF index16", "notes": "Forward-looking as of 2023-10-19, despite conversational present tense: 2024 had not occurred. Output was forecast to exceed twice 2023, distinct from the end-2024 capacity target. No absolute package or wafer basis was disclosed.", "legacy_observation_id": "", "observation_id": "SCE001124", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "annual_output_ratio_forecast", "metric_ko": "연간 생산 배율 전망", "native_comparator": "greater_than", "native_value": 2, "value_min": 2, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2023-10-19", "record_kind": "numeric_bound", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/japanese/encrypt/files/encrypt_file/reports/2023-10/b2fc08165bbaf6fc1a2db26500e6f78f1db85ebd/TSMC%203Q23%20Transcript.pdf", "source_title": "TSMC 3Q2023 Earnings Conference Call Transcript", "source_publication_date": "2023-10-19", "available_date_verified": "2023-10-19", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"annual_output_ratio_forecast\",\"period\":\"2024\",\"period_type\":\"annual\",\"value\":2,\"comparator\":\"greater_than\",\"unit\":\"times_2023_annual_output\",\"product_or_technology\":\"CoWoS all variants\",\"scope\":\"company_CoWoS_total_output\",\"status\":\"company_forecast\",\"source_id\":\"PKG013\",\"locator\":\"Q&A, printed p.17 / PDF index16\",\"notes\":\"Forward-looking as of 2023-10-19, despite conversational present tense: 2024 had not occurred. Output was forecast to exceed twice 2023, distinct from the end-2024 capacity target. No absolute package or wafer basis was disclosed.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "capacity_ratio_to_prior_year_snapshot", "period": "2024-07-18", "period_type": "snapshot", "value": null, "comparator": "greater_than", "unit": "times_prior_year_referenced_capacity", "product_or_technology": "CoWoS all variants combined", "scope": "company_CoWoS_capacity_snapshot", "status": "reported_actual", "source_id": "PKG014", "locator": "Q&A, printed p.13 / PDF index12, lines 418–421", "notes": "Management said from last year to this year capacity had more than doubled. Recorded as a management-reported snapshot at the call date, not a closed-year annual average or realized end-2024 capacity. Comparison-date granularity is unspecified. Includes CoWoS-S/L/R together; no variant split or absolute monthly count disclosed.", "legacy_observation_id": "", "observation_id": "SCE001125", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "capacity_ratio_to_prior_year_snapshot", "metric_ko": "전년 기준 시점 대비 생산능력 배율", "native_comparator": "greater_than", "native_value": 2, "value_min": 2, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_bound", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/japanese/encrypt/files/encrypt_file/reports/2024-08/5122725a56670882d777a8e8bfe0ed247cc55330/TSMC%202Q24%20Transcript.pdf", "source_title": "TSMC 2Q2024 Earnings Conference Call Transcript", "source_publication_date": "2024-07-18", "available_date_verified": "2024-07-18", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"capacity_ratio_to_prior_year_snapshot\",\"period\":\"2024-07-18\",\"period_type\":\"snapshot\",\"value\":2,\"comparator\":\"greater_than\",\"unit\":\"times_prior_year_referenced_capacity\",\"product_or_technology\":\"CoWoS all variants combined\",\"scope\":\"company_CoWoS_capacity_snapshot\",\"status\":\"reported_actual\",\"source_id\":\"PKG014\",\"locator\":\"Q&A, printed p.13 / PDF index12, lines 418–421\",\"notes\":\"Management said from last year to this year capacity had more than doubled. Recorded as a management-reported snapshot at the call date, not a closed-year annual average or realized end-2024 capacity. Comparison-date granularity is unspecified. Includes CoWoS-S/L/R together; no variant split or absolute monthly count disclosed.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "capacity_ratio_target", "period": "2025", "period_type": "annual_target", "value": 2, "comparator": "equal", "unit": "times_2024_referenced_capacity", "product_or_technology": "CoWoS all variants combined", "scope": "company_CoWoS_capacity", "status": "company_forecast", "source_id": "PKG015", "locator": "Prepared remarks, printed p.5 / PDF index4", "notes": "As of 2025-04-17, management was working to double capacity in 2025. This is a plan/forecast for capacity, not reported full-year actual output. Baseline and endpoint are not stated as annual average versus year-end, so do not annualize or infer wafers/month.", "legacy_observation_id": "", "observation_id": "SCE001126", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "capacity_ratio_target", "metric_ko": "생산능력 배율 목표", "native_comparator": "equal", "native_value": 2, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2025-04-17", "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/english/encrypt/files/encrypt_file/reports/2025-04/7630274eecc1197a4e3ea6a415f44a47204fe10a/TSMC%201Q25%20Transcript.pdf", "source_title": "TSMC 1Q2025 Earnings Conference Call Transcript", "source_publication_date": "2025-04-17", "available_date_verified": "2025-04-17", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"capacity_ratio_target\",\"period\":\"2025\",\"period_type\":\"annual_target\",\"value\":2,\"comparator\":\"equal\",\"unit\":\"times_2024_referenced_capacity\",\"product_or_technology\":\"CoWoS all variants combined\",\"scope\":\"company_CoWoS_capacity\",\"status\":\"company_forecast\",\"source_id\":\"PKG015\",\"locator\":\"Prepared remarks, printed p.5 / PDF index4\",\"notes\":\"As of 2025-04-17, management was working to double capacity in 2025. This is a plan/forecast for capacity, not reported full-year actual output. Baseline and endpoint are not stated as annual average versus year-end, so do not annualize or infer wafers/month.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "advanced_packaging", "metric": "annual_design_capacity_estimate", "period": "2023-06-08", "period_type": "snapshot", "value": null, "comparator": "greater_than", "unit": "300mm_equivalent_3DFabric_process_wafers/year", "product_or_technology": "3DFabric shared SoIC/InFO/CoWoS", "scope": "Advanced_Backend_Fab_6_Zhunan", "status": "company_forecast", "source_id": "PKG016", "locator": "Press release, capacity paragraph, web line309", "notes": "Future estimated fab capability announced at opening; capacity horizon/full ramp date unspecified. More than one million 12-inch equivalent 3DFabric process wafers per year. Shared platform capacity cannot be assigned entirely to CoWoS, SoIC or InFO. These backend/stacking process equivalents are not frontend logic wafer starts, unique chips or observed 2023 shipments.", "legacy_observation_id": "", "observation_id": "SCE001127", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "annual_design_capacity_estimate", "metric_ko": "설계 연간 생산능력 추정", "native_comparator": "greater_than", "native_value": 1000000, "value_min": 1000000, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2023-06-08", "record_kind": "numeric_bound", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://pr.tsmc.com/japanese/news/3033", "source_title": "TSMC Announces Opening of Advanced Backend Fab 6", "source_publication_date": "2023-06-08", "available_date_verified": "2023-06-08", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"advanced_packaging\",\"metric\":\"annual_design_capacity_estimate\",\"period\":\"2023-06-08\",\"period_type\":\"snapshot\",\"value\":1000000,\"comparator\":\"greater_than\",\"unit\":\"300mm_equivalent_3DFabric_process_wafers/year\",\"product_or_technology\":\"3DFabric shared SoIC/InFO/CoWoS\",\"scope\":\"Advanced_Backend_Fab_6_Zhunan\",\"status\":\"company_forecast\",\"source_id\":\"PKG016\",\"locator\":\"Press release, capacity paragraph, web line309\",\"notes\":\"Future estimated fab capability announced at opening; capacity horizon/full ramp date unspecified. More than one million 12-inch equivalent 3DFabric process wafers per year. Shared platform capacity cannot be assigned entirely to CoWoS, SoIC or InFO. These backend/stacking process equivalents are not frontend logic wafer starts, unique chips or observed 2023 shipments.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "advanced_packaging", "metric": "technology_launch", "period": "2018", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "I-Cube2", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG017", "locator": "Retrospective launch-history paragraph, web line85", "notes": "Explicit retrospective date in the 2021 company release. Launch year is not a quantified production start or installed capacity.", "value_text": "I-Cube2 launched in 2018.", "legacy_observation_id": "", "observation_id": "SCE001128", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "technology_launch", "metric_ko": "기술 발표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-announces-availability-of-its-next-generation-2-5d-integration-solution-i-cube4-for-high-performance-applications", "source_title": "Samsung Announces Availability of I-Cube4 2.5D Integration", "source_publication_date": "2021-05-06", "available_date_verified": "2021-05-06", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"advanced_packaging\",\"metric\":\"technology_launch\",\"period\":\"2018\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"I-Cube2\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG017\",\"locator\":\"Retrospective launch-history paragraph, web line85\",\"notes\":\"Explicit retrospective date in the 2021 company release. Launch year is not a quantified production start or installed capacity.\",\"value_text\":\"I-Cube2 launched in 2018.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "advanced_packaging", "metric": "technology_availability", "period": "2020-08-13", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "X-Cube 7nm/5nm", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG018", "locator": "Availability and methodology paragraphs, web lines75–84", "notes": "Includes a 7nm test chip with SRAM stacked on logic using TSV. Availability does not establish mass production or shipment volume.", "value_text": "Silicon-proven 3D IC design methodology and flow became immediately available for 7nm and 5nm.", "legacy_observation_id": "", "observation_id": "SCE001129", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "technology_availability", "metric_ko": "기술 이용 가능 시점", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-announces-availability-of-its-silicon-proven-3d-ic-technology-for-high-performance-applications", "source_title": "Samsung Announces Silicon-Proven X-Cube 3D IC Availability", "source_publication_date": "2020-08-13", "available_date_verified": "2020-08-13", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"advanced_packaging\",\"metric\":\"technology_availability\",\"period\":\"2020-08-13\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"X-Cube 7nm/5nm\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG018\",\"locator\":\"Availability and methodology paragraphs, web lines75–84\",\"notes\":\"Includes a 7nm test chip with SRAM stacked on logic using TSV. Availability does not establish mass production or shipment volume.\",\"value_text\":\"Silicon-proven 3D IC design methodology and flow became immediately available for 7nm and 5nm.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "advanced_packaging", "metric": "technology_availability", "period": "2021-05-06", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "I-Cube4", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG017", "locator": "Immediate-availability paragraph, web lines73–83", "notes": "Four HBMs describes integration configuration, not four wafers or packaging throughput. No absolute capacity was stated.", "value_text": "Commercial 2.5D solution became immediately available, integrating four HBMs and one logic die.", "legacy_observation_id": "", "observation_id": "SCE001130", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "technology_availability", "metric_ko": "기술 이용 가능 시점", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-announces-availability-of-its-next-generation-2-5d-integration-solution-i-cube4-for-high-performance-applications", "source_title": "Samsung Announces Availability of I-Cube4 2.5D Integration", "source_publication_date": "2021-05-06", "available_date_verified": "2021-05-06", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"advanced_packaging\",\"metric\":\"technology_availability\",\"period\":\"2021-05-06\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"I-Cube4\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG017\",\"locator\":\"Immediate-availability paragraph, web lines73–83\",\"notes\":\"Four HBMs describes integration configuration, not four wafers or packaging throughput. No absolute capacity was stated.\",\"value_text\":\"Commercial 2.5D solution became immediately available, integrating four HBMs and one logic die.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "advanced_packaging", "metric": "volume_production_start", "period": "2017", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "EMIB 2.5D", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG019", "locator": "EMIB 2.5D, Production proven bullet", "notes": "Explicit retrospective company technology-page statement retrieved in 2026; original page publication date not verified.", "value_text": "EMIB entered mass production in 2017 with Intel and external silicon.", "legacy_observation_id": "", "observation_id": "SCE001131", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "volume_production_start", "metric_ko": "양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://www.intel.com/content/www/us/en/foundry/packaging.html", "source_title": "Intel Foundry Advanced Packaging Innovations", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"advanced_packaging\",\"metric\":\"volume_production_start\",\"period\":\"2017\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"EMIB 2.5D\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG019\",\"locator\":\"EMIB 2.5D, Production proven bullet\",\"notes\":\"Explicit retrospective company technology-page statement retrieved in 2026; original page publication date not verified.\",\"value_text\":\"EMIB entered mass production in 2017 with Intel and external silicon.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "advanced_packaging", "metric": "commercial_product_launch", "period": "2020-06-10", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "Foveros / Lakefield", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG020", "locator": "Main launch paragraph and packaging features", "notes": "Commercial product launch; source does not provide annual Foveros wafer or package output.", "value_text": "Lakefield Intel Core processors using Foveros 3D packaging launched.", "legacy_observation_id": "", "observation_id": "SCE001132", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "commercial_product_launch", "metric_ko": "상용 제품 발표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://www.intc.com/news-events/press-releases/detail/1078/intel-hybrid-processors-uncompromised-pc-experiences-for", "source_title": "Intel Launches Lakefield Hybrid Processors", "source_publication_date": "2020-06-10", "available_date_verified": "2020-06-10", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"advanced_packaging\",\"metric\":\"commercial_product_launch\",\"period\":\"2020-06-10\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"Foveros / Lakefield\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG020\",\"locator\":\"Main launch paragraph and packaging features\",\"notes\":\"Commercial product launch; source does not provide annual Foveros wafer or package output.\",\"value_text\":\"Lakefield Intel Core processors using Foveros 3D packaging launched.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "advanced_packaging", "metric": "commercial_product_launch", "period": "2023-12-14", "period_type": "milestone", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "Foveros / Core Ultra Meteor Lake", "scope": "technology_or_product_specific", "status": "reported_actual", "source_id": "PKG021", "locator": "Global availability and What It Does paragraphs", "notes": "Intel 4 refers to the compute process. Foveros is a packaging integration technology and not a process-node alias.", "value_text": "Core Ultra mobile processors using Foveros became globally available.", "legacy_observation_id": "", "observation_id": "SCE001133", "release_component": "process_packaging", "category_ko": "첨단 패키징", "native_metric": "commercial_product_launch", "metric_ko": "상용 제품 발표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/core-ultra-client-computing-news-1.html", "source_title": "Intel Core Ultra Ushers in the Age of the AI PC", "source_publication_date": "2023-12-14", "available_date_verified": "2023-12-14", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"advanced_packaging\",\"metric\":\"commercial_product_launch\",\"period\":\"2023-12-14\",\"period_type\":\"milestone\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"Foveros / Core Ultra Meteor Lake\",\"scope\":\"technology_or_product_specific\",\"status\":\"reported_actual\",\"source_id\":\"PKG021\",\"locator\":\"Global availability and What It Does paragraphs\",\"notes\":\"Intel 4 refers to the compute process. Foveros is a packaging integration technology and not a process-node alias.\",\"value_text\":\"Core Ultra mobile processors using Foveros became globally available.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "category": "memory_dram", "metric": "cost_per_bit_change_yoy", "period": "FY2017", "period_type": "fiscal_year", "value": -21, "comparator": "equal", "unit": "percent_yoy", "product_or_technology": "DRAM", "scope": "company DRAM products", "status": "reported_actual", "source_id": "MEM002", "locator": "Operating Results by Product—DRAM", "notes": "전년 회계연도 대비. 원문 gigabits sold/ASP per gigabit/cost per gigabit. 판매·매입된 DRAM도 포함할 수 있으며 wafer starts가 아님. MCP 제품은 당시 non-volatile/trade NAND 범주에 보고됨.", "legacy_observation_id": "", "observation_id": "SCE001143", "release_component": "dram_hbm", "category_ko": "DRAM", "native_metric": "cost_per_bit_change_yoy", "metric_ko": "비트당 원가 증감률 YoY", "native_comparator": "equal", "native_value": -21, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312517000131/a2017q4.htm", "source_title": "Micron FY2017 Form 10-K", "source_publication_date": "2017-10-26", "available_date_verified": "2017-10-26", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_dram\",\"metric\":\"cost_per_bit_change_yoy\",\"period\":\"FY2017\",\"period_type\":\"fiscal_year\",\"value\":-21,\"comparator\":\"equal\",\"unit\":\"percent_yoy\",\"product_or_technology\":\"DRAM\",\"scope\":\"company DRAM products\",\"status\":\"reported_actual\",\"source_id\":\"MEM002\",\"locator\":\"Operating Results by Product—DRAM\",\"notes\":\"전년 회계연도 대비. 원문 gigabits sold/ASP per gigabit/cost per gigabit. 판매·매입된 DRAM도 포함할 수 있으며 wafer starts가 아님. MCP 제품은 당시 non-volatile/trade NAND 범주에 보고됨.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "category": "memory_dram", "metric": "bit_shipments_growth_yoy", "period": "FY2026", "period_type": "fiscal_year", "value": null, "comparator": "approximately", "unit": "percent_yoy", "product_or_technology": "DRAM", "scope": "company DRAM products", "status": "reported_actual", "source_id": "MEM009", "locator": "MD&A—Total Revenue", "notes": "공시의 언어적 구간을 보존. 대표값이나 임의 min/max를 부여하지 않음. bit shipments는 절대 생산량 또는 wafer starts가 아님. FY2026은 2026-09-03 종료 53주 회계연도.", "value_text": "increase in mid-20% range", "legacy_observation_id": "", "observation_id": "SCE001158", "release_component": "dram_hbm", "category_ko": "DRAM", "native_metric": "bit_shipments_growth_yoy", "metric_ko": "비트 출하 증감률 YoY", "native_comparator": "approximately", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron FY2026 Form 10-K", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_dram\",\"metric\":\"bit_shipments_growth_yoy\",\"period\":\"FY2026\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"approximately\",\"unit\":\"percent_yoy\",\"product_or_technology\":\"DRAM\",\"scope\":\"company DRAM products\",\"status\":\"reported_actual\",\"source_id\":\"MEM009\",\"locator\":\"MD&A—Total Revenue\",\"notes\":\"공시의 언어적 구간을 보존. 대표값이나 임의 min/max를 부여하지 않음. bit shipments는 절대 생산량 또는 wafer starts가 아님. FY2026은 2026-09-03 종료 53주 회계연도.\",\"value_text\":\"increase in mid-20% range\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "SK_HYNIX", "category": "memory_dram", "metric": "bit_shipments_growth_yoy", "period": "2025-H1", "period_type": "calendar_half_year", "value": 15, "comparator": "approximately", "unit": "percent_yoy", "product_or_technology": "DRAM including HBM", "scope": "company DRAM products", "status": "reported_actual", "source_id": "MEM010", "locator": "Results of Operations—H12025 vsH12024, printed pp42–43", "notes": "ASP는 USD 기준. HBM premium mix와 수요 영향. 해당기간 절대 wafer-input으로 역산하지 않음.", "legacy_observation_id": "", "observation_id": "SCE001163", "release_component": "dram_hbm", "category_ko": "DRAM", "native_metric": "bit_shipments_growth_yoy", "metric_ko": "비트 출하 증감률 YoY", "native_comparator": "approximately", "native_value": 15, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "source_url": "https://links.sgx.com/FileOpen/SK%20hynix%20Inc._2025%20-%20Final%20Offering%20Circular%20%289.4.25%29.ashx?App=Prospectus&FileID=67332", "source_title": "SK hynix 2025 Final Offering Circular", "source_publication_date": "2025-09-04", "available_date_verified": "2025-09-04", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"sk_hynix\",\"category\":\"memory_dram\",\"metric\":\"bit_shipments_growth_yoy\",\"period\":\"2025-H1\",\"period_type\":\"calendar_half_year\",\"value\":15,\"comparator\":\"approximately\",\"unit\":\"percent_yoy\",\"product_or_technology\":\"DRAM including HBM\",\"scope\":\"company DRAM products\",\"status\":\"reported_actual\",\"source_id\":\"MEM010\",\"locator\":\"Results of Operations—H12025 vsH12024, printed pp42–43\",\"notes\":\"ASP는 USD 기준. HBM premium mix와 수요 영향. 해당기간 절대 wafer-input으로 역산하지 않음.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "SAMSUNG", "category": "memory_dram", "metric": "bit_shipments_growth_qoq", "period": "2024-Q4", "period_type": "calendar_quarter", "value": null, "comparator": "approximately", "unit": "percent_qoq", "product_or_technology": "DRAM", "scope": "company DRAM products", "status": "reported_actual", "source_id": "MEM011", "locator": "Q&A PDF p25", "notes": "전분기 대비. 출하 bits 감소는 웨이퍼 생산량 감소와 동일하지 않음.", "value_text": "decline by a low-teens percentage", "legacy_observation_id": "", "observation_id": "SCE001165", "release_component": "dram_hbm", "category_ko": "DRAM", "native_metric": "bit_shipments_growth_qoq", "metric_ko": "비트 출하 증감률 QoQ", "native_comparator": "approximately", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://irsvc.teletogether.com/sec/pdf/2024Q4_script_eng.pdf?1=", "source_title": "Samsung Electronics CY2024 Q4 Earnings Call script", "source_publication_date": "2025-01-31", "available_date_verified": "2025-01-31", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"samsung\",\"category\":\"memory_dram\",\"metric\":\"bit_shipments_growth_qoq\",\"period\":\"2024-Q4\",\"period_type\":\"calendar_quarter\",\"value\":null,\"comparator\":\"approximately\",\"unit\":\"percent_qoq\",\"product_or_technology\":\"DRAM\",\"scope\":\"company DRAM products\",\"status\":\"reported_actual\",\"source_id\":\"MEM011\",\"locator\":\"Q&A PDF p25\",\"notes\":\"전분기 대비. 출하 bits 감소는 웨이퍼 생산량 감소와 동일하지 않음.\",\"value_text\":\"decline by a low-teens percentage\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "memory_dram", "metric": "asp_change_qoq", "period": "2024-Q4", "period_type": "calendar_quarter", "value": 20, "comparator": "approximately", "unit": "percent_qoq", "product_or_technology": "DRAM", "scope": "company DRAM products", "status": "reported_actual", "source_id": "MEM011", "locator": "Q&A PDF p25", "notes": "", "legacy_observation_id": "", "observation_id": "SCE001166", "release_component": "dram_hbm", "category_ko": "DRAM", "native_metric": "asp_change_qoq", "metric_ko": "비트당 ASP 증감률 QoQ", "native_comparator": "approximately", "native_value": 20, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://irsvc.teletogether.com/sec/pdf/2024Q4_script_eng.pdf?1=", "source_title": "Samsung Electronics CY2024 Q4 Earnings Call script", "source_publication_date": "2025-01-31", "available_date_verified": "2025-01-31", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"samsung\",\"category\":\"memory_dram\",\"metric\":\"asp_change_qoq\",\"period\":\"2024-Q4\",\"period_type\":\"calendar_quarter\",\"value\":20,\"comparator\":\"approximately\",\"unit\":\"percent_qoq\",\"product_or_technology\":\"DRAM\",\"scope\":\"company DRAM products\",\"status\":\"reported_actual\",\"source_id\":\"MEM011\",\"locator\":\"Q&A PDF p25\",\"notes\":\"\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_yoy", "period": "FY2018", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND as presented in FY2019 10-K", "status": "reported_actual", "source_id": "NAND04", "locator": "printed p.32 Total Revenue", "notes": "FY2018 원공시 Trade NAND 약40%와 범위가 다르므로 같은 시계열 행을 대체하거나 중복 합산하지 않음.", "value_text": "approximately 30% increase", "legacy_observation_id": "", "observation_id": "SCE001288", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_yoy", "metric_ko": "비트 출하 증감률 YoY", "native_comparator": "previous_year", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312519000094/a2019q4.htm", "source_title": "Micron FY2019 Form 10-K", "source_publication_date": "2019-10-17", "available_date_verified": "2019-10-17", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_yoy\",\"period\":\"FY2018\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"previous_year\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND as presented in FY2019 10-K\",\"status\":\"reported_actual\",\"source_id\":\"NAND04\",\"locator\":\"printed p.32 Total Revenue\",\"notes\":\"FY2018 원공시 Trade NAND 약40%와 범위가 다르므로 같은 시계열 행을 대체하거나 중복 합산하지 않음.\",\"value_text\":\"approximately 30% increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "category": "memory_nand", "metric": "asp_change_yoy", "period": "FY2023", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND06", "locator": "printed p.46 Total Revenue", "notes": "비트당 평균판매가격 증감이며 웨이퍼 장수 또는 생산 증가율이 아님.", "value_text": "low-50s percent range decline", "legacy_observation_id": "", "observation_id": "SCE001298", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "asp_growth_yoy", "metric_ko": "비트당 ASP 증감률 YoY", "native_comparator": "previous_year", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312523000054/mu-20230831.htm", "source_title": "Micron FY2023 Form 10-K", "source_publication_date": "2023-10-06", "available_date_verified": "2023-10-06", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"asp_growth_yoy\",\"period\":\"FY2023\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"previous_year\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND06\",\"locator\":\"printed p.46 Total Revenue\",\"notes\":\"비트당 평균판매가격 증감이며 웨이퍼 장수 또는 생산 증가율이 아님.\",\"value_text\":\"low-50s percent range decline\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_yoy", "period": "FY2024", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND07", "locator": "printed p.52 Total Revenue", "notes": "비트 출하 증가율이며 웨이퍼 장수 또는 생산 증가율이 아님.", "value_text": "low-30% range increase", "legacy_observation_id": "", "observation_id": "SCE001299", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_yoy", "metric_ko": "비트 출하 증감률 YoY", "native_comparator": "previous_year", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron FY2025 Form 10-K", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_yoy\",\"period\":\"FY2024\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"previous_year\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND07\",\"locator\":\"printed p.52 Total Revenue\",\"notes\":\"비트 출하 증가율이며 웨이퍼 장수 또는 생산 증가율이 아님.\",\"value_text\":\"low-30% range increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_yoy", "period": "FY2026", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND08", "locator": "printed p.56 Total Revenue", "notes": "2026-09-03 종료 53주 회계연도. 달력연도2026 전체 실적이 아니며 전년52주와 주수 차이 존재. 수량은 비트 출하 증감.", "value_text": "mid-20% range increase", "legacy_observation_id": "", "observation_id": "SCE001302", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_yoy", "metric_ko": "비트 출하 증감률 YoY", "native_comparator": "previous_year", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron FY2026 Form 10-K", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_yoy\",\"period\":\"FY2026\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"previous_year\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND08\",\"locator\":\"printed p.56 Total Revenue\",\"notes\":\"2026-09-03 종료 53주 회계연도. 달력연도2026 전체 실적이 아니며 전년52주와 주수 차이 존재. 수량은 비트 출하 증감.\",\"value_text\":\"mid-20% range increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "asp_change_yoy", "period": "FY2026", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND08", "locator": "printed p.56 Total Revenue", "notes": "2026-09-03 종료 53주 회계연도. 달력연도2026 전체 실적이 아니며 전년52주와 주수 차이 존재. 비트당 평균판매가격 증감.", "value_text": "approximately 200% increase", "legacy_observation_id": "", "observation_id": "SCE001303", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "asp_growth_yoy", "metric_ko": "비트당 ASP 증감률 YoY", "native_comparator": "previous_year", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_year", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron FY2026 Form 10-K", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"asp_growth_yoy\",\"period\":\"FY2026\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"previous_year\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND08\",\"locator\":\"printed p.56 Total Revenue\",\"notes\":\"2026-09-03 종료 53주 회계연도. 달력연도2026 전체 실적이 아니며 전년52주와 주수 차이 존재. 비트당 평균판매가격 증감.\",\"value_text\":\"approximately 200% increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_qoq", "period": "FY2024Q1", "period_type": "fiscal_quarter", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND09", "locator": "printed p.27 Total Revenue", "notes": "회계분기 종료 2023-11-30. 비트 출하 증감이며 웨이퍼 장수 미공개.", "value_text": "mid-teens percent range decrease", "legacy_observation_id": "", "observation_id": "SCE001304", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_qoq", "metric_ko": "비트 출하 증감률 QoQ", "native_comparator": "previous_quarter", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312523000077/mu-20231130.htm", "source_title": "Micron FY2024Q1 Form 10-Q", "source_publication_date": "2023-12-21", "available_date_verified": "2023-12-21", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_qoq\",\"period\":\"FY2024Q1\",\"period_type\":\"fiscal_quarter\",\"value\":null,\"comparator\":\"previous_quarter\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND09\",\"locator\":\"printed p.27 Total Revenue\",\"notes\":\"회계분기 종료 2023-11-30. 비트 출하 증감이며 웨이퍼 장수 미공개.\",\"value_text\":\"mid-teens percent range decrease\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "asp_change_qoq", "period": "FY2024Q1", "period_type": "fiscal_quarter", "value": 20, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND09", "locator": "printed p.27 Total Revenue", "notes": "회계분기 종료 2023-11-30. ASP20%는 원문 approximate이므로 대략값. 비트당 평균판매가격 증감이며 웨이퍼 장수 미공개.", "legacy_observation_id": "", "observation_id": "SCE001305", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "asp_growth_qoq", "metric_ko": "비트당 ASP 증감률 QoQ", "native_comparator": "previous_quarter", "native_value": 20, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312523000077/mu-20231130.htm", "source_title": "Micron FY2024Q1 Form 10-Q", "source_publication_date": "2023-12-21", "available_date_verified": "2023-12-21", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"asp_growth_qoq\",\"period\":\"FY2024Q1\",\"period_type\":\"fiscal_quarter\",\"value\":20,\"comparator\":\"previous_quarter\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND09\",\"locator\":\"printed p.27 Total Revenue\",\"notes\":\"회계분기 종료 2023-11-30. ASP20%는 원문 approximate이므로 대략값. 비트당 평균판매가격 증감이며 웨이퍼 장수 미공개.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_qoq", "period": "FY2024Q2", "period_type": "fiscal_quarter", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND10", "locator": "printed p.29 Total Revenue", "notes": "회계분기 종료 2024-02-29. 비트 출하 증감이며 웨이퍼 장수 미공개.", "value_text": "low-single-digit percent range decrease", "legacy_observation_id": "", "observation_id": "SCE001306", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_qoq", "metric_ko": "비트 출하 증감률 QoQ", "native_comparator": "previous_quarter", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312524000007/mu-20240229.htm", "source_title": "Micron FY2024Q2 Form 10-Q", "source_publication_date": "2024-03-21", "available_date_verified": "2024-03-21", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_qoq\",\"period\":\"FY2024Q2\",\"period_type\":\"fiscal_quarter\",\"value\":null,\"comparator\":\"previous_quarter\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND10\",\"locator\":\"printed p.29 Total Revenue\",\"notes\":\"회계분기 종료 2024-02-29. 비트 출하 증감이며 웨이퍼 장수 미공개.\",\"value_text\":\"low-single-digit percent range decrease\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "asp_change_qoq", "period": "FY2024Q2", "period_type": "fiscal_quarter", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND10", "locator": "printed p.29 Total Revenue", "notes": "회계분기 종료 2024-02-29. 비트당 평균판매가격 증감이며 웨이퍼 장수 미공개.", "value_text": "low-30% range increase", "legacy_observation_id": "", "observation_id": "SCE001307", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "asp_growth_qoq", "metric_ko": "비트당 ASP 증감률 QoQ", "native_comparator": "previous_quarter", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312524000007/mu-20240229.htm", "source_title": "Micron FY2024Q2 Form 10-Q", "source_publication_date": "2024-03-21", "available_date_verified": "2024-03-21", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"asp_growth_qoq\",\"period\":\"FY2024Q2\",\"period_type\":\"fiscal_quarter\",\"value\":null,\"comparator\":\"previous_quarter\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND10\",\"locator\":\"printed p.29 Total Revenue\",\"notes\":\"회계분기 종료 2024-02-29. 비트당 평균판매가격 증감이며 웨이퍼 장수 미공개.\",\"value_text\":\"low-30% range increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "memory_nand", "metric": "bit_shipments_growth_qoq", "period": "FY2024Q3", "period_type": "fiscal_quarter", "value": null, "comparator": "equal", "unit": "percent", "product_or_technology": "NAND", "scope": "NAND consolidated", "status": "reported_actual", "source_id": "NAND11", "locator": "printed p.30 Total Revenue", "notes": "회계분기 종료 2024-05-30. 비트 출하 증감이며 웨이퍼 장수 미공개.", "value_text": "high-single-digit percent range increase", "legacy_observation_id": "", "observation_id": "SCE001308", "release_component": "nand_storage", "category_ko": "NAND·저장장치", "native_metric": "bit_shipments_growth_qoq", "metric_ko": "비트 출하 증감률 QoQ", "native_comparator": "previous_quarter", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "previous_quarter", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "qualitative", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312524000019/mu-20240530.htm", "source_title": "Micron FY2024Q3 Form 10-Q", "source_publication_date": "2024-06-27", "available_date_verified": "2024-06-27", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"micron\",\"category\":\"memory_nand\",\"metric\":\"bit_shipments_growth_qoq\",\"period\":\"FY2024Q3\",\"period_type\":\"fiscal_quarter\",\"value\":null,\"comparator\":\"previous_quarter\",\"unit\":\"percent\",\"product_or_technology\":\"NAND\",\"scope\":\"NAND consolidated\",\"status\":\"reported_actual\",\"source_id\":\"NAND11\",\"locator\":\"printed p.30 Total Revenue\",\"notes\":\"회계분기 종료 2024-05-30. 비트 출하 증감이며 웨이퍼 장수 미공개.\",\"value_text\":\"high-single-digit percent range increase\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "ASML", "category": "equipment_installed_base", "metric": "prototype_systems_shipment_milestone", "period": "2006-08", "period_type": "event_month", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "EUV Alpha Demo Tool", "scope": "Global; demo tools for SUNY/CNSE Albany and imec Leuven", "status": "reported_actual", "source_id": "EUV002", "locator": "How EUV lithography was developed", "notes": "장비 정수 대수를 해당 문장에서 별도로 집계하지 않았다. HVM 장비가 아니다.", "value_text": "Prototype EUV demo tools shipped to research institutions", "legacy_observation_id": "", "observation_id": "SCE001393", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "prototype_systems_shipment_milestone", "metric_ko": "시제품 장비 출하 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ASML Holding N.V.", "source_url": "https://www.asml.com/en/products/euv-lithography-systems", "source_title": "EUV lithography systems – Products", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"prototype_systems_shipment_milestone\",\"period\":\"2006-08\",\"period_type\":\"event_month\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"EUV Alpha Demo Tool\",\"scope\":\"Global; demo tools for SUNY/CNSE Albany and imec Leuven\",\"status\":\"reported_actual\",\"source_id\":\"EUV002\",\"locator\":\"How EUV lithography was developed\",\"notes\":\"장비 정수 대수를 해당 문장에서 별도로 집계하지 않았다. HVM 장비가 아니다.\",\"value_text\":\"Prototype EUV demo tools shipped to research institutions\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "first_production_model_shipment_milestone", "period": "2013", "period_type": "event_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN NXE:3300", "scope": "Global first shipment of the production-model platform", "status": "reported_actual", "source_id": "EUV001", "locator": "Achieving first light", "notes": "모델의 production system이라는 표현은 고객의 2013년 상업 제품 HVM을 뜻하지 않는다.", "value_text": "First NXE:3300 production system shipped", "legacy_observation_id": "", "observation_id": "SCE001394", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_production_model_shipment_milestone", "metric_ko": "첫 생산용 모델 출하 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ASML Holding N.V.", "source_url": "https://www.asml.com/en/company/stories/2022/making-euv-lab-to-fab", "source_title": "Making EUV: from lab to fab", "source_publication_date": "2022-03-30", "available_date_verified": "2022-03-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"first_production_model_shipment_milestone\",\"period\":\"2013\",\"period_type\":\"event_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN NXE:3300\",\"scope\":\"Global first shipment of the production-model platform\",\"status\":\"reported_actual\",\"source_id\":\"EUV001\",\"locator\":\"Achieving first light\",\"notes\":\"모델의 production system이라는 표현은 고객의 2013년 상업 제품 HVM을 뜻하지 않는다.\",\"value_text\":\"First NXE:3300 production system shipped\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "cumulative_systems_shipped", "period": "2020-12", "period_type": "cumulative_milestone", "value": 100, "comparator": "equal", "unit": "systems", "product_or_technology": "EUV NXE", "scope": "Global cumulative EUV shipments; customer unspecified", "status": "reported_actual", "source_id": "EUV001", "locator": "EUV is here to stay; 100th shipment photo caption", "notes": "2020년 12월 100번째 출하라는 ASML의 2022년 상세 회고·사진 설명을 채택. EUV002의 현재 제품 페이지는 beginning of 2020으로 달리 적어 날짜 상충을 보존한다. 연간 출하량 또는 설치 대수가 아니다.", "legacy_observation_id": "", "observation_id": "SCE001395", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "cumulative_systems_shipped", "metric_ko": "누적 장비 출하 수", "native_comparator": "equal", "native_value": 100, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ASML Holding N.V.", "source_url": "https://www.asml.com/en/company/stories/2022/making-euv-lab-to-fab", "source_title": "Making EUV: from lab to fab", "source_publication_date": "2022-03-30", "available_date_verified": "2022-03-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"cumulative_systems_shipped\",\"period\":\"2020-12\",\"period_type\":\"cumulative_milestone\",\"value\":100,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"EUV NXE\",\"scope\":\"Global cumulative EUV shipments; customer unspecified\",\"status\":\"reported_actual\",\"source_id\":\"EUV001\",\"locator\":\"EUV is here to stay; 100th shipment photo caption\",\"notes\":\"2020년 12월 100번째 출하라는 ASML의 2022년 상세 회고·사진 설명을 채택. EUV002의 현재 제품 페이지는 beginning of 2020으로 달리 적어 날짜 상충을 보존한다. 연간 출하량 또는 설치 대수가 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "systems_in_use_at_customer_locations", "period": "2021-12-31", "period_type": "point_in_time", "value": 127, "comparator": "equal", "unit": "systems", "product_or_technology": "Latest-generation EUV machines", "scope": "Worldwide customer sites; latest-generation systems in use", "status": "reported_actual", "source_id": "EUV001", "locator": "EUV is here to stay", "notes": "'latest-generation'이라는 원문 범위를 유지. 모든 시제품을 포함한 총 누적 제조·판매·설치 대수와 같다고 볼 수 없다.", "legacy_observation_id": "", "observation_id": "SCE001396", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "systems_in_use_at_customer_locations", "metric_ko": "고객 현장 사용 중 장비 수", "native_comparator": "equal", "native_value": 127, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ASML Holding N.V.", "source_url": "https://www.asml.com/en/company/stories/2022/making-euv-lab-to-fab", "source_title": "Making EUV: from lab to fab", "source_publication_date": "2022-03-30", "available_date_verified": "2022-03-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"systems_in_use_at_customer_locations\",\"period\":\"2021-12-31\",\"period_type\":\"point_in_time\",\"value\":127,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"Latest-generation EUV machines\",\"scope\":\"Worldwide customer sites; latest-generation systems in use\",\"status\":\"reported_actual\",\"source_id\":\"EUV001\",\"locator\":\"EUV is here to stay\",\"notes\":\"'latest-generation'이라는 원문 범위를 유지. 모든 시제품을 포함한 총 누적 제조·판매·설치 대수와 같다고 볼 수 없다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "cumulative_high_na_systems_shipped", "period": "2025-Q1", "period_type": "cumulative_milestone", "value": 5, "comparator": "equal", "unit": "systems", "product_or_technology": "High NA EUV; EXE platform", "scope": "Global cumulative High NA shipments by Q1 2025", "status": "reported_actual", "source_id": "EUV011", "locator": "CEO statement and outlook", "notes": "5대는 해당 분기 출하량이 아니라 다섯 번째 장비까지의 누적 출하 이정표. 고객별 배분, 인수·가동 완료는 불명.", "legacy_observation_id": "", "observation_id": "SCE001397", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "cumulative_high_na_systems_shipped", "metric_ko": "High-NA 누적 출하 수", "native_comparator": "equal", "native_value": 5, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ASML Holding N.V.", "source_url": "https://investor.asml.com/news-releases/news-release-details/q1-2025-financial-results", "source_title": "ASML Q1 2025 financial results", "source_publication_date": "2025-04-16", "available_date_verified": "2025-04-16", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"cumulative_high_na_systems_shipped\",\"period\":\"2025-Q1\",\"period_type\":\"cumulative_milestone\",\"value\":5,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"High NA EUV; EXE platform\",\"scope\":\"Global cumulative High NA shipments by Q1 2025\",\"status\":\"reported_actual\",\"source_id\":\"EUV011\",\"locator\":\"CEO statement and outlook\",\"notes\":\"5대는 해당 분기 출하량이 아니라 다섯 번째 장비까지의 누적 출하 이정표. 고객별 배분, 인수·가동 완료는 불명.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "customers_with_high_na_systems", "period": "2025-04-16", "period_type": "point_in_time", "value": 3, "comparator": "equal", "unit": "customers", "product_or_technology": "High NA EUV; EXE platform", "scope": "Global customers at whose sites these systems were located", "status": "reported_actual", "source_id": "EUV011", "locator": "CEO statement and outlook", "notes": "고객 이름을 이 수치에서 추론하지 않는다. 3은 장비 대수가 아니다.", "legacy_observation_id": "", "observation_id": "SCE001398", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "customers_with_high_na_systems", "metric_ko": "High-NA 장비 도입 고객 수", "native_comparator": "equal", "native_value": 3, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ASML Holding N.V.", "source_url": "https://investor.asml.com/news-releases/news-release-details/q1-2025-financial-results", "source_title": "ASML Q1 2025 financial results", "source_publication_date": "2025-04-16", "available_date_verified": "2025-04-16", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"customers_with_high_na_systems\",\"period\":\"2025-04-16\",\"period_type\":\"point_in_time\",\"value\":3,\"comparator\":\"equal\",\"unit\":\"customers\",\"product_or_technology\":\"High NA EUV; EXE platform\",\"scope\":\"Global customers at whose sites these systems were located\",\"status\":\"reported_actual\",\"source_id\":\"EUV011\",\"locator\":\"CEO statement and outlook\",\"notes\":\"고객 이름을 이 수치에서 추론하지 않는다. 3은 장비 대수가 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "ASML", "category": "equipment_installed_base", "metric": "first_model_shipment_event_quantity", "period": "2025-04", "period_type": "event_month", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "TWINSCAN EXE:5200B", "scope": "First EXE:5200B shipment event; destination not disclosed in cited passage", "status": "reported_actual", "source_id": "EUV012", "locator": "Our products and services p.19", "notes": "4월 초 첫 EXE:5200B 출하. 고객 배분이나 설치·수락을 이 기록에서 확정하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001399", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_model_shipment_event_quantity", "metric_ko": "첫 모델 출하 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ASML Holding N.V.", "source_url": "https://www.sec.gov/Archives/edgar/data/937966/000162828026011378/asml-20251231.htm", "source_title": "ASML Annual Report 2025", "source_publication_date": "2026-02-25", "available_date_verified": "2026-02-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"ASML\",\"category\":\"equipment_installed_base\",\"metric\":\"first_model_shipment_event_quantity\",\"period\":\"2025-04\",\"period_type\":\"event_month\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"TWINSCAN EXE:5200B\",\"scope\":\"First EXE:5200B shipment event; destination not disclosed in cited passage\",\"status\":\"reported_actual\",\"source_id\":\"EUV012\",\"locator\":\"Our products and services p.19\",\"notes\":\"4월 초 첫 EXE:5200B 출하. 고객 배분이나 설치·수락을 이 기록에서 확정하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "purchase_order_milestone", "period": "2018", "period_type": "event_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN EXE:5000 High NA EUV", "scope": "Intel; order only, destination not given", "status": "reported_actual", "source_id": "EUV004", "locator": "Paragraph beginning 'Intel announced at its Accelerated event'", "notes": "2022년 공동 발표의 과거 회고. 'purchase'는 주문·구매 이력이며 인도 또는 설치 완료가 아니다.", "value_text": "Intel became the first purchaser of EXE:5000", "legacy_observation_id": "", "observation_id": "SCE001400", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "purchase_order_milestone", "metric_ko": "장비 구매 주문 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://investor.asml.com/news-releases/news-release-details/intel-and-asml-strengthen-their-collaboration-drive-high-na-manufacturing-2025", "source_title": "Intel and ASML strengthen their collaboration to drive High-NA into manufacturing in 2025", "source_publication_date": "2022-01-19", "available_date_verified": "2022-01-19", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"purchase_order_milestone\",\"period\":\"2018\",\"period_type\":\"event_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN EXE:5000 High NA EUV\",\"scope\":\"Intel; order only, destination not given\",\"status\":\"reported_actual\",\"source_id\":\"EUV004\",\"locator\":\"Paragraph beginning 'Intel announced at its Accelerated event'\",\"notes\":\"2022년 공동 발표의 과거 회고. 'purchase'는 주문·구매 이력이며 인도 또는 설치 완료가 아니다.\",\"value_text\":\"Intel became the first purchaser of EXE:5000\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "purchase_order_milestone", "period": "2022-01-19", "period_type": "event_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN EXE:5200 High NA EUV", "scope": "Intel; first purchase order for the model", "status": "reported_actual", "source_id": "EUV004", "locator": "Opening news and first purchase-order paragraph", "notes": "정확한 계약 총 대수는 공개하지 않았다. 모델명을 후속 EXE:5200B로 임의 치환하지 않는다.", "value_text": "First purchase order for EXE:5200 issued", "legacy_observation_id": "", "observation_id": "SCE001401", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "purchase_order_milestone", "metric_ko": "장비 구매 주문 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://investor.asml.com/news-releases/news-release-details/intel-and-asml-strengthen-their-collaboration-drive-high-na-manufacturing-2025", "source_title": "Intel and ASML strengthen their collaboration to drive High-NA into manufacturing in 2025", "source_publication_date": "2022-01-19", "available_date_verified": "2022-01-19", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"purchase_order_milestone\",\"period\":\"2022-01-19\",\"period_type\":\"event_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN EXE:5200 High NA EUV\",\"scope\":\"Intel; first purchase order for the model\",\"status\":\"reported_actual\",\"source_id\":\"EUV004\",\"locator\":\"Opening news and first purchase-order paragraph\",\"notes\":\"정확한 계약 총 대수는 공개하지 않았다. 모델명을 후속 EXE:5200B로 임의 치환하지 않는다.\",\"value_text\":\"First purchase order for EXE:5200 issued\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "high_na_production_adoption_target", "period": "2025", "period_type": "target_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV", "scope": "Intel planned production manufacturing as stated Jan.2022", "status": "announced_plan", "source_id": "EUV004", "locator": "Paragraph beginning 'Intel announced at its Accelerated event'", "notes": "당시 계획을 보존한다. 2025년 실제 HVM 달성 기록이 아니며 EUV009의 2026년 실제 적용과 구분.", "value_text": "Planned High NA production manufacturing beginning in 2025", "legacy_observation_id": "", "observation_id": "SCE001402", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_production_adoption_target", "metric_ko": "High-NA 생산 도입 목표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2022-01-19", "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://investor.asml.com/news-releases/news-release-details/intel-and-asml-strengthen-their-collaboration-drive-high-na-manufacturing-2025", "source_title": "Intel and ASML strengthen their collaboration to drive High-NA into manufacturing in 2025", "source_publication_date": "2022-01-19", "available_date_verified": "2022-01-19", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"high_na_production_adoption_target\",\"period\":\"2025\",\"period_type\":\"target_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV\",\"scope\":\"Intel planned production manufacturing as stated Jan.2022\",\"status\":\"announced_plan\",\"source_id\":\"EUV004\",\"locator\":\"Paragraph beginning 'Intel announced at its Accelerated event'\",\"notes\":\"당시 계획을 보존한다. 2025년 실제 HVM 달성 기록이 아니며 EUV009의 2026년 실제 적용과 구분.\",\"value_text\":\"Planned High NA production manufacturing beginning in 2025\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "first_site_system_delivery_event_quantity", "period": "2022", "period_type": "event_year", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "Low NA EUV scanner; model not specified", "scope": "Ireland Fab 34 first EUV delivery", "status": "reported_actual", "source_id": "EUV006", "locator": "PDF p.1 opening paragraph", "notes": "Fab 34 최초 한 대 인도 사건이다. Intel 글로벌 보유 대수 1대라는 뜻이 아니다.", "legacy_observation_id": "", "observation_id": "SCE001403", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_site_system_delivery_event_quantity", "metric_ko": "사업장 최초 장비 인도 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Intel", "source_url": "https://download.intel.com/newsroom/archive/2025/en-us-2022-12-22-first-euv-light-marks-intel-4-milestone-in-ireland.pdf", "source_title": "First EUV Light Marks Intel 4 Milestone in Ireland", "source_publication_date": "2022-12-22", "available_date_verified": "2022-12-22", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"first_site_system_delivery_event_quantity\",\"period\":\"2022\",\"period_type\":\"event_year\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"Low NA EUV scanner; model not specified\",\"scope\":\"Ireland Fab 34 first EUV delivery\",\"status\":\"reported_actual\",\"source_id\":\"EUV006\",\"locator\":\"PDF p.1 opening paragraph\",\"notes\":\"Fab 34 최초 한 대 인도 사건이다. Intel 글로벌 보유 대수 1대라는 뜻이 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "euv_first_light_milestone", "period": "2022-12", "period_type": "event_month", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "Low NA EUV / Intel 4", "scope": "Ireland Fab 34 Leixlip", "status": "reported_actual", "source_id": "EUV006", "locator": "PDF p.1 opening paragraphs", "notes": "발표는 this week라고 하므로 정확한 일자는 임의 부여하지 않았다. 첫 발광은 HVM 개시가 아니다.", "value_text": "First EUV light generated during the week of the Dec.22 announcement", "legacy_observation_id": "", "observation_id": "SCE001404", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_first_light_milestone", "metric_ko": "EUV 최초 발광 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://download.intel.com/newsroom/archive/2025/en-us-2022-12-22-first-euv-light-marks-intel-4-milestone-in-ireland.pdf", "source_title": "First EUV Light Marks Intel 4 Milestone in Ireland", "source_publication_date": "2022-12-22", "available_date_verified": "2022-12-22", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"euv_first_light_milestone\",\"period\":\"2022-12\",\"period_type\":\"event_month\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"Low NA EUV / Intel 4\",\"scope\":\"Ireland Fab 34 Leixlip\",\"status\":\"reported_actual\",\"source_id\":\"EUV006\",\"locator\":\"PDF p.1 opening paragraphs\",\"notes\":\"발표는 this week라고 하므로 정확한 일자는 임의 부여하지 않았다. 첫 발광은 HVM 개시가 아니다.\",\"value_text\":\"First EUV light generated during the week of the Dec.22 announcement\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "euv_high_volume_manufacturing_start", "period": "2023-09-29", "period_type": "event_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "Intel 4; Low NA EUV", "scope": "Ireland Fab 34 Leixlip", "status": "reported_actual", "source_id": "EUV007", "locator": "Opening event description", "notes": "Intel 전체 최초 EUV 연구 도입 시점과 구분하며 Fab 34에 한정한다.", "value_text": "Intel 4 high-volume manufacturing start announced at Fab 34", "legacy_observation_id": "", "observation_id": "SCE001405", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_high_volume_manufacturing_start", "metric_ko": "EUV 대량 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/ireland-begins-intel-4-production-livestream-replay.html", "source_title": "Intel Ireland Begins Intel 4 Production (Replay)", "source_publication_date": "2023-09-29", "available_date_verified": "2023-09-29", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"euv_high_volume_manufacturing_start\",\"period\":\"2023-09-29\",\"period_type\":\"event_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"Intel 4; Low NA EUV\",\"scope\":\"Ireland Fab 34 Leixlip\",\"status\":\"reported_actual\",\"source_id\":\"EUV007\",\"locator\":\"Opening event description\",\"notes\":\"Intel 전체 최초 EUV 연구 도입 시점과 구분하며 Fab 34에 한정한다.\",\"value_text\":\"Intel 4 high-volume manufacturing start announced at Fab 34\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "first_system_modules_shipped_milestone", "period": "2023-12", "period_type": "event_month", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN EXE:5000 High NA EUV", "scope": "ASML shipment to Intel; first modules of first system", "status": "reported_actual", "source_id": "EUV003", "locator": "Opening paragraph", "notes": "완성 장비의 현장 설치·보정 완료로 처리하지 않는다.", "value_text": "First modules of the first High NA system shipped to Intel", "legacy_observation_id": "", "observation_id": "SCE001406", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_system_modules_shipped_milestone", "metric_ko": "최초 장비 모듈 출하 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://www.asml.com/en/company/stories/2024/5-things-high-na-euv", "source_title": "5 things you should know about High NA EUV lithography", "source_publication_date": "2024-01-25", "available_date_verified": "2024-01-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"first_system_modules_shipped_milestone\",\"period\":\"2023-12\",\"period_type\":\"event_month\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN EXE:5000 High NA EUV\",\"scope\":\"ASML shipment to Intel; first modules of first system\",\"status\":\"reported_actual\",\"source_id\":\"EUV003\",\"locator\":\"Opening paragraph\",\"notes\":\"완성 장비의 현장 설치·보정 완료로 처리하지 않는다.\",\"value_text\":\"First modules of the first High NA system shipped to Intel\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "first_site_high_na_installation_event_quantity", "period": "2024-04", "period_type": "event_month", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "TWINSCAN EXE:5000 High NA EUV", "scope": "Oregon D1X test manufacturing facility, Hillsboro", "status": "reported_actual", "source_id": "EUV005", "locator": "Opening paragraph; Images captions", "notes": "4월 설치 완료 및 보정 시작. 첫 장비 설치 사건으로서 범위를 한정하며 Intel 총 EUV fleet 수로 사용하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001407", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_site_high_na_installation_event_quantity", "metric_ko": "사업장 최초 High-NA 설치 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/resources/intel-high-na-euv.html", "source_title": "High NA EUV at Intel", "source_publication_date": "2024-04-18", "available_date_verified": "2024-04-18", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"first_site_high_na_installation_event_quantity\",\"period\":\"2024-04\",\"period_type\":\"event_month\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"TWINSCAN EXE:5000 High NA EUV\",\"scope\":\"Oregon D1X test manufacturing facility, Hillsboro\",\"status\":\"reported_actual\",\"source_id\":\"EUV005\",\"locator\":\"Opening paragraph; Images captions\",\"notes\":\"4월 설치 완료 및 보정 시작. 첫 장비 설치 사건으로서 범위를 한정하며 Intel 총 EUV fleet 수로 사용하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "high_na_systems_operating", "period": "2025-02-24", "period_type": "point_in_time", "value": 2, "comparator": "equal", "unit": "systems", "product_or_technology": "High NA EUV; EXE:5000 model identified by corroborating conference coverage", "scope": "Intel development / testing operations; not all EUV equipment", "status": "secondary_estimate", "source_id": "EUV008", "locator": "Paragraphs 1–3; 18A testing correction", "notes": "실명 엔지니어의 발표를 인용한 Reuters 보도이며 회사 공식 장비 대장 원문은 미확보. 'in production'은 기사 안의 18A 시험 맥락에 따라 가동으로 기록하고 상업 HVM으로 분류하지 않았다.", "legacy_observation_id": "", "observation_id": "SCE001408", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "high_na_systems_operating", "metric_ko": "가동 중 High-NA 장비 수", "native_comparator": "equal", "native_value": 2, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Intel", "source_url": "https://www.reuters.com/technology/intel-says-first-two-new-asml-machines-are-production-with-positive-results-2025-02-24/", "source_title": "Intel says new ASML machines are in production, with positive results", "source_publication_date": "2025-02-25", "available_date_verified": "2025-02-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"high_na_systems_operating\",\"period\":\"2025-02-24\",\"period_type\":\"point_in_time\",\"value\":2,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"High NA EUV; EXE:5000 model identified by corroborating conference coverage\",\"scope\":\"Intel development / testing operations; not all EUV equipment\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV008\",\"locator\":\"Paragraphs 1–3; 18A testing correction\",\"notes\":\"실명 엔지니어의 발표를 인용한 Reuters 보도이며 회사 공식 장비 대장 원문은 미확보. 'in production'은 기사 안의 18A 시험 맥락에 따라 가동으로 기록하고 상업 HVM으로 분류하지 않았다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "high_na_test_wafers_processed_in_single_quarter", "period": "2025-02-24", "period_type": "as_of_disclosure_prior_quarter_unspecified", "value": 30000, "comparator": "equal", "unit": "wafers/quarter", "product_or_technology": "High NA EUV testing", "scope": "Intel development testing; one quarter mentioned at SPIE", "status": "secondary_estimate", "source_id": "EUV008", "locator": "Steve Carson conference statement, paragraph 3", "notes": "어느 역년·회계 분기인지 기사에서 특정하지 않는다. 고객 제품용 합격 웨이퍼 생산·출하량 또는 연간 생산량이 아니다.", "legacy_observation_id": "", "observation_id": "SCE001409", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_test_wafers_processed_in_single_quarter", "metric_ko": "분기 High-NA 테스트 웨이퍼 처리량", "native_comparator": "equal", "native_value": 30000, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Intel", "source_url": "https://www.reuters.com/technology/intel-says-first-two-new-asml-machines-are-production-with-positive-results-2025-02-24/", "source_title": "Intel says new ASML machines are in production, with positive results", "source_publication_date": "2025-02-25", "available_date_verified": "2025-02-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"high_na_test_wafers_processed_in_single_quarter\",\"period\":\"2025-02-24\",\"period_type\":\"as_of_disclosure_prior_quarter_unspecified\",\"value\":30000,\"comparator\":\"equal\",\"unit\":\"wafers/quarter\",\"product_or_technology\":\"High NA EUV testing\",\"scope\":\"Intel development testing; one quarter mentioned at SPIE\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV008\",\"locator\":\"Steve Carson conference statement, paragraph 3\",\"notes\":\"어느 역년·회계 분기인지 기사에서 특정하지 않는다. 고객 제품용 합격 웨이퍼 생산·출하량 또는 연간 생산량이 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "equipment_installed_base", "metric": "model_installation_and_acceptance_passed_milestone", "period": "2026-07-15", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN EXE:5200B High NA EUV", "scope": "Intel Foundry; location of this model not explicitly given in cited paragraph", "status": "reported_actual", "source_id": "EUV009", "locator": "Final paragraph before About ASML", "notes": "발표일까지 달성 사실을 확인한 것이며 설치일 또는 시험 통과일이 2026-07-15라는 뜻은 아니다. EXE:5000과 다른 모델.", "value_text": "Intel was first to install and pass acceptance testing of EXE:5200B", "legacy_observation_id": "", "observation_id": "SCE001410", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "model_installation_and_acceptance_passed_milestone", "metric_ko": "모델 설치·인수시험 통과", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://investor.asml.com/news-releases/news-release-details/high-na-euv-reaches-new-readiness-milestone", "source_title": "High NA EUV reaches new readiness milestone with first high-volume Logic product", "source_publication_date": "2026-07-15", "available_date_verified": "2026-07-15", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"equipment_installed_base\",\"metric\":\"model_installation_and_acceptance_passed_milestone\",\"period\":\"2026-07-15\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN EXE:5200B High NA EUV\",\"scope\":\"Intel Foundry; location of this model not explicitly given in cited paragraph\",\"status\":\"reported_actual\",\"source_id\":\"EUV009\",\"locator\":\"Final paragraph before About ASML\",\"notes\":\"발표일까지 달성 사실을 확인한 것이며 설치일 또는 시험 통과일이 2026-07-15라는 뜻은 아니다. EXE:5000과 다른 모델.\",\"value_text\":\"Intel was first to install and pass acceptance testing of EXE:5200B\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "high_na_high_volume_manufacturing_start", "period": "2026-07-15", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV / Intel 18A / Panther Lake", "scope": "Oregon; selected Intel 18A layers for a subset of Core Ultra Series 3 processors", "status": "reported_actual", "source_id": "EUV009", "locator": "News highlights; opening paragraphs", "notes": "일부 제품·특정 층에 한정. Intel18A 전체 층 또는 전체 출하 제품이 High NA라는 뜻이 아니다.", "value_text": "High NA used in HVM, with some Panther Lake products shipping to customers", "legacy_observation_id": "", "observation_id": "SCE001411", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_high_volume_manufacturing_start", "metric_ko": "High-NA 대량 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Intel", "source_url": "https://investor.asml.com/news-releases/news-release-details/high-na-euv-reaches-new-readiness-milestone", "source_title": "High NA EUV reaches new readiness milestone with first high-volume Logic product", "source_publication_date": "2026-07-15", "available_date_verified": "2026-07-15", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"high_na_high_volume_manufacturing_start\",\"period\":\"2026-07-15\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV / Intel 18A / Panther Lake\",\"scope\":\"Oregon; selected Intel 18A layers for a subset of Core Ultra Series 3 processors\",\"status\":\"reported_actual\",\"source_id\":\"EUV009\",\"locator\":\"News highlights; opening paragraphs\",\"notes\":\"일부 제품·특정 층에 한정. Intel18A 전체 층 또는 전체 출하 제품이 High NA라는 뜻이 아니다.\",\"value_text\":\"High NA used in HVM, with some Panther Lake products shipping to customers\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "INTEL", "category": "process_technology", "metric": "cumulative_high_na_wafers_processed", "period": "2026-09-07", "period_type": "cumulative_to_date", "value": null, "comparator": "greater_than", "unit": "wafers_processed", "product_or_technology": "High NA EUV", "scope": "Early certification/testing + R&D + selected-layer volume production for subset of Panther Lake", "status": "reported_actual", "source_id": "EUV010", "locator": "First update bullet", "notes": "원문 >1m. 처리 건수의 고유 웨이퍼 중복 제거 여부와 층별 노광 횟수는 공개되지 않았다. 양품 웨이퍼 생산량·wafer starts로 사용하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001412", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "cumulative_high_na_wafers_processed", "metric_ko": "누적 High-NA 웨이퍼 처리량", "native_comparator": "greater_than", "native_value": 1000000, "value_min": 1000000, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_bound", "has_numeric_value": true, "company_name": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-foundry/intel-foundry-asml-accelerate-industry-readiness-for-high-na-euv.html", "source_title": "Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV", "source_publication_date": "2026-09-07", "available_date_verified": "2026-09-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"INTEL\",\"category\":\"process_technology\",\"metric\":\"cumulative_high_na_wafers_processed\",\"period\":\"2026-09-07\",\"period_type\":\"cumulative_to_date\",\"value\":1000000,\"comparator\":\"greater_than\",\"unit\":\"wafers_processed\",\"product_or_technology\":\"High NA EUV\",\"scope\":\"Early certification/testing + R&D + selected-layer volume production for subset of Panther Lake\",\"status\":\"reported_actual\",\"source_id\":\"EUV010\",\"locator\":\"First update bullet\",\"notes\":\"원문 >1m. 처리 건수의 고유 웨이퍼 중복 제거 여부와 층별 노광 횟수는 공개되지 않았다. 양품 웨이퍼 생산량·wafer starts로 사용하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "euv_volume_production_start", "period": "2019-Q2", "period_type": "event_quarter", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "N7+; Low NA EUV", "scope": "TSMC N7+ technology, company-wide", "status": "reported_actual", "source_id": "EUV037", "locator": "Paragraph beginning The N7+ volume production", "notes": "2019-10-07 발표가 양산 시작을 2019년2분기로 회고한다. EUV013 연차보고서로 연도 교차확인. 일반 N7과 N7+를 구분한다.", "value_text": "N7+ entered volume production using EUV", "legacy_observation_id": "", "observation_id": "SCE001413", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_volume_production_start", "metric_ko": "EUV 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://pr.tsmc.com/japanese/news/2010", "source_title": "TSMC’s N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume", "source_publication_date": "2019-10-07", "available_date_verified": "2019-10-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"euv_volume_production_start\",\"period\":\"2019-Q2\",\"period_type\":\"event_quarter\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"N7+; Low NA EUV\",\"scope\":\"TSMC N7+ technology, company-wide\",\"status\":\"reported_actual\",\"source_id\":\"EUV037\",\"locator\":\"Paragraph beginning The N7+ volume production\",\"notes\":\"2019-10-07 발표가 양산 시작을 2019년2분기로 회고한다. EUV013 연차보고서로 연도 교차확인. 일반 N7과 N7+를 구분한다.\",\"value_text\":\"N7+ entered volume production using EUV\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "euv_volume_production_start", "period": "2020-Q2", "period_type": "event_quarter", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "N5; extensive Low NA EUV adoption", "scope": "TSMC N5 technology", "status": "reported_actual", "source_id": "EUV014", "locator": "Technological Developments > N5", "notes": "EUV 채택 맥락은 EUV013의 N5 설명으로도 확인된다.", "value_text": "N5 entered volume production in Q2 2020", "legacy_observation_id": "", "observation_id": "SCE001414", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_volume_production_start", "metric_ko": "EUV 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/static/annualReports/2020/english/index.html", "source_title": "TSMC 2020 Annual Report", "source_publication_date": "2021", "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"euv_volume_production_start\",\"period\":\"2020-Q2\",\"period_type\":\"event_quarter\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"N5; extensive Low NA EUV adoption\",\"scope\":\"TSMC N5 technology\",\"status\":\"reported_actual\",\"source_id\":\"EUV014\",\"locator\":\"Technological Developments > N5\",\"notes\":\"EUV 채택 맥락은 EUV013의 N5 설명으로도 확인된다.\",\"value_text\":\"N5 entered volume production in Q2 2020\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "euv_volume_production_start", "period": "2020-end", "period_type": "event_year_end", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "N6; Low NA EUV", "scope": "TSMC N6 technology", "status": "reported_actual", "source_id": "EUV014", "locator": "Technological Developments > N7+/N6", "notes": "원문은 end of 2020. 정확한 시작월·일은 공개되지 않았다. N6의 EUV 적용 기술임은 EUV038의 2019년 공정 발표로 확인한다.", "value_text": "N6 entered volume production at the end of 2020", "legacy_observation_id": "", "observation_id": "SCE001415", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_volume_production_start", "metric_ko": "EUV 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/static/annualReports/2020/english/index.html", "source_title": "TSMC 2020 Annual Report", "source_publication_date": "2021", "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"euv_volume_production_start\",\"period\":\"2020-end\",\"period_type\":\"event_year_end\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"N6; Low NA EUV\",\"scope\":\"TSMC N6 technology\",\"status\":\"reported_actual\",\"source_id\":\"EUV014\",\"locator\":\"Technological Developments > N7+/N6\",\"notes\":\"원문은 end of 2020. 정확한 시작월·일은 공개되지 않았다. N6의 EUV 적용 기술임은 EUV038의 2019년 공정 발표로 확인한다.\",\"value_text\":\"N6 entered volume production at the end of 2020\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "equipment_installed_base", "metric": "share_of_global_euv_installed_base", "period": "2019", "period_type": "point_in_time_year", "value": 42, "comparator": "equal", "unit": "percent", "product_or_technology": "Low NA EUV; model mix not disclosed", "scope": "TSMC share of worldwide EUV installed base", "status": "secondary_estimate", "source_id": "EUV017", "locator": "TSMC Leadership in EUV HVM table, 2019 column", "notes": "회사 발표 표를 전재한 2차 자료. 연중 어느 날짜인지 불명. 절대 대수로 환산하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001416", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "share_of_global_euv_installed_base", "metric_ko": "세계 EUV 설치 대수 내 비중", "native_comparator": "equal", "native_value": 42, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.inkl.com/news/tsmc-outlines-path-to-euv-success-more-tools-more-wafers-best-pellicles-in-industry", "source_title": "TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry", "source_publication_date": "2024-05", "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"equipment_installed_base\",\"metric\":\"share_of_global_euv_installed_base\",\"period\":\"2019\",\"period_type\":\"point_in_time_year\",\"value\":42,\"comparator\":\"equal\",\"unit\":\"percent\",\"product_or_technology\":\"Low NA EUV; model mix not disclosed\",\"scope\":\"TSMC share of worldwide EUV installed base\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV017\",\"locator\":\"TSMC Leadership in EUV HVM table, 2019 column\",\"notes\":\"회사 발표 표를 전재한 2차 자료. 연중 어느 날짜인지 불명. 절대 대수로 환산하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "equipment_installed_base", "metric": "share_of_global_euv_installed_base", "period": "2020-08", "period_type": "point_in_time_month", "value": 50, "comparator": "approximately", "unit": "percent", "product_or_technology": "Low NA EUV; model mix not disclosed", "scope": "TSMC share of worldwide EUV installed base at 2020 Technology Symposium", "status": "secondary_estimate", "source_id": "EUV015", "locator": "Paragraph beginning 'However, TSMC also revealed'", "notes": "원문 약 50%. 발표 시점의 비율이며 2020년 말 비율이 아니다. 기자의 30–35대 산술 추정은 채택하지 않았다.", "legacy_observation_id": "", "observation_id": "SCE001417", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "share_of_global_euv_installed_base", "metric_ko": "세계 EUV 설치 대수 내 비중", "native_comparator": "approximately", "native_value": 50, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.techspot.com/news/86562-tsmc-accounts-half-industry-euv-equipment-installation-base.html", "source_title": "TSMC accounts for half of industry's EUV equipment installation base and wafer production", "source_publication_date": "2020-08-29", "available_date_verified": "2020-08-29", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"equipment_installed_base\",\"metric\":\"share_of_global_euv_installed_base\",\"period\":\"2020-08\",\"period_type\":\"point_in_time_month\",\"value\":50,\"comparator\":\"approximately\",\"unit\":\"percent\",\"product_or_technology\":\"Low NA EUV; model mix not disclosed\",\"scope\":\"TSMC share of worldwide EUV installed base at 2020 Technology Symposium\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV015\",\"locator\":\"Paragraph beginning 'However, TSMC also revealed'\",\"notes\":\"원문 약 50%. 발표 시점의 비율이며 2020년 말 비율이 아니다. 기자의 30–35대 산술 추정은 채택하지 않았다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "share_of_global_cumulative_euv_wafer_output", "period": "2020-08", "period_type": "cumulative_share_as_of_month", "value": 60, "comparator": "approximately", "unit": "percent", "product_or_technology": "Low NA EUV", "scope": "TSMC share of industry cumulative EUV wafer output as described by conference reporting", "status": "secondary_estimate", "source_id": "EUV015", "locator": "Same paragraph, cumulative EUV wafer production", "notes": "원문 약 60%. 기사 제목의 capacity라는 표현과 구분해 본문의 누적 처리·생산 비율로 보존. 고유 웨이퍼 수·연간 생산량·명목 능력은 알 수 없다.", "legacy_observation_id": "", "observation_id": "SCE001418", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "share_of_global_cumulative_euv_wafer_output", "metric_ko": "세계 누적 EUV 처리 웨이퍼 비중", "native_comparator": "approximately", "native_value": 60, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.techspot.com/news/86562-tsmc-accounts-half-industry-euv-equipment-installation-base.html", "source_title": "TSMC accounts for half of industry's EUV equipment installation base and wafer production", "source_publication_date": "2020-08-29", "available_date_verified": "2020-08-29", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"share_of_global_cumulative_euv_wafer_output\",\"period\":\"2020-08\",\"period_type\":\"cumulative_share_as_of_month\",\"value\":60,\"comparator\":\"approximately\",\"unit\":\"percent\",\"product_or_technology\":\"Low NA EUV\",\"scope\":\"TSMC share of industry cumulative EUV wafer output as described by conference reporting\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV015\",\"locator\":\"Same paragraph, cumulative EUV wafer production\",\"notes\":\"원문 약 60%. 기사 제목의 capacity라는 표현과 구분해 본문의 누적 처리·생산 비율로 보존. 고유 웨이퍼 수·연간 생산량·명목 능력은 알 수 없다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "equipment_installed_base", "metric": "share_of_global_euv_installed_base", "period": "2023", "period_type": "point_in_time_year", "value": 56, "comparator": "equal", "unit": "percent", "product_or_technology": "Low NA EUV; model mix not disclosed", "scope": "TSMC share of worldwide EUV installed base", "status": "secondary_estimate", "source_id": "EUV016", "locator": "TSMC company statement quoted in third paragraph", "notes": "TSMC가 2024년 기자에게 직접 설명한 2023년 수치. EUV017 본문 일부의 2024년 표현보다 회사 인용문의 2023년을 채택. 장비 절대 수로 변환하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001419", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "share_of_global_euv_installed_base", "metric_ko": "세계 EUV 설치 대수 내 비중", "native_comparator": "equal", "native_value": 56, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.theregister.com/on-prem/2024/11/07/tsmc-prioritizing-bringing-in-na-euv-equipment/1405684", "source_title": "TSMC prioritizing high-NA EUV scanners for R&D", "source_publication_date": "2024-11-07", "available_date_verified": "2024-11-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"equipment_installed_base\",\"metric\":\"share_of_global_euv_installed_base\",\"period\":\"2023\",\"period_type\":\"point_in_time_year\",\"value\":56,\"comparator\":\"equal\",\"unit\":\"percent\",\"product_or_technology\":\"Low NA EUV; model mix not disclosed\",\"scope\":\"TSMC share of worldwide EUV installed base\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV016\",\"locator\":\"TSMC company statement quoted in third paragraph\",\"notes\":\"TSMC가 2024년 기자에게 직접 설명한 2023년 수치. EUV017 본문 일부의 2024년 표현보다 회사 인용문의 2023년을 채택. 장비 절대 수로 변환하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "equipment_installed_base", "metric": "euv_tool_count_index", "period": "2023", "period_type": "point_in_time_year", "value": 10, "comparator": "equal", "unit": "index_2019_equals_1", "product_or_technology": "Low NA EUV", "scope": "TSMC EUV tool count relative to TSMC 2019 baseline", "status": "secondary_estimate", "source_id": "EUV016", "locator": "TSMC quoted statement", "notes": "10은 장비 10대가 아니라 2019년 대비 배수다. 기준 연도의 절대 장비 대수는 미공개.", "legacy_observation_id": "", "observation_id": "SCE001420", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "euv_tool_count_index", "metric_ko": "EUV 장비 대수 지수", "native_comparator": "equal", "native_value": 10, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.theregister.com/on-prem/2024/11/07/tsmc-prioritizing-bringing-in-na-euv-equipment/1405684", "source_title": "TSMC prioritizing high-NA EUV scanners for R&D", "source_publication_date": "2024-11-07", "available_date_verified": "2024-11-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"equipment_installed_base\",\"metric\":\"euv_tool_count_index\",\"period\":\"2023\",\"period_type\":\"point_in_time_year\",\"value\":10,\"comparator\":\"equal\",\"unit\":\"index_2019_equals_1\",\"product_or_technology\":\"Low NA EUV\",\"scope\":\"TSMC EUV tool count relative to TSMC 2019 baseline\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV016\",\"locator\":\"TSMC quoted statement\",\"notes\":\"10은 장비 10대가 아니라 2019년 대비 배수다. 기준 연도의 절대 장비 대수는 미공개.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "euv_wafer_moves_index", "period": "2023", "period_type": "reported_year_index", "value": 30, "comparator": "equal", "unit": "index_2019_equals_1", "product_or_technology": "Low NA EUV", "scope": "TSMC EUV wafer moves relative to 2019 baseline", "status": "secondary_estimate", "source_id": "EUV016", "locator": "TSMC quoted statement", "notes": "wafer moves는 층별·반복 처리를 포함할 수 있는 원문 지표. 고유 wafer starts 또는 고객 출하로 변환하지 않는다. 공개 문장만으로 기간 누적/연간 집계의 세부 정의는 알 수 없다.", "legacy_observation_id": "", "observation_id": "SCE001421", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_wafer_moves_index", "metric_ko": "EUV 웨이퍼 처리 지수", "native_comparator": "equal", "native_value": 30, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://www.theregister.com/on-prem/2024/11/07/tsmc-prioritizing-bringing-in-na-euv-equipment/1405684", "source_title": "TSMC prioritizing high-NA EUV scanners for R&D", "source_publication_date": "2024-11-07", "available_date_verified": "2024-11-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"euv_wafer_moves_index\",\"period\":\"2023\",\"period_type\":\"reported_year_index\",\"value\":30,\"comparator\":\"equal\",\"unit\":\"index_2019_equals_1\",\"product_or_technology\":\"Low NA EUV\",\"scope\":\"TSMC EUV wafer moves relative to 2019 baseline\",\"status\":\"secondary_estimate\",\"source_id\":\"EUV016\",\"locator\":\"TSMC quoted statement\",\"notes\":\"wafer moves는 층별·반복 처리를 포함할 수 있는 원문 지표. 고유 wafer starts 또는 고객 출하로 변환하지 않는다. 공개 문장만으로 기간 누적/연간 집계의 세부 정의는 알 수 없다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "high_na_integration_plan", "period": "future_unspecified_as_of_2025", "period_type": "undated_future_plan", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV", "scope": "TSMC lithography R&D / future advanced technologies", "status": "announced_plan", "source_id": "EUV018", "locator": "Lithography Technology, printed p.99", "notes": "2024년 연차보고서에 향후 계획으로 기재. 2024년 설치·양산 또는 장비 0대를 뜻하지 않는다.", "value_text": "Future integration of High NA EUV envisaged", "legacy_observation_id": "", "observation_id": "SCE001422", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_integration_plan", "metric_ko": "High-NA 통합 계획", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2025", "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/static/annualReports/2024/english/ebook/files/basic-html/page101.html", "source_title": "TSMC 2024 Annual Report: Lithography Technology", "source_publication_date": "2025", "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"high_na_integration_plan\",\"period\":\"future_unspecified_as_of_2025\",\"period_type\":\"undated_future_plan\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV\",\"scope\":\"TSMC lithography R&D / future advanced technologies\",\"status\":\"announced_plan\",\"source_id\":\"EUV018\",\"locator\":\"Lithography Technology, printed p.99\",\"notes\":\"2024년 연차보고서에 향후 계획으로 기재. 2024년 설치·양산 또는 장비 0대를 뜻하지 않는다.\",\"value_text\":\"Future integration of High NA EUV envisaged\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "high_na_lithography_rd_started", "period": "2025", "period_type": "event_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV", "scope": "TSMC lithography technology R&D", "status": "reported_actual", "source_id": "EUV019", "locator": "5.2.2 > Lithography Technology, printed pp.104–105", "notes": "High NA용 기술 개발의 실제 시작이며 고객 팹의 특정 장비 설치나 상업 HVM을 확인하는 문장은 아니다.", "value_text": "Development of lithography technology for High NA scanners began", "legacy_observation_id": "", "observation_id": "SCE001423", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_lithography_rd_started", "metric_ko": "High-NA 노광 R&D 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report.E.pdf", "source_title": "TSMC 2025 Annual Report", "source_publication_date": "2026", "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"high_na_lithography_rd_started\",\"period\":\"2025\",\"period_type\":\"event_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV\",\"scope\":\"TSMC lithography technology R&D\",\"status\":\"reported_actual\",\"source_id\":\"EUV019\",\"locator\":\"5.2.2 > Lithography Technology, printed pp.104–105\",\"notes\":\"High NA용 기술 개발의 실제 시작이며 고객 팹의 특정 장비 설치나 상업 HVM을 확인하는 문장은 아니다.\",\"value_text\":\"Development of lithography technology for High NA scanners began\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "TSMC", "category": "process_technology", "metric": "high_na_high_volume_manufacturing_target", "period": "2030", "period_type": "target_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV", "scope": "TSMC future advanced nodes", "status": "announced_plan", "source_id": "EUV020", "locator": "Paragraph 'TSMC intends to use ASML’s High NA technology'", "notes": "2026-09-08 발표 당시 계획. 2031년 12-inch photomask pilot 및 2033년 대형 마스크 시스템 준비와 별도 일정. photomask 치수는 웨이퍼 직경이 아니다.", "value_text": "TSMC intends to start using High NA in HVM for advanced nodes in 2030", "legacy_observation_id": "", "observation_id": "SCE001424", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_high_volume_manufacturing_target", "metric_ko": "High-NA 대량 양산 목표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2026-09-08", "record_kind": "milestone", "has_numeric_value": false, "company_name": "TSMC / Taiwan Semiconductor Manufacturing Company", "source_url": "https://investor.asml.com/news-releases/news-release-details/asml-and-tsmc-announce-initiative-pioneer-industry-transition-large-format-photomasks-high-na-euv", "source_title": "ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV", "source_publication_date": "2026-09-08", "available_date_verified": "2026-09-08", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"TSMC\",\"category\":\"process_technology\",\"metric\":\"high_na_high_volume_manufacturing_target\",\"period\":\"2030\",\"period_type\":\"target_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV\",\"scope\":\"TSMC future advanced nodes\",\"status\":\"announced_plan\",\"source_id\":\"EUV020\",\"locator\":\"Paragraph 'TSMC intends to use ASML’s High NA technology'\",\"notes\":\"2026-09-08 발표 당시 계획. 2031년 12-inch photomask pilot 및 2033년 대형 마스크 시스템 준비와 별도 일정. photomask 치수는 웨이퍼 직경이 아니다.\",\"value_text\":\"TSMC intends to start using High NA in HVM for advanced nodes in 2030\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "equipment_installed_base", "metric": "first_research_system_delivery_event_quantity", "period": "2010", "period_type": "event_year", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "TWINSCAN NXE:3100 pre-production EUV", "scope": "Samsung research facility in South Korea; first ASML NXE:3100 shipment", "status": "reported_actual", "source_id": "EUV001", "locator": "Achieving first light", "notes": "연구용 첫 NXE:3100 인도 사건. 삼성 전체 연말 fleet 대수 또는 양산 장비 설치 대수로 일반화하지 않는다.", "legacy_observation_id": "", "observation_id": "SCE001425", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_research_system_delivery_event_quantity", "metric_ko": "연구용 최초 장비 인도 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://www.asml.com/en/company/stories/2022/making-euv-lab-to-fab", "source_title": "Making EUV: from lab to fab", "source_publication_date": "2022-03-30", "available_date_verified": "2022-03-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"equipment_installed_base\",\"metric\":\"first_research_system_delivery_event_quantity\",\"period\":\"2010\",\"period_type\":\"event_year\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"TWINSCAN NXE:3100 pre-production EUV\",\"scope\":\"Samsung research facility in South Korea; first ASML NXE:3100 shipment\",\"status\":\"reported_actual\",\"source_id\":\"EUV001\",\"locator\":\"Achieving first light\",\"notes\":\"연구용 첫 NXE:3100 인도 사건. 삼성 전체 연말 fleet 대수 또는 양산 장비 설치 대수로 일반화하지 않는다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "research_euv_first_light_milestone", "period": "2010-12-24", "period_type": "event_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "TWINSCAN NXE:3100 pre-production EUV", "scope": "Samsung South Korea research facility", "status": "reported_actual", "source_id": "EUV001", "locator": "Achieving first light", "notes": "시험 장비의 첫 발광이며 칩 상업 양산 시작이 아니다.", "value_text": "First NXE:3100 achieved first light on Christmas Eve", "legacy_observation_id": "", "observation_id": "SCE001426", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "research_euv_first_light_milestone", "metric_ko": "연구용 EUV 최초 발광", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://www.asml.com/en/company/stories/2022/making-euv-lab-to-fab", "source_title": "Making EUV: from lab to fab", "source_publication_date": "2022-03-30", "available_date_verified": "2022-03-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"research_euv_first_light_milestone\",\"period\":\"2010-12-24\",\"period_type\":\"event_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"TWINSCAN NXE:3100 pre-production EUV\",\"scope\":\"Samsung South Korea research facility\",\"status\":\"reported_actual\",\"source_id\":\"EUV001\",\"locator\":\"Achieving first light\",\"notes\":\"시험 장비의 첫 발광이며 칩 상업 양산 시작이 아니다.\",\"value_text\":\"First NXE:3100 achieved first light on Christmas Eve\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_wafer_production_start", "period": "2018-10-18", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "7LPP; Low NA EUV", "scope": "S3 fab, Hwaseong; Samsung Foundry", "status": "reported_actual", "source_id": "EUV021", "locator": "Opening paragraph; The Road to EUV Technology", "notes": "발표는 started wafer production. 정확한 최초 생산일·당시 처리량은 비공개여서 HVM 대수/능력을 추정하지 않는다.", "value_text": "7LPP wafer production had started at S3", "legacy_observation_id": "", "observation_id": "SCE001427", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_wafer_production_start", "metric_ko": "EUV 웨이퍼 생산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-starts-production-of-euv-based-7nm-lpp-process", "source_title": "Samsung Electronics Starts Production of EUV-based 7nm LPP Process", "source_publication_date": "2018-10-18", "available_date_verified": "2018-10-18", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_wafer_production_start\",\"period\":\"2018-10-18\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"7LPP; Low NA EUV\",\"scope\":\"S3 fab, Hwaseong; Samsung Foundry\",\"status\":\"reported_actual\",\"source_id\":\"EUV021\",\"locator\":\"Opening paragraph; The Road to EUV Technology\",\"notes\":\"발표는 started wafer production. 정확한 최초 생산일·당시 처리량은 비공개여서 HVM 대수/능력을 추정하지 않는다.\",\"value_text\":\"7LPP wafer production had started at S3\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_test_wafer_production_start", "period": "2019-H2", "period_type": "event_half_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "7nm and below; Low NA EUV", "scope": "V1 Hwaseong", "status": "reported_actual", "source_id": "EUV022", "locator": "V1 history paragraph", "notes": "2020년 양산과 구분한 시험 웨이퍼 이정표.", "value_text": "V1 test wafer production began in second half of 2019", "legacy_observation_id": "", "observation_id": "SCE001428", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_test_wafer_production_start", "metric_ko": "EUV 테스트 웨이퍼 생산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-euv-manufacturing-line", "source_title": "Samsung Electronics Begins Mass Production at New EUV Manufacturing Line", "source_publication_date": "2020-02-20", "available_date_verified": "2020-02-20", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_test_wafer_production_start\",\"period\":\"2019-H2\",\"period_type\":\"event_half_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"7nm and below; Low NA EUV\",\"scope\":\"V1 Hwaseong\",\"status\":\"reported_actual\",\"source_id\":\"EUV022\",\"locator\":\"V1 history paragraph\",\"notes\":\"2020년 양산과 구분한 시험 웨이퍼 이정표.\",\"value_text\":\"V1 test wafer production began in second half of 2019\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_mass_production_start", "period": "2020-02-20", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "7nm / 6nm; Low NA EUV", "scope": "V1 Hwaseong dedicated EUV line", "status": "reported_actual", "source_id": "EUV022", "locator": "Opening and current production paragraphs", "notes": "V1 최초 양산 사건이며 삼성 최초 EUV 웨이퍼 생산은 앞선 S3 2018년 사건. 구체 월간 웨이퍼량과 장비 대수는 미공개.", "value_text": "V1 had begun mass production of 7nm/6nm mobile chips", "legacy_observation_id": "", "observation_id": "SCE001429", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_mass_production_start", "metric_ko": "EUV 대량 생산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-euv-manufacturing-line", "source_title": "Samsung Electronics Begins Mass Production at New EUV Manufacturing Line", "source_publication_date": "2020-02-20", "available_date_verified": "2020-02-20", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_mass_production_start\",\"period\":\"2020-02-20\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"7nm / 6nm; Low NA EUV\",\"scope\":\"V1 Hwaseong dedicated EUV line\",\"status\":\"reported_actual\",\"source_id\":\"EUV022\",\"locator\":\"Opening and current production paragraphs\",\"notes\":\"V1 최초 양산 사건이며 삼성 최초 EUV 웨이퍼 생산은 앞선 S3 2018년 사건. 구체 월간 웨이퍼량과 장비 대수는 미공개.\",\"value_text\":\"V1 had begun mass production of 7nm/6nm mobile chips\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_dram_customer_qualified_shipments_milestone", "period": "2020-03-25", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "D1x DDR4 DRAM; Low NA EUV", "scope": "Samsung DRAM modules; global customer evaluation", "status": "reported_actual", "source_id": "EUV023", "locator": "Opening paragraph", "notes": "원문 100만은 메모리 모듈 수라서 웨이퍼 생산량·EUV 장비 대수 열에 숫자로 넣지 않았다.", "value_text": "One million EUV-based D1x DDR4 modules shipped and customer evaluations completed", "legacy_observation_id": "", "observation_id": "SCE001430", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_dram_customer_qualified_shipments_milestone", "metric_ko": "EUV DRAM 고객 인증 출하 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-announces-industrys-first-euv-dram-with-shipment-of-first-million-modules", "source_title": "Samsung Announces Industry’s First EUV DRAM with Shipment of First Million Modules", "source_publication_date": "2020-03-25", "available_date_verified": "2020-03-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_dram_customer_qualified_shipments_milestone\",\"period\":\"2020-03-25\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"D1x DDR4 DRAM; Low NA EUV\",\"scope\":\"Samsung DRAM modules; global customer evaluation\",\"status\":\"reported_actual\",\"source_id\":\"EUV023\",\"locator\":\"Opening paragraph\",\"notes\":\"원문 100만은 메모리 모듈 수라서 웨이퍼 생산량·EUV 장비 대수 열에 숫자로 넣지 않았다.\",\"value_text\":\"One million EUV-based D1x DDR4 modules shipped and customer evaluations completed\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_dram_mass_production_start", "period": "2021-10-12", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "14nm DDR5 DRAM; D1a; Low NA EUV", "scope": "Samsung DRAM; fab not specified in cited release", "status": "reported_actual", "source_id": "EUV024", "locator": "Opening paragraph", "notes": "2020년 D1x EUV DRAM 출하와 구분한 후속 세대.", "value_text": "Mass production of 14nm EUV DDR5 DRAM began", "legacy_observation_id": "", "observation_id": "SCE001431", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_dram_mass_production_start", "metric_ko": "EUV DRAM 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-starts-mass-production-of-most-advanced-14nm-euv-ddr5-dram", "source_title": "Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM", "source_publication_date": "2021-10-12", "available_date_verified": "2021-10-12", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_dram_mass_production_start\",\"period\":\"2021-10-12\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"14nm DDR5 DRAM; D1a; Low NA EUV\",\"scope\":\"Samsung DRAM; fab not specified in cited release\",\"status\":\"reported_actual\",\"source_id\":\"EUV024\",\"locator\":\"Opening paragraph\",\"notes\":\"2020년 D1x EUV DRAM 출하와 구분한 후속 세대.\",\"value_text\":\"Mass production of 14nm EUV DDR5 DRAM began\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "euv_patterning_layers", "period": "2021-10-12", "period_type": "point_in_time", "value": 5, "comparator": "equal", "unit": "layers", "product_or_technology": "14nm DDR5 DRAM; Low NA EUV", "scope": "Number of EUV layers in the announced Samsung 14nm DRAM process", "status": "reported_actual", "source_id": "EUV024", "locator": "Paragraph beginning 'By applying five EUV layers'", "notes": "5는 공정 EUV 적용층 수. 5대의 장비 또는 5회만 처리한 고유 웨이퍼 수가 아니다.", "legacy_observation_id": "", "observation_id": "SCE001432", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_patterning_layers", "metric_ko": "EUV 적용 패터닝 층 수", "native_comparator": "equal", "native_value": 5, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-starts-mass-production-of-most-advanced-14nm-euv-ddr5-dram", "source_title": "Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM", "source_publication_date": "2021-10-12", "available_date_verified": "2021-10-12", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"euv_patterning_layers\",\"period\":\"2021-10-12\",\"period_type\":\"point_in_time\",\"value\":5,\"comparator\":\"equal\",\"unit\":\"layers\",\"product_or_technology\":\"14nm DDR5 DRAM; Low NA EUV\",\"scope\":\"Number of EUV layers in the announced Samsung 14nm DRAM process\",\"status\":\"reported_actual\",\"source_id\":\"EUV024\",\"locator\":\"Paragraph beginning 'By applying five EUV layers'\",\"notes\":\"5는 공정 EUV 적용층 수. 5대의 장비 또는 5회만 처리한 고유 웨이퍼 수가 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "equipment_installed_base", "metric": "high_na_research_tool_installation_plan", "period": "future_unspecified_as_of_2024-11-20", "period_type": "undated_future_plan", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV; model unspecified", "scope": "NRD-K R&D complex, Giheung", "status": "announced_plan", "source_id": "EUV025", "locator": "Final paragraph before tags", "notes": "2024년 tool-in 행사는 시설 전체 행사. High NA는 미래형 will be set up. 연구 라인 가동 2025년 중반 계획을 High NA 실제 인도일로 전환하지 않았다.", "value_text": "NRD-K to be equipped with High NA EUV", "legacy_observation_id": "", "observation_id": "SCE001433", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "high_na_research_tool_installation_plan", "metric_ko": "연구용 High-NA 설치 계획", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2024-11-20", "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/ca/samsung-reaches-key-milestone-at-new-semiconductor-rd-complex", "source_title": "Samsung Reaches Key Milestone at New Semiconductor R&D Complex", "source_publication_date": "2024-11-20", "available_date_verified": "2024-11-20", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"equipment_installed_base\",\"metric\":\"high_na_research_tool_installation_plan\",\"period\":\"future_unspecified_as_of_2024-11-20\",\"period_type\":\"undated_future_plan\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV; model unspecified\",\"scope\":\"NRD-K R&D complex, Giheung\",\"status\":\"announced_plan\",\"source_id\":\"EUV025\",\"locator\":\"Final paragraph before tags\",\"notes\":\"2024년 tool-in 행사는 시설 전체 행사. High NA는 미래형 will be set up. 연구 라인 가동 2025년 중반 계획을 High NA 실제 인도일로 전환하지 않았다.\",\"value_text\":\"NRD-K to be equipped with High NA EUV\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "process_technology", "metric": "high_na_dram_high_volume_manufacturing_target", "period": "2028", "period_type": "target_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "High NA EUV; future DRAM", "scope": "Samsung future DRAM HVM; fab / node not specified", "status": "announced_plan", "source_id": "EUV026", "locator": "Paragraph beginning 'Samsung also plans to introduce'", "notes": "원문 by2028의 기한 계획. 장비 설치 완료나 실제 양산 개시는 아니다.", "value_text": "Planned High NA adoption into DRAM HVM by 2028", "legacy_observation_id": "", "observation_id": "SCE001434", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "high_na_dram_high_volume_manufacturing_target", "metric_ko": "High-NA DRAM 대량 양산 목표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2026-09-08", "record_kind": "milestone", "has_numeric_value": false, "company_name": "Samsung Electronics", "source_url": "https://news.samsungsemiconductor.com/global/samsung-electronics-and-asml-expand-strategic-collaboration-for-next-generation-semiconductor-manufacturing/", "source_title": "Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing", "source_publication_date": "2026-09-08", "available_date_verified": "2026-09-08", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"process_technology\",\"metric\":\"high_na_dram_high_volume_manufacturing_target\",\"period\":\"2028\",\"period_type\":\"target_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"High NA EUV; future DRAM\",\"scope\":\"Samsung future DRAM HVM; fab / node not specified\",\"status\":\"announced_plan\",\"source_id\":\"EUV026\",\"locator\":\"Paragraph beginning 'Samsung also plans to introduce'\",\"notes\":\"원문 by2028의 기한 계획. 장비 설치 완료나 실제 양산 개시는 아니다.\",\"value_text\":\"Planned High NA adoption into DRAM HVM by 2028\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SK_HYNIX", "category": "equipment_installed_base", "metric": "first_euv_fab_introduction_milestone", "period": "2021-02-01", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "Low NA EUV; model unspecified", "scope": "M16, Icheon", "status": "reported_actual", "source_id": "EUV027", "locator": "Paragraph beginning 'What’s more special about M16'", "notes": "도입 사실과 당시 2021년 하반기 1a DRAM 생산 계획은 구분. 회사 전체 도입 장비 대수는 공개하지 않았다.", "value_text": "M16 introduced EUV equipment for the first time at SK hynix", "legacy_observation_id": "", "observation_id": "SCE001435", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_euv_fab_introduction_milestone", "metric_ko": "팹 최초 EUV 도입 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "source_url": "https://news.skhynix.com/en/sk-hynix-announces-the-completion-of-m16-plant-construction/", "source_title": "SK hynix Announces the Completion of M16 Plant Construction", "source_publication_date": "2021-02-01", "available_date_verified": "2021-02-01", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SK_HYNIX\",\"category\":\"equipment_installed_base\",\"metric\":\"first_euv_fab_introduction_milestone\",\"period\":\"2021-02-01\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"Low NA EUV; model unspecified\",\"scope\":\"M16, Icheon\",\"status\":\"reported_actual\",\"source_id\":\"EUV027\",\"locator\":\"Paragraph beginning 'What’s more special about M16'\",\"notes\":\"도입 사실과 당시 2021년 하반기 1a DRAM 생산 계획은 구분. 회사 전체 도입 장비 대수는 공개하지 않았다.\",\"value_text\":\"M16 introduced EUV equipment for the first time at SK hynix\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SK_HYNIX", "category": "process_technology", "metric": "euv_dram_mass_production_start", "period": "2021-07", "period_type": "event_month", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "1anm 8Gb LPDDR4; Low NA EUV", "scope": "SK hynix 1anm (fourth-generation 10nm-class) DRAM", "status": "reported_actual", "source_id": "EUV028", "locator": "Opening paragraph; first adoption paragraph", "notes": "회사 설명에 따르면 이전 1ynm DRAM에 부분 적용한 경험이 있었다. 이 사건을 모든 종류의 최초 EUV 실험이라고 설명하지 않는다.", "value_text": "Mass production using EUV started in July 2021", "legacy_observation_id": "", "observation_id": "SCE001436", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_dram_mass_production_start", "metric_ko": "EUV DRAM 양산 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "source_url": "https://news.skhynix.com/en/sk-hynix-starts-mass-production-of-1anm-dram-using-euv-equipment/", "source_title": "SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment", "source_publication_date": "2021-07-12", "available_date_verified": "2021-07-12", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SK_HYNIX\",\"category\":\"process_technology\",\"metric\":\"euv_dram_mass_production_start\",\"period\":\"2021-07\",\"period_type\":\"event_month\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"1anm 8Gb LPDDR4; Low NA EUV\",\"scope\":\"SK hynix 1anm (fourth-generation 10nm-class) DRAM\",\"status\":\"reported_actual\",\"source_id\":\"EUV028\",\"locator\":\"Opening paragraph; first adoption paragraph\",\"notes\":\"회사 설명에 따르면 이전 1ynm DRAM에 부분 적용한 경험이 있었다. 이 사건을 모든 종류의 최초 EUV 실험이라고 설명하지 않는다.\",\"value_text\":\"Mass production using EUV started in July 2021\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SK_HYNIX", "category": "equipment_installed_base", "metric": "first_model_site_assembly_event_quantity", "period": "2025-09-03", "period_type": "reported_by_date", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "TWINSCAN EXE:5200B High NA EUV", "scope": "M16, Icheon; assembly ceremony event", "status": "reported_actual", "source_id": "EUV029", "locator": "Body dateline and opening paragraph", "notes": "본문 dateline Sep3 사용; 페이지 metadata는 Sep2로 하루 차이. 'for mass production'인 장비의 조립 완료이며 High NA DRAM 양산 개시 또는 전체 EUV fleet=1대가 아니다.", "legacy_observation_id": "", "observation_id": "SCE001437", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_model_site_assembly_event_quantity", "metric_ko": "사업장 최초 모델 조립 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "SK hynix (formerly Hynix/Hyundai Electronics)", "source_url": "https://news.skhynix.com/en/sk-hynix-introduces-industrys-first-commercial-high-na-euv/", "source_title": "SK hynix Introduces Industry’s First Commercial High NA EUV", "source_publication_date": "2025-09-03", "available_date_verified": "2025-09-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SK_HYNIX\",\"category\":\"equipment_installed_base\",\"metric\":\"first_model_site_assembly_event_quantity\",\"period\":\"2025-09-03\",\"period_type\":\"reported_by_date\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"TWINSCAN EXE:5200B High NA EUV\",\"scope\":\"M16, Icheon; assembly ceremony event\",\"status\":\"reported_actual\",\"source_id\":\"EUV029\",\"locator\":\"Body dateline and opening paragraph\",\"notes\":\"본문 dateline Sep3 사용; 페이지 metadata는 Sep2로 하루 차이. 'for mass production'인 장비의 조립 완료이며 High NA DRAM 양산 개시 또는 전체 EUV fleet=1대가 아니다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "equipment_installed_base", "metric": "multiple_euv_purchase_orders_milestone", "period": "2021-06-30", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "EUV; models unspecified", "scope": "Micron long-term volume agreement with ASML", "status": "reported_actual", "source_id": "EUV030", "locator": "EUV paragraph, prepared remarks p.6", "notes": "복수라는 표현만 공개되므로 정확 대수, 대금에서 나눈 추정 대수, 설치 완료 대수를 만들지 않았다.", "value_text": "Purchase orders for multiple EUV tools placed", "legacy_observation_id": "", "observation_id": "SCE001438", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "multiple_euv_purchase_orders_milestone", "metric_ko": "복수 EUV 구매 주문 사건", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/index.php/static-files/e68755e8-3a81-42ed-b563-a4ef600f27ab", "source_title": "Micron Fiscal Q3 2021 Prepared Remarks", "source_publication_date": "2021-06-30", "available_date_verified": "2021-06-30", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"equipment_installed_base\",\"metric\":\"multiple_euv_purchase_orders_milestone\",\"period\":\"2021-06-30\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"EUV; models unspecified\",\"scope\":\"Micron long-term volume agreement with ASML\",\"status\":\"reported_actual\",\"source_id\":\"EUV030\",\"locator\":\"EUV paragraph, prepared remarks p.6\",\"notes\":\"복수라는 표현만 공개되므로 정확 대수, 대금에서 나눈 추정 대수, 설치 완료 대수를 만들지 않았다.\",\"value_text\":\"Purchase orders for multiple EUV tools placed\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "equipment_installed_base", "metric": "model_delivery_event_quantity", "period": "2021-09-28", "period_type": "reported_by_date", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "NXE:3600 Low NA EUV", "scope": "Boise headquarters R&D center; recent delivery by disclosure date", "status": "reported_actual", "source_id": "EUV031", "locator": "Paragraph 'Adding momentum to our years of R&D'", "notes": "최근 한 시스템 인도 사실이다. 인도 정확일은 불명. Micron 전체 최초 EUV 장비 또는 총 fleet 1대라는 표현은 원문에 없다.", "legacy_observation_id": "", "observation_id": "SCE001439", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "model_delivery_event_quantity", "metric_ko": "모델 인도 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/index.php/static-files/4ddec623-7f31-44fb-b6f8-1574068a6435", "source_title": "Micron Fiscal Q4 2021 Prepared Remarks", "source_publication_date": "2021-09-28", "available_date_verified": "2021-09-28", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"equipment_installed_base\",\"metric\":\"model_delivery_event_quantity\",\"period\":\"2021-09-28\",\"period_type\":\"reported_by_date\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"NXE:3600 Low NA EUV\",\"scope\":\"Boise headquarters R&D center; recent delivery by disclosure date\",\"status\":\"reported_actual\",\"source_id\":\"EUV031\",\"locator\":\"Paragraph 'Adding momentum to our years of R&D'\",\"notes\":\"최근 한 시스템 인도 사실이다. 인도 정확일은 불명. Micron 전체 최초 EUV 장비 또는 총 fleet 1대라는 표현은 원문에 없다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "process_technology", "metric": "euv_high_volume_manufacturing_target", "period": "2024", "period_type": "target_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "EUV DRAM; node not specified in cited 2021 remarks", "scope": "Micron manufacturing roadmap as of September 2021", "status": "announced_plan", "source_id": "EUV031", "locator": "Following sentence on 2024 timeframe", "notes": "2021년 당시 계획의 기록. 2023년 발표는 1γ Taiwan/Japan 2025년 이후 램프업으로 달라진다.", "value_text": "Planned implementation of EUV in HVM in the 2024 timeframe", "legacy_observation_id": "", "observation_id": "SCE001440", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_high_volume_manufacturing_target", "metric_ko": "EUV 대량 양산 목표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2021-09-28", "record_kind": "milestone", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/index.php/static-files/4ddec623-7f31-44fb-b6f8-1574068a6435", "source_title": "Micron Fiscal Q4 2021 Prepared Remarks", "source_publication_date": "2021-09-28", "available_date_verified": "2021-09-28", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"process_technology\",\"metric\":\"euv_high_volume_manufacturing_target\",\"period\":\"2024\",\"period_type\":\"target_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"EUV DRAM; node not specified in cited 2021 remarks\",\"scope\":\"Micron manufacturing roadmap as of September 2021\",\"status\":\"announced_plan\",\"source_id\":\"EUV031\",\"locator\":\"Following sentence on 2024 timeframe\",\"notes\":\"2021년 당시 계획의 기록. 2023년 발표는 1γ Taiwan/Japan 2025년 이후 램프업으로 달라진다.\",\"value_text\":\"Planned implementation of EUV in HVM in the 2024 timeframe\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "process_technology", "metric": "euv_dram_production_ramp_target", "period": "2025_onwards", "period_type": "target_start_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "1γ (1-gamma) DRAM; Low NA EUV", "scope": "Taiwan and Japan, including Hiroshima", "status": "announced_plan", "source_id": "EUV032", "locator": "EUV integration plans paragraph", "notes": "2023년 계획이며 두 지역에 같은 날 설치 또는 양산 시작을 약속한 것은 아니다.", "value_text": "EUV production ramp on 1γ expected from 2025 onwards in Taiwan and Japan", "legacy_observation_id": "", "observation_id": "SCE001441", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_dram_production_ramp_target", "metric_ko": "EUV DRAM 생산 확대 목표", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": true, "estimate_phase": "forecast", "forecast_as_of": "2023-05-17", "record_kind": "milestone", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/news/press-release/2023/Micron-to-Bring-EUV-Technology-to-Japan-Advancing-Next-Generation-Memory-Manufacturing-05-17-2023/default.aspx", "source_title": "Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing", "source_publication_date": "2023-05-17", "available_date_verified": "2023-05-17", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"process_technology\",\"metric\":\"euv_dram_production_ramp_target\",\"period\":\"2025_onwards\",\"period_type\":\"target_start_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"1γ (1-gamma) DRAM; Low NA EUV\",\"scope\":\"Taiwan and Japan, including Hiroshima\",\"status\":\"announced_plan\",\"source_id\":\"EUV032\",\"locator\":\"EUV integration plans paragraph\",\"notes\":\"2023년 계획이며 두 지역에 같은 날 설치 또는 양산 시작을 약속한 것은 아니다.\",\"value_text\":\"EUV production ramp on 1γ expected from 2025 onwards in Taiwan and Japan\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "process_technology", "metric": "euv_dram_sample_shipments_start", "period": "2025-02-25", "period_type": "reported_by_date", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "1γ 16Gb DDR5; Low NA EUV", "scope": "Ecosystem partners and select customers", "status": "reported_actual", "source_id": "EUV033", "locator": "Opening paragraph", "notes": "샘플 공급 사건. HVM 또는 전체 고객에 대한 양산 출하 시작으로 확대하지 않는다.", "value_text": "1γ DDR5 samples shipped to partners and selected customers", "legacy_observation_id": "", "observation_id": "SCE001442", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "euv_dram_sample_shipments_start", "metric_ko": "EUV DRAM 샘플 출하 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/news/press-release/2025/Micron-Announces-Shipment-of-1-1-gamma-DRAM-Pioneering-Memory-Technology-Advancements-for-Future-Compute-Needs-02-25-2025/default.aspx", "source_title": "Micron Announces Shipment of 1γ (1-gamma) DRAM", "source_publication_date": "2025-02-25", "available_date_verified": "2025-02-25", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"process_technology\",\"metric\":\"euv_dram_sample_shipments_start\",\"period\":\"2025-02-25\",\"period_type\":\"reported_by_date\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"1γ 16Gb DDR5; Low NA EUV\",\"scope\":\"Ecosystem partners and select customers\",\"status\":\"reported_actual\",\"source_id\":\"EUV033\",\"locator\":\"Opening paragraph\",\"notes\":\"샘플 공급 사건. HVM 또는 전체 고객에 대한 양산 출하 시작으로 확대하지 않는다.\",\"value_text\":\"1γ DDR5 samples shipped to partners and selected customers\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "process_technology", "metric": "first_euv_dram_production_node_shipments_start", "period": "FY2025", "period_type": "fiscal_year", "value": null, "comparator": "equal", "unit": "milestone", "product_or_technology": "1γ DRAM; Low NA EUV", "scope": "Micron DRAM production node; geography not specified in cited 10-K sentence", "status": "reported_actual", "source_id": "EUV034", "locator": "Business > Products > DRAM; Research and Development", "notes": "회계연도 종료 2025-08-28. 연차보고서의 production node shipments 표현을 유지하며 정확한 HVM 개시월이나 웨이퍼량을 추론하지 않는다.", "value_text": "Shipping of 1γ production node began during fiscal 2025", "legacy_observation_id": "", "observation_id": "SCE001443", "release_component": "euv_users", "category_ko": "공정·응용처·기술", "native_metric": "first_euv_dram_production_node_shipments_start", "metric_ko": "첫 EUV DRAM 공정 제품 출하 시작", "native_comparator": "equal", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron Form 10-K for fiscal year ended August 28, 2025", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"process_technology\",\"metric\":\"first_euv_dram_production_node_shipments_start\",\"period\":\"FY2025\",\"period_type\":\"fiscal_year\",\"value\":null,\"comparator\":\"equal\",\"unit\":\"milestone\",\"product_or_technology\":\"1γ DRAM; Low NA EUV\",\"scope\":\"Micron DRAM production node; geography not specified in cited 10-K sentence\",\"status\":\"reported_actual\",\"source_id\":\"EUV034\",\"locator\":\"Business > Products > DRAM; Research and Development\",\"notes\":\"회계연도 종료 2025-08-28. 연차보고서의 production node shipments 표현을 유지하며 정확한 HVM 개시월이나 웨이퍼량을 추론하지 않는다.\",\"value_text\":\"Shipping of 1γ production node began during fiscal 2025\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "equipment_installed_base", "metric": "first_site_euv_installation_event_quantity", "period": "FY2025-Q4", "period_type": "fiscal_quarter", "value": 1, "comparator": "equal", "unit": "systems", "product_or_technology": "Low NA EUV; model unspecified; enables 1γ", "scope": "Japan fab; complements existing 1γ supply from Taiwan", "status": "reported_actual", "source_id": "EUV035", "locator": "Manufacturing remarks: first EUV tool for Japan fab", "notes": "FY2025 Q4 종료 2025-08-28; 발표일 2025-09-23과 설치 기간을 구분. EUV036 Proxy p.38에서도 FY2025 설치 확인. 동일 사건을 두 대로 합산하지 않는다. 일본 연구기관의 선행 EUV와 구별되는 Micron 생산 팹의 첫 장비다.", "legacy_observation_id": "", "observation_id": "SCE001444", "release_component": "euv_users", "category_ko": "EUV 고객 장비·도입 사건", "native_metric": "first_site_euv_installation_event_quantity", "metric_ko": "사업장 최초 EUV 설치 사건 수량", "native_comparator": "equal", "native_value": 1, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://investors.micron.com/static-files/5ea95475-639b-4cfc-91fd-b9b4a2bb5e63", "source_title": "Micron Fiscal Q4 2025 Prepared Remarks", "source_publication_date": "2025-09-23", "available_date_verified": "2025-09-23", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"equipment_installed_base\",\"metric\":\"first_site_euv_installation_event_quantity\",\"period\":\"FY2025-Q4\",\"period_type\":\"fiscal_quarter\",\"value\":1,\"comparator\":\"equal\",\"unit\":\"systems\",\"product_or_technology\":\"Low NA EUV; model unspecified; enables 1γ\",\"scope\":\"Japan fab; complements existing 1γ supply from Taiwan\",\"status\":\"reported_actual\",\"source_id\":\"EUV035\",\"locator\":\"Manufacturing remarks: first EUV tool for Japan fab\",\"notes\":\"FY2025 Q4 종료 2025-08-28; 발표일 2025-09-23과 설치 기간을 구분. EUV036 Proxy p.38에서도 FY2025 설치 확인. 동일 사건을 두 대로 합산하지 않는다. 일본 연구기관의 선행 EUV와 구별되는 Micron 생산 팹의 첫 장비다.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "CXMT", "category": "memory_dram", "metric": "tapeout", "period": "2018-07", "period_type": "event", "value": null, "comparator": "qualitative", "unit": "milestone", "product_or_technology": "DDR4", "scope": "company_product", "status": "reported_actual", "source_id": "CNE001", "locator": "CXMT History, 2018–2019 timeline", "notes": "Historical month-level date as stated by company; announcement is not a wafer-volume measurement.", "value_text": "8Gb DDR4 tape-out for manufacturing", "legacy_observation_id": "", "observation_id": "SCE001445", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "tapeout", "metric_ko": "테이프아웃", "native_comparator": "qualitative", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://www.cxmt.com/en/about.html", "source_title": "CXMT corporate history", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"tapeout\",\"period\":\"2018-07\",\"period_type\":\"event\",\"value\":null,\"comparator\":\"qualitative\",\"unit\":\"milestone\",\"product_or_technology\":\"DDR4\",\"scope\":\"company_product\",\"status\":\"reported_actual\",\"source_id\":\"CNE001\",\"locator\":\"CXMT History, 2018–2019 timeline\",\"notes\":\"Historical month-level date as stated by company; announcement is not a wafer-volume measurement.\",\"value_text\":\"8Gb DDR4 tape-out for manufacturing\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "CXMT", "category": "memory_dram", "metric": "product_test", "period": "2019-05", "period_type": "event", "value": null, "comparator": "qualitative", "unit": "milestone", "product_or_technology": "DDR4", "scope": "company_product", "status": "reported_actual", "source_id": "CNE001", "locator": "CXMT History, 2018–2019 timeline", "notes": "Historical month-level date as stated by company; announcement is not a wafer-volume measurement.", "value_text": "DDR4 product successfully tested", "legacy_observation_id": "", "observation_id": "SCE001446", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "product_test", "metric_ko": "제품 테스트", "native_comparator": "qualitative", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://www.cxmt.com/en/about.html", "source_title": "CXMT corporate history", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"product_test\",\"period\":\"2019-05\",\"period_type\":\"event\",\"value\":null,\"comparator\":\"qualitative\",\"unit\":\"milestone\",\"product_or_technology\":\"DDR4\",\"scope\":\"company_product\",\"status\":\"reported_actual\",\"source_id\":\"CNE001\",\"locator\":\"CXMT History, 2018–2019 timeline\",\"notes\":\"Historical month-level date as stated by company; announcement is not a wafer-volume measurement.\",\"value_text\":\"DDR4 product successfully tested\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "CXMT", "category": "memory_dram", "metric": "mass_production_announcement", "period": "2019-09", "period_type": "event", "value": null, "comparator": "qualitative", "unit": "milestone", "product_or_technology": "DDR4", "scope": "company_product", "status": "reported_actual", "source_id": "CNE001", "locator": "CXMT History, 2018–2019 timeline", "notes": "Historical month-level date as stated by company; announcement is not a wafer-volume measurement.", "value_text": "8Gb DDR4 mass production announced at World Manufacturing Convention", "legacy_observation_id": "", "observation_id": "SCE001447", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "mass_production_announcement", "metric_ko": "양산 발표", "native_comparator": "qualitative", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://www.cxmt.com/en/about.html", "source_title": "CXMT corporate history", "source_publication_date": null, "available_date_verified": null, "retrieved_date": "2026-10-17", "availability_status": "publication_date_unverified_no_point_in_time_use", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"mass_production_announcement\",\"period\":\"2019-09\",\"period_type\":\"event\",\"value\":null,\"comparator\":\"qualitative\",\"unit\":\"milestone\",\"product_or_technology\":\"DDR4\",\"scope\":\"company_product\",\"status\":\"reported_actual\",\"source_id\":\"CNE001\",\"locator\":\"CXMT History, 2018–2019 timeline\",\"notes\":\"Historical month-level date as stated by company; announcement is not a wafer-volume measurement.\",\"value_text\":\"8Gb DDR4 mass production announced at World Manufacturing Convention\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "CXMT", "category": "memory_dram", "metric": "gross_dies_per_wafer_uplift", "period": "2026-09-20", "period_type": "event", "value": null, "comparator": "greater_than_or_equal", "unit": "percent", "product_or_technology": "G5 versus G4 DRAM platform", "scope": "company_product", "status": "reported_actual", "source_id": "CNE006", "locator": "Next-Generation Product Lineup and Note", "notes": "Company comparison normalized to 8Gb density baseline. Gross DPW uplift is not wafer-output growth or good-die yield.", "legacy_observation_id": "", "observation_id": "SCE001467", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "gross_dies_per_wafer_uplift", "metric_ko": "웨이퍼당 총 다이 수 증가율", "native_comparator": "at_least", "native_value": 50, "value_min": 50, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_bound", "has_numeric_value": true, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://www.cxmt.com/en/news/info_22.html", "source_title": "CXMT Announces Mass Production of 5th-Generation DRAM Technology Platform", "source_publication_date": "2026-09-20", "available_date_verified": "2026-09-20", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"gross_dies_per_wafer_uplift\",\"period\":\"2026-09-20\",\"period_type\":\"event\",\"value\":50,\"comparator\":\"at_least\",\"unit\":\"percent\",\"product_or_technology\":\"G5 versus G4 DRAM platform\",\"scope\":\"company_product\",\"status\":\"reported_actual\",\"source_id\":\"CNE006\",\"locator\":\"Next-Generation Product Lineup and Note\",\"notes\":\"Company comparison normalized to 8Gb density baseline. Gross DPW uplift is not wafer-output growth or good-die yield.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "CXMT", "category": "memory_dram", "metric": "mass_production_announcement", "period": "2026-09-07", "period_type": "event", "value": null, "comparator": "qualitative", "unit": "milestone", "product_or_technology": "LPDDR6", "scope": "company_product", "status": "reported_actual", "source_id": "CNE007", "locator": "Body first and second paragraphs", "notes": "Company primary announcement; no wafer or unit shipment quantity reported. Product names and claim retained as written.", "value_text": "Company reports LPDDR6 mass production and commercial debut in Xiaomi 18 Fold", "legacy_observation_id": "", "observation_id": "SCE001468", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "mass_production_announcement", "metric_ko": "양산 발표", "native_comparator": "qualitative", "native_value": null, "value_min": null, "value_max": null, "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "milestone", "has_numeric_value": false, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://www.cxmt.com/en/news/info_21.html", "source_title": "CXMT Pioneers Mass-Production of LPDDR6", "source_publication_date": "2026-09-07", "available_date_verified": "2026-09-07", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"mass_production_announcement\",\"period\":\"2026-09-07\",\"period_type\":\"event\",\"value\":null,\"comparator\":\"qualitative\",\"unit\":\"milestone\",\"product_or_technology\":\"LPDDR6\",\"scope\":\"company_product\",\"status\":\"reported_actual\",\"source_id\":\"CNE007\",\"locator\":\"Body first and second paragraphs\",\"notes\":\"Company primary announcement; no wafer or unit shipment quantity reported. Product names and claim retained as written.\",\"value_text\":\"Company reports LPDDR6 mass production and commercial debut in Xiaomi 18 Fold\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "CXMT", "category": "memory_dram", "metric": "wafer_capacity_estimate", "period": "2022", "period_type": "annual_label_snapshot", "value": 57000, "comparator": "equal", "unit": "wafers/month", "product_or_technology": "DRAM all products", "scope": "company_capacity_estimate", "status": "secondary_estimate", "source_id": "CNE008", "locator": "Printed p.2, CXMT Capa 추이 및 전망", "notes": "Chart source TrendForce / LS Securities. Vintage 2025-10-10. Historical estimate, not official company actual. Chart labels K/Month; precise within-year reference date and wafer diameter are not printed in this chart. It must not be interpreted as annual production or DDR5-only capacity.", "legacy_observation_id": "", "observation_id": "SCE001472", "release_component": "china_memory", "category_ko": "DRAM", "native_metric": "wafer_capacity_estimate", "metric_ko": "웨이퍼 생산능력 추정", "native_comparator": "=", "native_value": 57000, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "historical_estimate", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "ChangXin Memory Technologies / CXMT / 长鑫存储", "source_url": "https://msg.ls-sec.co.kr/eum/K_20251010_31780_171.pdf", "source_title": "Sector Issue Brief: memory supply/demand update", "source_publication_date": "2025-10-10", "available_date_verified": "2025-10-10", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"cxmt\",\"category\":\"memory_dram\",\"metric\":\"wafer_capacity_estimate\",\"period\":\"2022\",\"period_type\":\"annual_label_snapshot\",\"value\":57000,\"comparator\":\"=\",\"unit\":\"wafers/month\",\"product_or_technology\":\"DRAM all products\",\"scope\":\"company_capacity_estimate\",\"status\":\"secondary_estimate\",\"source_id\":\"CNE008\",\"locator\":\"Printed p.2, CXMT Capa 추이 및 전망\",\"notes\":\"Chart source TrendForce / LS Securities. Vintage 2025-10-10. Historical estimate, not official company actual. Chart labels K/Month; precise within-year reference date and wafer diameter are not printed in this chart. It must not be interpreted as annual production or DDR5-only capacity.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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{"company_id": "SAMSUNG", "category": "financial_capex", "metric": "capital_expenditure_company_defined", "period": "2024", "period_type": "calendar_year", "value": 46.3, "comparator": "equal", "unit": "trillion_KRW", "product_or_technology": "all_products", "scope": "semiconductor_DS_division", "status": "reported_actual", "source_id": "FIN_SS_2024", "locator": "Annual capital expenditure paragraph", "notes": "회사전체와 DS 포함관계, 합산금지. DS에는 메모리와 Foundry/SystemLSI가 포함. 이 수치로 EUV 대수 추정 금지.", "legacy_observation_id": "", "observation_id": "SCE001562", "release_component": "finance_capex", "category_ko": "설비투자", "native_metric": "capital_expenditure_company_defined", "metric_ko": "회사 정의 설비투자", "native_comparator": "equal", "native_value": 46.3, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://news.samsung.com/global/samsung-electronics-announces-fourth-quarter-and-fy-2024-results", "source_title": "Samsung Electronics Fourth Quarter and FY2024 Results", "source_publication_date": "2025-01-31", "available_date_verified": "2025-01-31", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"financial_capex\",\"metric\":\"capital_expenditure_company_defined\",\"period\":\"2024\",\"period_type\":\"calendar_year\",\"value\":46.3,\"comparator\":\"equal\",\"unit\":\"trillion_KRW\",\"product_or_technology\":\"all_products\",\"scope\":\"semiconductor_DS_division\",\"status\":\"reported_actual\",\"source_id\":\"FIN_SS_2024\",\"locator\":\"Annual capital expenditure paragraph\",\"notes\":\"회사전체와 DS 포함관계, 합산금지. DS에는 메모리와 Foundry/SystemLSI가 포함. 이 수치로 EUV 대수 추정 금지.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "financial_capex", "metric": "capital_expenditure_company_defined", "period": "2025", "period_type": "calendar_year", "value": 52.7, "comparator": "equal", "unit": "trillion_KRW", "product_or_technology": "all_products", "scope": "company_total", "status": "reported_actual", "source_id": "FIN_SS_2025", "locator": "PDF p.6, Capital expenditures paragraph, full-year total and DS split", "notes": "2025Q4 공식 스크립트 기준. 회사전체와 DS 부분합산 금지; 명목원화금액.", "legacy_observation_id": "", "observation_id": "SCE001563", "release_component": "finance_capex", "category_ko": "설비투자", "native_metric": "capital_expenditure_company_defined", "metric_ko": "회사 정의 설비투자", "native_comparator": "equal", "native_value": 52.7, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://irsvc.teletogether.com/sec/pdf/2025Q4_script_eng.pdf", "source_title": "Samsung Electronics 2025 Q4 Earnings Call Script", "source_publication_date": "2026-01-29", "available_date_verified": "2026-01-29", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"financial_capex\",\"metric\":\"capital_expenditure_company_defined\",\"period\":\"2025\",\"period_type\":\"calendar_year\",\"value\":52.7,\"comparator\":\"equal\",\"unit\":\"trillion_KRW\",\"product_or_technology\":\"all_products\",\"scope\":\"company_total\",\"status\":\"reported_actual\",\"source_id\":\"FIN_SS_2025\",\"locator\":\"PDF p.6, Capital expenditures paragraph, full-year total and DS split\",\"notes\":\"2025Q4 공식 스크립트 기준. 회사전체와 DS 부분합산 금지; 명목원화금액.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "SAMSUNG", "category": "financial_capex", "metric": "capital_expenditure_company_defined", "period": "2025", "period_type": "calendar_year", "value": 47.5, "comparator": "equal", "unit": "trillion_KRW", "product_or_technology": "all_products", "scope": "semiconductor_DS_division", "status": "reported_actual", "source_id": "FIN_SS_2025", "locator": "PDF p.6, Capital expenditures paragraph, full-year total and DS split", "notes": "2025Q4 공식 스크립트 기준. 회사전체와 DS 부분합산 금지; 명목원화금액.", "legacy_observation_id": "", "observation_id": "SCE001564", "release_component": "finance_capex", "category_ko": "설비투자", "native_metric": "capital_expenditure_company_defined", "metric_ko": "회사 정의 설비투자", "native_comparator": "equal", "native_value": 47.5, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Samsung Electronics", "source_url": "https://irsvc.teletogether.com/sec/pdf/2025Q4_script_eng.pdf", "source_title": "Samsung Electronics 2025 Q4 Earnings Call Script", "source_publication_date": "2026-01-29", "available_date_verified": "2026-01-29", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"SAMSUNG\",\"category\":\"financial_capex\",\"metric\":\"capital_expenditure_company_defined\",\"period\":\"2025\",\"period_type\":\"calendar_year\",\"value\":47.5,\"comparator\":\"equal\",\"unit\":\"trillion_KRW\",\"product_or_technology\":\"all_products\",\"scope\":\"semiconductor_DS_division\",\"status\":\"reported_actual\",\"source_id\":\"FIN_SS_2025\",\"locator\":\"PDF p.6, Capital expenditures paragraph, full-year total and DS split\",\"notes\":\"2025Q4 공식 스크립트 기준. 회사전체와 DS 부분합산 금지; 명목원화금액.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_operations", "metric": "depreciation_amortization_expense", "period": "FY2023", "period_type": "fiscal_year", "value": 7756.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2025", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001565", "release_component": "finance_capex", "category_ko": "R&D·감가상각", "native_metric": "depreciation_amortization_expense", "metric_ko": "감가상각·상각 비용", "native_comparator": "equal", "native_value": 7756.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron Form10-K FY2025", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_operations\",\"metric\":\"depreciation_amortization_expense\",\"period\":\"FY2023\",\"period_type\":\"fiscal_year\",\"value\":7756.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2025\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_capex", "metric": "cash_property_plant_equipment_expenditure", "period": "FY2023", "period_type": "fiscal_year", "value": 7676.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2025", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "PPE취득 현금유출의 양의 규모. 보조금·장비매각을 차감한 순CAPEX와 별개. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001566", "release_component": "finance_capex", "category_ko": "설비투자", "native_metric": "cash_property_plant_equipment_expenditure", "metric_ko": "유형자산 취득 현금 유출", "native_comparator": "equal", "native_value": 7676.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron Form10-K FY2025", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_capex\",\"metric\":\"cash_property_plant_equipment_expenditure\",\"period\":\"FY2023\",\"period_type\":\"fiscal_year\",\"value\":7676.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2025\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"PPE취득 현금유출의 양의 규모. 보조금·장비매각을 차감한 순CAPEX와 별개. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_capex", "metric": "government_capex_incentive_proceeds", "period": "FY2023", "period_type": "fiscal_year", "value": 710.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2025", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "정부 CAPEX보조금의 현금유입, 양의 금액으로 보존. PPE현금유출이나 순CAPEX와 별개. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001567", "release_component": "finance_capex", "category_ko": "설비투자", "native_metric": "government_capex_incentive_proceeds", "metric_ko": "정부 설비투자 인센티브 현금 유입", "native_comparator": "equal", "native_value": 710.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron Form10-K FY2025", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_capex\",\"metric\":\"government_capex_incentive_proceeds\",\"period\":\"FY2023\",\"period_type\":\"fiscal_year\",\"value\":710.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2025\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"정부 CAPEX보조금의 현금유입, 양의 금액으로 보존. PPE현금유출이나 순CAPEX와 별개. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_operations", "metric": "research_development_expense", "period": "FY2023", "period_type": "fiscal_year", "value": 3114.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2025", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "회계 R&D 비용, 재고·CAPEX·공정노드 장수와 구분. FY2026은53주이며CY2026아님.", "legacy_observation_id": "", "observation_id": "SCE001568", "release_component": "finance_capex", "category_ko": "R&D·감가상각", "native_metric": "research_development_expense", "metric_ko": "연구개발비", "native_comparator": "equal", "native_value": 3114.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm", "source_title": "Micron Form10-K FY2025", "source_publication_date": "2025-10-03", "available_date_verified": "2025-10-03", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_operations\",\"metric\":\"research_development_expense\",\"period\":\"FY2023\",\"period_type\":\"fiscal_year\",\"value\":3114.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2025\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"회계 R&D 비용, 재고·CAPEX·공정노드 장수와 구분. FY2026은53주이며CY2026아님.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_operations", "metric": "depreciation_amortization_expense", "period": "FY2026", "period_type": "fiscal_year", "value": 9503.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2026", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001569", "release_component": "finance_capex", "category_ko": "R&D·감가상각", "native_metric": "depreciation_amortization_expense", "metric_ko": "감가상각·상각 비용", "native_comparator": "equal", "native_value": 9503.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron Form10-K FY2026", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_operations\",\"metric\":\"depreciation_amortization_expense\",\"period\":\"FY2026\",\"period_type\":\"fiscal_year\",\"value\":9503.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2026\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_operations", "metric": "depreciation_amortization_expense", "period": "FY2025", "period_type": "fiscal_year", "value": 8352.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2026", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001570", "release_component": "finance_capex", "category_ko": "R&D·감가상각", "native_metric": "depreciation_amortization_expense", "metric_ko": "감가상각·상각 비용", "native_comparator": "equal", "native_value": 8352.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron Form10-K FY2026", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_operations\",\"metric\":\"depreciation_amortization_expense\",\"period\":\"FY2025\",\"period_type\":\"fiscal_year\",\"value\":8352.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2026\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
{"company_id": "MICRON", "category": "financial_operations", "metric": "depreciation_amortization_expense", "period": "FY2024", "period_type": "fiscal_year", "value": 7780.0, "comparator": "equal", "unit": "million_USD", "product_or_technology": "all_products", "scope": "consolidated", "status": "reported_actual", "source_id": "FIN_MU_2026", "locator": "Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement", "notes": "영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.", "legacy_observation_id": "", "observation_id": "SCE001571", "release_component": "finance_capex", "category_ko": "R&D·감가상각", "native_metric": "depreciation_amortization_expense", "metric_ko": "감가상각·상각 비용", "native_comparator": "equal", "native_value": 7780.0, "value_min": null, "value_max": null, "value_text": "", "comparison_basis": "", "is_forecast": false, "estimate_phase": "reported", "forecast_as_of": null, "record_kind": "numeric_point", "has_numeric_value": true, "company_name": "Micron Technology", "source_url": "https://www.sec.gov/Archives/edgar/data/723125/000072312526000023/mu-20260903.htm", "source_title": "Micron Form10-K FY2026", "source_publication_date": "2026-10-09", "available_date_verified": "2026-10-09", "retrieved_date": "2026-10-17", "availability_status": "source_date_verified", "cutoff_date": "2026-10-17", "aggregation_rule": "Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.", "native_record_json": "{\"company_id\":\"MICRON\",\"category\":\"financial_operations\",\"metric\":\"depreciation_amortization_expense\",\"period\":\"FY2024\",\"period_type\":\"fiscal_year\",\"value\":7780.0,\"comparator\":\"equal\",\"unit\":\"million_USD\",\"product_or_technology\":\"all_products\",\"scope\":\"consolidated\",\"status\":\"reported_actual\",\"source_id\":\"FIN_MU_2026\",\"locator\":\"Item8 Consolidated Statements of Cash Flows / Statements of Operations; FY2026 PDF-equivalent printed p.70 cashflow / p.67 income statement\",\"notes\":\"영업현금흐름 조정표의 비현금 감가상각·상각비, 현금유출 아님. FY는8/9월종료; FY2026은53주.\"}", "period_end": null, "wafer_basis": null, "geography": null, "reporting_basis": null, "measure_kind": null, "technology_family": null, "aggregation_level": null, "capacity_kind": null, "shared_asset_id": null, "series_id": null, "derivation": null, "research_file": null, "shared_asset_note": null, "value_qualifier": null}
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