{"meta":{"version":"2026-09-09.research-1","preparedAt":"2026-09-09","numericalClasses":["reported","derived","model-estimate","assumption-scenario","unavailable"],"publicBoundary":"Public references, independently calculated estimates and explicit scenario assumptions. Commercial price-board histories and private operational methods are not redistributed.","refresh":"This release uses dated, reviewed snapshots. Models recalculate from the bundled validated inputs; this is not a live ingestion feed.","modelPromotion":"A candidate can be described as improved only after chronological out-of-sample validation against a declared baseline, with errors, horizon, sample size and interval coverage published. No superiority over commercial providers is claimed.","researchAgent":{"name":"VLSI ASTRIA","title":"Semiconductor Intelligence Agent","version":"2026.09","attribution":"Research & model estimates by VLSI ASTRIA","scope":"AI-assisted research with reproducible statistical models and explicit scenario assumptions. Publisher facts retain their original source. Experimental forecasts are not independently validated or guaranteed."},"evaluatedAt":"2026-09-09T16:23:20.962Z","productCount":150,"pricedReferenceCount":49,"forecastSeriesCount":4,"densityScenarioCount":8,"relationshipCount":15,"mixBucketCount":29,"foundryCount":8},"view":"relationships","count":15,"records":[{"id":"product-link-1","companyId":"tsmc","foundry":"TSMC","customer":"NVIDIA","product":"Blackwell GPU dies (B200; GPU component of GB200)","node":"Custom TSMC 4NP","waferDiameter":null,"relationship":"external relationship","status":"product and process disclosed","sourceDate":"2024-03-18","sourceUrl":"https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing","checkedAt":"2026-09-08","caveat":"No wafer, fab, revenue, or allocation disclosure."},{"id":"product-link-2","companyId":"tsmc","foundry":"TSMC","customer":"AMD","product":"4th Gen EPYC (Genoa)","node":"TSMC caption associates processor with 5nm technology","waferDiameter":null,"relationship":"external relationship","status":"product process association package scope limited","sourceDate":"2023","sourceUrl":"https://esg.tsmc.com/file/public/e-all_2022.pdf","checkedAt":"2026-09-08","caveat":"The caption does not identify each die in the multi-die package; it cannot support an all-die 5nm claim. No volume or revenue allocation."},{"id":"product-link-3","companyId":"tsmc","foundry":"TSMC","customer":"AMD","product":"EPYC Venice","node":"TSMC N2","waferDiameter":null,"relationship":"external relationship","status":"tapeout bringup","sourceDate":"2025-04-14","sourceUrl":"https://ir.amd.com/news-events/press-releases/detail/1245/amd-achieves-first-tsmc-n2-product-silicon-milestone","checkedAt":"2026-09-08","caveat":"Not evidence of HVM or shipments."},{"id":"product-link-4","companyId":"samsung-foundry","foundry":"Samsung Foundry","customer":"Ambarella","product":"CV3-AD685","node":"Samsung 5nm","waferDiameter":null,"relationship":"external relationship","status":"production product disclosed","sourceDate":"2023-02-21","sourceUrl":"https://news.samsung.com/global/samsung-electronics-world-class-5nm-technology-selected-by-ambarella-for-new-automotive-ai-central-domain-controller","checkedAt":"2026-09-08","caveat":"No wafer volume or realized revenue."},{"id":"product-link-5","companyId":"samsung-foundry","foundry":"Samsung Foundry","customer":"Preferred Networks","product":"Next-generation AI accelerators","node":"Samsung 2nm","waferDiameter":null,"relationship":"external relationship","status":"planned turnkey order","sourceDate":"2024-07-09","sourceUrl":"https://news.samsung.com/global/samsung-electronics-to-provide-turnkey-semiconductor-solutions-with-2nm-gaa-process-and-2-5d-package-to-preferred-networks","checkedAt":"2026-09-08","caveat":"Future; packaging does not prove wafer shipments."},{"id":"product-link-6","companyId":"intel-foundry","foundry":"Intel Foundry","customer":"Intel Products","product":"Core Ultra Series 3 / Panther Lake","node":"Intel 18A","waferDiameter":null,"relationship":"internal product","status":"internal production hvm ramp","sourceDate":"2025-10-09","sourceUrl":"https://newsroom.intel.com/client-computing/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a","checkedAt":"2026-09-08","caveat":"Internal; no wafer volume."},{"id":"product-link-7","companyId":"intel-foundry","foundry":"Intel Foundry","customer":"Intel Products","product":"Xeon 6+ / Clearwater Forest","node":"Intel 18A","waferDiameter":null,"relationship":"internal product","status":"internal product fab disclosed","sourceDate":"2025-10-09","sourceUrl":"https://newsroom.intel.com/client-computing/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a","checkedAt":"2026-09-08","caveat":"Launch timing was forward-looking."},{"id":"product-link-8","companyId":"intel-foundry","foundry":"Intel Foundry","customer":"Fortinet","product":"Security Processor 6","node":null,"waferDiameter":null,"relationship":"external relationship","status":"collaboration only","sourceDate":"2026-07-23","sourceUrl":"https://www.intc.com/news-events/press-releases/detail/1773/intel-reports-second-quarter-2026-financial-results","checkedAt":"2026-09-08","caveat":"No node, order, tape-out, shipment, or production confirmation."},{"id":"product-link-9","companyId":"umc","foundry":"UMC","customer":"Sensirion","product":"Temperature and flow-sensor ICs","node":null,"waferDiameter":null,"relationship":"external relationship","status":"manufacturing capacity allocated","sourceDate":"2021-03-08","sourceUrl":"https://sensirion.com/company/news/press-releases-and-news/article/sensirion-gains-capacity-support-from-umc","checkedAt":"2026-09-08","caveat":"No node, diameter, volume, fab, or sales value."},{"id":"product-link-10","companyId":"umc","foundry":"UMC/Wavetek","customer":"HyperLight","product":"TFLN Chiplet Platform","node":null,"waferDiameter":"6-inch and 8-inch capabilities","relationship":"external relationship","status":"collaboration scalable manufacturing","sourceDate":"2026-03-13","sourceUrl":"https://www.umc.com/en/News/press_release/Content/corporate/20260313","checkedAt":"2026-09-08","caveat":"No production SKU, wafer volume, or lithographic node."},{"id":"product-link-11","companyId":"globalfoundries","foundry":"GlobalFoundries","customer":"ElevATE Semiconductor","product":"High-voltage test/aerospace/defense chips","node":"7HV","waferDiameter":"200mm","relationship":"external relationship","status":"manufactured at scale","sourceDate":"2024-06-05","sourceUrl":"https://gf.com/news-and-events/news/elevate-semiconductor-and-globalfoundries-partner-on-high-voltage-chips-for-commercial-and-national-security-applications/","checkedAt":"2026-09-08","caveat":"Product family, no model/volume/revenue allocation."},{"id":"product-link-12","companyId":"tower","foundry":"Tower","customer":"HP Indigo","product":"Industrial press mixed-signal driver solution","node":"180nm power-management","waferDiameter":"8-inch","relationship":"external relationship","status":"customer product process disclosed","sourceDate":"2020-04-23","sourceUrl":"https://ir.towersemi.com/news-releases/news-release-details/hp-indigo-selected-tower-semiconductor-their-next-generation/","checkedAt":"2026-09-08","caveat":"No press model, volume, or revenue."},{"id":"product-link-13","companyId":"tower","foundry":"Tower","customer":"USC research team","product":"FMCW LiDAR IC","node":"PH18 silicon photonics platform","waferDiameter":null,"relationship":"research collaboration","status":"fabricated research demonstrator","sourceDate":"2021-09-13","sourceUrl":"https://ir.towersemi.com/news-releases/news-release-details/tower-semiconductor-announces-breakthrough-lidar-technology/","checkedAt":"2026-09-08","caveat":"Not a commercial shipping program."},{"id":"tsmc-sony-image-sensor-jv-2026","companyId":"tsmc","foundry":"TSMC","customer":"Sony Semiconductor Solutions","product":"Next-generation smartphone image sensors","node":null,"waferDiameter":null,"relationship":"joint-venture controlling shareholder","status":"definitive agreement conditional","sourceDate":"2026-08-11","sourceUrl":"https://www.sec.gov/Archives/edgar/data/1046179/000104617926000539/sonysemiconductorsolutions.htm","checkedAt":"2026-08-12","caveat":"The definitive agreement does not establish current production, capacity, shipments, revenue, market share, or a process node. The 2029 volume-production date is planned, contributions are phased, closing remains conditional, and Japanese-government support is contemplated without a disclosed amount."},{"id":"samsung-foundry-tesla-contract-2025","companyId":"samsung-foundry","foundry":"Samsung Foundry","customer":"Tesla, Inc.","product":"Product not disclosed in cited agreement","node":null,"waferDiameter":null,"relationship":"customer","status":"contract effective","sourceDate":"2025-07-31","sourceUrl":"https://www.samsung.com/global/ir/reports-disclosures/public-disclosure-view.84447/","checkedAt":"2026-08-05","caveat":"The agreement value is a multi-year contractual amount, not annual revenue, realized sales, backlog, shipment volume, or proof of production. Samsung states that key terms remain confidential and may change or terminate."}]}