{"company_id":"SAMSUNG","metric":"capacity","period":"2008","period_type":"year","value":60000,"unit":"wafers/month","wafer_basis":"300mm_physical","scope":"Austin_new_300mm_NAND_fab_only","status":"announced_plan","source_id":"MKSS2007","locator":"Paragraph2","notes":"Plan announced2007; do not assume actual2008 attainment; later Austin logic conversion breaks a simple memory capacity series.","research_file":"memory_korea.json","observation_id":"SCE000381","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://semiconductor.samsung.com/news-events/news/samsung-opens-largest-wafer-plant-in-austin-texas/","source_title":"Samsung Opens Largest Wafer Plant in Austin Texas","source_publication_date":null,"available_date_verified":null,"retrieved_date":"2026-10-16","series_id":"","legacy_observation_id":"WH00381","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":60000,"value_text":"","comparison_basis":"","is_forecast":true,"estimate_phase":"forecast","forecast_as_of":"","record_kind":"numeric_point","has_numeric_value":true,"availability_status":"publication_date_unverified_no_point_in_time_use","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2011-09","period_type":"month","value":null,"unit":"wafers/month","wafer_basis":"300mm_physical","scope":"Hwaseong_Line16_initial_NAND_ramp","status":"announced_plan","source_id":"MKSS2011L16","locator":"Projected volume paragraph","notes":"Projected volume more than10,000; not audited realized starts, and not contradictory to future200k buildout target.","value_qualifier":"greater_than","research_file":"memory_korea.json","value_min":10000,"comparator":"greater_than","observation_id":"SCE000382","company_name":"Samsung Electronics","value_max":null,"capacity_kind":"unspecified","source_url":"https://news.samsung.com/global/world%E2%80%99s-largest-memory-fabrication-facility-line-16memory","source_title":"World Largest Fabrication Facility Line16","source_publication_date":"2011-09-26","available_date_verified":"2011-09-26","retrieved_date":"2026-10-16","series_id":"","legacy_observation_id":"WH00382","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"greater_than","native_value":null,"value_text":"","comparison_basis":"","is_forecast":true,"estimate_phase":"forecast","forecast_as_of":"2011-09-26","record_kind":"numeric_bound","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2011-10","period_type":"month","value":40000,"unit":"wafers/month","wafer_basis":"300mm_physical","scope":"Austin_S2_logic_only","status":"reported_actual","source_id":"MKSS2011S2","locator":"Opening paragraph","notes":"Achieved targeted wafer-start capacity,45nm low-power logic; separate from memory. Does not represent all Samsung foundry.","research_file":"memory_korea.json","observation_id":"SCE000383","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://news.samsung.com/global/samsung%E2%80%99s-austin-logic-line-breaks-record-achievements","source_title":"Samsung Austin Logic Line Breaks Record Achievements","source_publication_date":"2011-12-13","available_date_verified":"2011-12-13","retrieved_date":"2026-10-16","series_id":"","legacy_observation_id":"WH00383","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":40000,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"reported","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2011_onward","period_type":"target_window","value":null,"unit":"wafers/month","wafer_basis":"300mm_physical","scope":"Hwaseong_Line16_planned_buildout","status":"announced_plan","source_id":"MKSS2010L16","locator":"반도체 부문, Line16","notes":"Source says more than200,000 and phased investment; not demonstrated output in2011.","value_qualifier":"greater_than","research_file":"memory_korea.json","value_min":200000,"comparator":"greater_than","observation_id":"SCE000384","company_name":"Samsung Electronics","value_max":null,"capacity_kind":"unspecified","source_url":"https://news.samsung.com/kr/삼성전자-2010년-사상-최대-26조원-투자-계획","source_title":"Samsung 2010 Investment Plan / Line16 Groundbreaking","source_publication_date":"2010-05-17","available_date_verified":"2010-05-17","retrieved_date":"2026-10-16","series_id":"","legacy_observation_id":"WH00384","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"greater_than","native_value":null,"value_text":"","comparison_basis":"","is_forecast":true,"estimate_phase":"forecast","forecast_as_of":"2010-05-17","record_kind":"numeric_bound","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2013-12","period_type":"point_in_time","value":1867000,"unit":"wafers/month","wafer_basis":"200mm_equivalent","scope":"Installed IC wafer fab capacity including allocated joint-venture shares, IC Insights Global Wafer Capacity scope.","status":"secondary_estimate","source_id":"IS11","locator":"Figure 1, p.2","notes":"Analyst estimate of installed capacity, not actual starts or shipment. TSMC and other ownership scopes must be checked; Micron includes former Elpida and Rexchip and 95% Inotera output entitlement.","series_id":"IC_INSIGHTS_2014_VINTAGE","research_file":"industry_stats.json","observation_id":"SCE000385","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://www.icinsights.com/data/articles/documents/632.pdf","source_title":"Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders","source_publication_date":"2014-01-08","available_date_verified":"2014-01-08","retrieved_date":"2026-10-16","legacy_observation_id":"WH00385","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":1867000,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"historical_estimate","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2016-12","period_type":"point_in_time","value":2598750,"unit":"wafers/month","wafer_basis":"200mm_equivalent","scope":"IC Insights Global Wafer Capacity 2017–2021 ranking, as reproduced by Atomera; historical company and JV entity scope.","status":"secondary_estimate","source_id":"IS12","locator":"Slide 9: Largest Companies with fabs","notes":"Slide explicitly identifies end-2016. Source presentation published March 2018, not March 2018 capacity. Original estimate publication date not established. Preserve historical group and subsidiary rows; do not sum after combining contemporary parent groups.","series_id":"IC_INSIGHTS_2017_VINTAGE_ATOMERA","research_file":"industry_stats.json","observation_id":"SCE000386","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://getfilings.com/sec-filings/180312/Atomera-Inc_8-K/atomera_ex9901.htm","source_title":"Atomera Investor Presentation, March 2018","source_publication_date":"2018-03-12","available_date_verified":"2018-03-12","retrieved_date":"2026-10-16","legacy_observation_id":"WH00386","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":2598750,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"historical_estimate","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2019-12","period_type":"point_in_time","value":2935000,"unit":"wafers/month","wafer_basis":"200mm_equivalent","scope":"Installed IC fab capacity per IC Insights; images-sensor-converted Line 13 partly excluded.","status":"secondary_estimate","source_id":"IS13","locator":"Figure 1, p.1","notes":"IC Insights 2021 publication vintage; not comparable without scope reconciliation to Knometa revised 2020 values. Line 13 partially excluded in 2020 due to conversion to image sensors.","series_id":"IC_INSIGHTS_2021_VINTAGE","research_file":"industry_stats.json","observation_id":"SCE000387","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://www.icinsights.com/data/articles/documents/1345.pdf","source_title":"Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%","source_publication_date":"2021-02-10","available_date_verified":"2021-02-10","retrieved_date":"2026-10-16","legacy_observation_id":"WH00387","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":2935000,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"historical_estimate","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2020-12","period_type":"point_in_time","value":3060000,"unit":"wafers/month","wafer_basis":"200mm_equivalent","scope":"Installed IC fab capacity per IC Insights; images-sensor-converted Line 13 partly excluded.","status":"secondary_estimate","source_id":"IS13","locator":"Figure 1, p.1","notes":"IC Insights 2021 publication vintage; not comparable without scope reconciliation to Knometa revised 2020 values. Line 13 partially excluded in 2020 due to conversion to image sensors.","series_id":"IC_INSIGHTS_2021_VINTAGE","research_file":"industry_stats.json","observation_id":"SCE000388","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://www.icinsights.com/data/articles/documents/1345.pdf","source_title":"Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%","source_publication_date":"2021-02-10","available_date_verified":"2021-02-10","retrieved_date":"2026-10-16","legacy_observation_id":"WH00388","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":3060000,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"historical_estimate","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
{"company_id":"SAMSUNG","metric":"capacity","period":"2020-12","period_type":"point_in_time","value":3364000,"unit":"wafers/month","wafer_basis":"200mm_equivalent","scope":"Installed monthly IC wafer capacity, including image sensors, per Knometa 2022.","status":"secondary_estimate","source_id":"IS14","locator":"Global IC Wafer Capacity Leaders chart; exact numeric table also IS15","notes":"Knometa 2022 publication vintage, includes image sensors. 2020 baseline differs from IC Insights 2021 vintage; keep separate series. Exact table values independently checked against readable Evertiq table IS15.","series_id":"KNOMETA_2022_VINTAGE_INCLUDES_IMAGE_SENSORS","research_file":"industry_stats.json","observation_id":"SCE000389","company_name":"Samsung Electronics","value_min":null,"value_max":null,"comparator":"equal","capacity_kind":"unspecified","source_url":"https://www.knometa.com/news/?post=top-five-leaders-continue-expanding-share-of-global-ic-fab-capacity","source_title":"Top Five Leaders Continue Expanding Share of Global IC Fab Capacity","source_publication_date":"2022-04-07","available_date_verified":"2022-04-07","retrieved_date":"2026-10-16","legacy_observation_id":"WH00389","release_component":"wafer_history_v1","category":"wafer_history","category_ko":"웨이퍼 생산·출하·능력","native_metric":"capacity","metric_ko":"생산능력","native_comparator":"as_reported","native_value":3364000,"value_text":"","comparison_basis":"","is_forecast":false,"estimate_phase":"historical_estimate","forecast_as_of":null,"record_kind":"numeric_point","has_numeric_value":true,"availability_status":"source_date_verified","cutoff_date":"2026-10-17","aggregation_rule":"Do not sum unless metric, unit, product, geography, scope, period basis and non-overlap have been independently verified.","period_end":null,"product_or_technology":null,"geography":null,"reporting_basis":null,"measure_kind":null,"technology_family":null,"aggregation_level":null,"shared_asset_id":null,"derivation":null,"shared_asset_note":null,"value_qualifier":null,"industry_stage":"device_manufacturing","measurement_family":"physical_capacity","period_start":null,"financial_basis":null,"source_vintage":null,"xbrl_tag":null,"native_unit":null,"evidence_vintage":null,"approximate_range":null,"supporting_source_ids":null,"unit_confirmation":null,"flow_or_stock":null,"alternative_definition":null,"conflict_group_id":null,"facility":null,"substrate_dimensions_mm":null,"original_unit_label":null,"unit_validation_source":null}
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