{"meta":{"schemaVersion":"2026-08-29.news-and-changes-2","generatedFrom":"official company newsroom indexes and versioned VLSI Market catalog revisions","view":"news","newsLinkCount":12,"datasetRevisionCount":0,"caveat":"Newsroom records are outbound links to the original company publisher. Dataset revisions are separate VLSI Market records. Neither is an investment recommendation."},"newsLinks":[{"id":"nvidia-financial-community-event-2026-08-27","publishedAt":"2026-08-27","organization":"NVIDIA","organizationType":"fabless","topic":"Corporate","title":"NVIDIA Announces Upcoming Event for Financial Community","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://nvidianews.nvidia.com/news/nvidia-announces-upcoming-event-for-financial-community-6927858"},{"id":"intel-ai-infra-summit-2026-08-26","publishedAt":"2026-08-26","organization":"Intel","organizationType":"IDM","topic":"AI compute","title":"Intel at AI Infra Summit 2026","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://newsroom.intel.com/artificial-intelligence/intel-at-ai-infra-summit-2026"},{"id":"nvidia-nvhbm-2026-08-26","publishedAt":"2026-08-26","organization":"NVIDIA","organizationType":"fabless","topic":"Memory","title":"NVIDIA NVLink Fusion Expands With NVHBM Custom High-Bandwidth Memory","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://blogs.nvidia.com/blog/nvlink-fusion-nvhbm-custom-high-bandwidth-memory/"},{"id":"nvidia-aws-2026-08-26","publishedAt":"2026-08-26","organization":"NVIDIA","organizationType":"fabless","topic":"AI compute","title":"AWS and NVIDIA to Deliver 2 Million Additional GPUs and Next-Generation Infrastructure for Agentic and Physical AI","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://nvidianews.nvidia.com/news/aws-and-nvidia-to-deliver-2-million-additional-gpus-and-next-generation-infrastructure-for-agentic-and-physical-ai"},{"id":"nvidia-jetson-orin-nano-2-2026-08-25","publishedAt":"2026-08-25","organization":"NVIDIA","organizationType":"fabless","topic":"AI compute","title":"NVIDIA Announces Jetson Orin Nano 2 Robotics Computer to Redefine Entry-Level Edge AI","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://nvidianews.nvidia.com/news/nvidia-announces-jetson-orin-nano-2-robotics-computer-to-redefine-entry-level-edge-ai"},{"id":"intel-hot-chips-2026-08-24","publishedAt":"2026-08-24","organization":"Intel","organizationType":"IDM","topic":"AI compute","title":"Intel Outlines Architectures for Agentic AI at Hot Chips 2026","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://newsroom.intel.com/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026"},{"id":"amd-board-tim-ryan-2026-08-19","publishedAt":"2026-08-19","organization":"AMD","organizationType":"fabless","topic":"Corporate","title":"AMD Appoints Tim Ryan to Board of Directors","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://newsroom.amd.com/news/amd-appoints-tim-ryan-board-of-directors/"},{"id":"intel-investor-conference-2026-08-18","publishedAt":"2026-08-18","organization":"Intel","organizationType":"IDM","topic":"Corporate","title":"Intel Corporation to Participate in Upcoming Investor Conference","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://newsroom.intel.com/corporate/intel-corporation-to-participate-in-upcoming-investor-conference-august-2026"},{"id":"tsmc-sony-jv-2026-08-11","publishedAt":"2026-08-11","organization":"TSMC","organizationType":"foundry","topic":"Foundry","title":"Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://pr.tsmc.com/english/news/3333"},{"id":"tsmc-july-revenue-2026-08-10","publishedAt":"2026-08-10","organization":"TSMC","organizationType":"foundry","topic":"Financial results","title":"TSMC July 2026 Revenue Report","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://pr.tsmc.com/english/news/3329"},{"id":"amd-taalas-2026-08-06","publishedAt":"2026-08-06","organization":"AMD","organizationType":"fabless","topic":"AI compute","title":"AMD Acquires Taalas to Advance Compute Solutions for Rapidly Growing AI Inference Market","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://newsroom.amd.com/news/amd-acquires-taalas-ai-inference/"},{"id":"amd-q2-2026-results","publishedAt":"2026-08-04","organization":"AMD","organizationType":"fabless","topic":"Financial results","title":"AMD Reports Second Quarter 2026 Financial Results","sourceLanguage":"en","sourceClass":"official-company-newsroom","validatedAt":"2026-08-29","canonicalUrl":"https://ir.amd.com/news-events/press-releases/detail/1295/amd-reports-second-quarter-2026-financial-results"}],"monitoredNewsSources":[{"id":"nvidia-newsroom","organization":"NVIDIA","organizationType":"fabless","geography":"United States","sourceType":"company newsroom","indexUrl":"https://nvidianews.nvidia.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"active-link-check"},{"id":"tsmc-press","organization":"TSMC","organizationType":"foundry","geography":"Taiwan","sourceType":"company newsroom","indexUrl":"https://pr.tsmc.com/english/latest-news","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"active-link-check"},{"id":"amd-newsroom","organization":"AMD","organizationType":"fabless","geography":"United States","sourceType":"company newsroom","indexUrl":"https://newsroom.amd.com/news-types/news/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"active-link-check"},{"id":"intel-newsroom","organization":"Intel","organizationType":"IDM","geography":"United States","sourceType":"company newsroom","indexUrl":"https://newsroom.intel.com/news","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"active-link-check"},{"id":"samsung-global-newsroom","organization":"Samsung Electronics","organizationType":"memory","geography":"South Korea","sourceType":"company newsroom","indexUrl":"https://news.samsung.com/global/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"sk-hynix-newsroom","organization":"SK hynix","organizationType":"memory","geography":"South Korea","sourceType":"company newsroom","indexUrl":"https://news.skhynix.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"micron-news","organization":"Micron","organizationType":"memory","geography":"United States","sourceType":"investor relations","indexUrl":"https://investors.micron.com/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"cxmt-official","organization":"CXMT","organizationType":"memory","geography":"China","sourceType":"company newsroom","indexUrl":"https://www.cxmt.com/","language":"zh-CN","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"globalfoundries-news","organization":"GlobalFoundries","organizationType":"foundry","geography":"United States","sourceType":"investor relations","indexUrl":"https://investors.gf.com/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"umc-press","organization":"UMC","organizationType":"foundry","geography":"Taiwan","sourceType":"press room","indexUrl":"https://www.umc.com/en/News/press_release","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"smic-news","organization":"SMIC","organizationType":"foundry","geography":"China","sourceType":"company newsroom","indexUrl":"https://www.smics.com/en/site/news","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"tower-news","organization":"Tower Semiconductor","organizationType":"foundry","geography":"Israel","sourceType":"investor relations","indexUrl":"https://ir.towersemi.com/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"arm-newsroom","organization":"Arm","organizationType":"semiconductor IP","geography":"United Kingdom","sourceType":"company newsroom","indexUrl":"https://newsroom.arm.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"synopsys-news","organization":"Synopsys","organizationType":"EDA","geography":"United States","sourceType":"company newsroom","indexUrl":"https://news.synopsys.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"cadence-newsroom","organization":"Cadence","organizationType":"EDA","geography":"United States","sourceType":"company newsroom","indexUrl":"https://www.cadence.com/en_US/home/company/newsroom.html","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"siemens-press","organization":"Siemens EDA","organizationType":"EDA","geography":"Germany","sourceType":"press room","indexUrl":"https://press.siemens.com/global/en","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"rambus-newsroom","organization":"Rambus","organizationType":"semiconductor IP","geography":"United States","sourceType":"company newsroom","indexUrl":"https://www.rambus.com/newsroom/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"ceva-press","organization":"CEVA","organizationType":"semiconductor IP","geography":"United States","sourceType":"press room","indexUrl":"https://www.ceva-ip.com/press-releases/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"sifive-press","organization":"SiFive","organizationType":"semiconductor IP","geography":"United States","sourceType":"press room","indexUrl":"https://www.sifive.com/press","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"marvell-newsroom","organization":"Marvell","organizationType":"fabless","geography":"United States","sourceType":"company newsroom","indexUrl":"https://www.marvell.com/company/newsroom.html","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"qualcomm-news","organization":"Qualcomm","organizationType":"fabless","geography":"United States","sourceType":"company newsroom","indexUrl":"https://www.qualcomm.com/news/releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"broadcom-news","organization":"Broadcom","organizationType":"fabless","geography":"United States","sourceType":"investor relations","indexUrl":"https://investors.broadcom.com/press-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"mediatek-press","organization":"MediaTek","organizationType":"fabless","geography":"Taiwan","sourceType":"press room","indexUrl":"https://corp.mediatek.com/news-events/press-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"nxp-newsroom","organization":"NXP","organizationType":"IDM","geography":"Netherlands","sourceType":"company newsroom","indexUrl":"https://www.nxp.com/company/about-nxp/newsroom:NEWSROOM","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"infineon-press","organization":"Infineon","organizationType":"IDM","geography":"Germany","sourceType":"press room","indexUrl":"https://www.infineon.com/cms/en/about-infineon/press/press-releases/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"stmicro-newsroom","organization":"STMicroelectronics","organizationType":"IDM","geography":"Switzerland","sourceType":"company newsroom","indexUrl":"https://newsroom.st.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"ti-newsroom","organization":"Texas Instruments","organizationType":"IDM","geography":"United States","sourceType":"company newsroom","indexUrl":"https://news.ti.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"renesas-newsroom","organization":"Renesas","organizationType":"IDM","geography":"Japan","sourceType":"company newsroom","indexUrl":"https://www.renesas.com/en/about/newsroom","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"onsemi-press","organization":"onsemi","organizationType":"IDM","geography":"United States","sourceType":"press room","indexUrl":"https://www.onsemi.com/company/news-media/press-announcements","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"asml-press","organization":"ASML","organizationType":"equipment","geography":"Netherlands","sourceType":"press room","indexUrl":"https://www.asml.com/en/news/press-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"applied-materials-news","organization":"Applied Materials","organizationType":"equipment","geography":"United States","sourceType":"investor relations","indexUrl":"https://ir.appliedmaterials.com/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"lam-newsroom","organization":"Lam Research","organizationType":"equipment","geography":"United States","sourceType":"company newsroom","indexUrl":"https://newsroom.lamresearch.com/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"kla-news","organization":"KLA","organizationType":"equipment","geography":"United States","sourceType":"investor relations","indexUrl":"https://ir.kla.com/news-events/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"tel-news","organization":"Tokyo Electron","organizationType":"equipment","geography":"Japan","sourceType":"company newsroom","indexUrl":"https://www.tel.com/news/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"advantest-news","organization":"Advantest","organizationType":"equipment","geography":"Japan","sourceType":"company newsroom","indexUrl":"https://www.advantest.com/news/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"ase-press","organization":"ASE Technology","organizationType":"OSAT","geography":"Taiwan","sourceType":"press room","indexUrl":"https://www.aseglobal.com/press-room","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"amkor-news","organization":"Amkor","organizationType":"OSAT","geography":"United States","sourceType":"investor relations","indexUrl":"https://ir.amkor.com/news-releases","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"soitec-news","organization":"Soitec","organizationType":"materials","geography":"France","sourceType":"company newsroom","indexUrl":"https://www.soitec.com/en/news","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"groq-newsroom","organization":"Groq","organizationType":"startup","geography":"United States","sourceType":"company newsroom","indexUrl":"https://groq.com/newsroom/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"tenstorrent-newsroom","organization":"Tenstorrent","organizationType":"startup","geography":"Canada","sourceType":"company newsroom","indexUrl":"https://tenstorrent.com/newsroom/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"rebellions-newsroom","organization":"Rebellions","organizationType":"startup","geography":"South Korea","sourceType":"company newsroom","indexUrl":"https://rebellions.ai/newsroom/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"furiosa-blog","organization":"FuriosaAI","organizationType":"startup","geography":"South Korea","sourceType":"official blog","indexUrl":"https://furiosa.ai/blog","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"ayar-labs-news","organization":"Ayar Labs","organizationType":"startup","geography":"United States","sourceType":"company newsroom","indexUrl":"https://ayarlabs.com/news/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"sox-index","organization":"PHLX Semiconductor Sector Index","organizationType":"benchmark","geography":"United States","sourceType":"official index or fund page","indexUrl":"https://indexes.nasdaqomx.com/Index/Overview/SOX","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"smh-fund","organization":"VanEck Semiconductor ETF (SMH)","organizationType":"benchmark","geography":"United States","sourceType":"official index or fund page","indexUrl":"https://www.vaneck.com/us/en/investments/semiconductor-etf-smh/","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"soxx-fund","organization":"iShares Semiconductor ETF (SOXX)","organizationType":"benchmark","geography":"United States","sourceType":"official index or fund page","indexUrl":"https://www.ishares.com/us/products/239705/ishares-phlx-semiconductor-etf","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"soxl-fund","organization":"Direxion Daily Semiconductor Bull 3X Shares (SOXL)","organizationType":"benchmark","geography":"United States","sourceType":"official index or fund page","indexUrl":"https://www.direxion.com/product/daily-semiconductor-bull-bear-3x-etfs","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"},{"id":"xsd-fund","organization":"SPDR S&P Semiconductor ETF (XSD)","organizationType":"benchmark","geography":"United States","sourceType":"official index or fund page","indexUrl":"https://www.ssga.com/us/en/intermediary/etfs/spdr-sp-semiconductor-etf-xsd","language":"en","ingestionMode":"official-index-link-check","monitoringStatus":"catalog-only"}],"changes":[]}